DSPIC33FJ256GP710AT-I/PT - 16-bit DSC 40MIPS 256KB Flash | Microchip
N.º de pieza: DSPIC33FJ256GP710AT-I/PT ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8.9 | $8,90 |
| 10 | $8.05 | $80,50 |
| 100 | $7.2 | $720,00 |
| 500 | $6.55 | $3.275,00 |
| 1.000 | $5.9 | $5.900,00 |
DSPIC33FJ256GP710AT-I/PT Descripción general
A Digital Signal Controller combines the compute architecture of a microcontroller with DSP capabilities such as single-cycle MAC multiply-accumulate and hardware divide support. Within the power-management hierarchy of embedded processors, the dsPIC33F sits between general-purpose 16-bit MCUs (like the PIC24H, with which it is pin compatible) and dedicated DSPs, making it a middle path for real-time control plus signal processing. The dsPIC33F family shares a high degree of compatibility with the dsPIC30F family, allowing migration between device generations as system requirements evolve.
Key features include the 16-bit dsPIC core clocked at 40 MHz for 40 MIPS throughput, rich connectivity with CAN, I2C, SPI, and UART modules, 53 general-purpose I/O pins, and In-Circuit Serial Programming (ICSP) via PGECx/PGEDx pin pairs. The device is supported by the MPLAB XC-DSC C/C++ optimizing compiler and MPLAB Snap debugger.
Architecture highlights: the modified Harvard pipeline executes most instructions in a single cycle, while hardware DSP multiply-accumulate instructions accelerate filtering, FFT, and control-loop math without software libraries. Dual-source Flash variants (the AT suffix denotes the A-version silicon with tape-and-reel ordering) simplify supply continuity.
Typical applications include digital power supplies, motor control and PFC stages, industrial automation nodes with CAN networking, and audio or sensor signal-processing pipelines where 40 MIPS and on-chip DSP math remove the need for a second processor.
Design consideration: pair multiple decoupling capacitors on the 3.3V rails and route PGEC/PGED pairs carefully for debug access; only paired PGECx/PGEDx pins may be used together for ICSP.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para DSPIC33FJ256GP710AT-I/PT — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33FJ256GP710AT-I/PT (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Core Architecture, Maximum CPU Speed, ADC.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33FJ256GP710A-I/PT
✅ Sustitución directa✓ En stock
$15.6 / unidad
Ver hoja de datos →DSPIC33FJ256GP510T-I/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$6.95 / unidad
Ver hoja de datos →DSPIC33FJ128MC710T-I/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.2 / unidad
Ver hoja de datos →DSPIC33FJ128MC710-I/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$6.9 / unidad
Ver hoja de datos →DSPIC33FJ128MC706AT-I/PT
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$8.15 / unidad
Ver hoja de datos →DSPIC33FJ256GP710AT-I/PT Valores máximos y características eléctricas
| Core Architecture | 16-bit dsPIC DSC |
| Maximum CPU Speed | 40 MIPS (40 MHz) |
| Flash Program Memory | 256 KB |
| SRAM | 30 KB |
| Tensión de alimentación | 3.3 V |
| Encapsulado | 100-TQFP (12x12 mm) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Communication Interfaces | CAN, I2C, SPI, UART |
| General-Purpose I/O | 53 I/Os |
| Series | dsPIC33FJ256GP710A |
| Tipo de montaje | Surface Mount |
| Debug/Programming | ICSP via PGECx/PGEDx pairs, MPLAB Snap compatible |
| Toolchain | MPLAB XC-DSC C/C++ Compiler |
Guía de configuración de pines de DSPIC33FJ256GP710AT-I/PT 100-tqfp (12x12 mm)
Configuración de pines para DSPIC33FJ256GP710AT-I/PT (encapsulado 100-tqfp (12x12 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33FJ256GP710AT-I/PT.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33FJ256GP710AT-I/PT es adecuado para 6 aplicacións: Digital Power Supplies and PFC, Motor Control (FOC and BLDC), Industrial Automation with CAN Networking, Audio and Sensor Signal Processing, Embedded Control with Seamless Family Migration, Test, Measurement and Instrumentation.
Digital Power Supplies and PFC
The DSPIC33FJ256GP710AT-I/PT suits digitally controlled AC-DC and DC-DC power stages because its 40 MIPS DSP core executes control-loop math, including proportional-integral compensators and notch filters, in single-cycle multiply-accumulate instructions. High-resolution PWM peripherals drive half-bridge and PFC switches while fast ADCs sample current and voltage feedback. In a typical totem-pole PFC design, the DSC runs the current loop at tens of kHz update rates with headroom for housekeeping and protection logic. The 256KB Flash holds the control firmware, compensation tables, and a communication stack simultaneously, eliminating an external supervisor MCU. Designers should budget ADC sampling latency into loop compensation for stability margin.
Recomendado
Motor Control (FOC and BLDC)
Field-oriented control of PMSM and BLDC motors demands deterministic math throughput; the 40 MIPS dsPIC core with hardware DSP multiply-accumulate executes Park/Clarke transforms and PI current loops comfortably. The device integrates motor-control PWM outputs with dead-time insertion and ADC channels synchronized to PWM triggers for shunt or phase-current sensing. The 100-pin TQFP exposes enough PWM, ADC, QEI (quadrature encoder interface), and CAN resources to run a complete servo axis on one chip. The 256KB Flash accommodates FOC firmware plus CANopen or Modbus communication stacks. For dedicated motor-control cost-downs, the same-footprint DSPIC33FJ128MC710T-I/PT halves memory while retaining the MC peripheral set.
Recomendado
Industrial Automation with CAN Networking
Factory nodes, sensors hubs, and actuator controllers benefit from this DSC's on-chip CAN 2.0B module, which implements DeviceNet- and CANopen-style networking without an external controller. The 53 GPIOs and multiple UART/SPI/I2C ports interface HMI peripherals, encoders, and analog front ends, while 40 MIPS of headroom runs protocol stacks and local control logic concurrently. Industrial -40C to +85C operation matches cabinet-mounted and machine-mounted electronics. The 256KB Flash supports over-the-air style field firmware updates stored in a second image. Layout practice: keep the CAN transceiver close to the device with a split-termination network to meet EMC immunity requirements on the bus.
Recomendado
Audio and Sensor Signal Processing
The dsPIC33F DSP engine performs FIR/IIR filtering, FFTs, and tone detection at audio rates using single-cycle MAC and 40-bit accumulators, making the GP710A a single-chip solution for voice-band processing, acoustic analyzers, and active noise systems. On-chip ADC channels digitize microphone or sensor inputs while SPI connects external audio codecs or high-precision converters. The 30KB SRAM buffers FFT windows and filter states without external RAM at typical sample rates. Compared with a separate DSP plus MCU pair, the integrated DSC removes inter-processor latency and cuts BOM cost. Designers should use the DMA-capable data transfers to keep loop overhead low during continuous sampling.
Recomendado
Embedded Control with Seamless Family Migration
Products that may scale across performance tiers benefit from the dsPIC33F family's migration strategy: Microchip documents that dsPIC33F devices are pin compatible with PIC24H MCUs and highly compatible with dsPIC30F DSCs, so one PCB can host different memory or peripheral variants. The GP710A serves as the flagship 256KB variant, with drop-downs such as DSPIC33FJ256GP510T-I/PT in the same 100-TQFP for cost-optimized builds. ICSP programming through any PGECx/PGEDx pair supports in-fixture programming during production. Teams should fix the debug pair selection early in layout and route the ICSP header to a standard connector for MPLAB Snap compatibility.
Recomendado
Test, Measurement and Instrumentation
Bench instruments, data loggers, and portable analyzers use this DSC's combination of 40 MIPS DSP throughput for waveform analysis, 30KB SRAM for capture buffers, and rich communications (UART, SPI, I2C, USB-class peripherals via software stacks) for PC connectivity. The 100-pin package supplies enough GPIO to drive displays, keypads, and relay multiplexers on one controller. 256KB Flash holds calibration tables, UI resources, and DSP routines together. The industrial temperature grade suits both lab and field-deployed instruments. For precision analog front ends, pair the DSC with external delta-sigma converters over SPI rather than relying solely on the internal ADC when sub-millivolt accuracy is required.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33FJ256GP710AT-I/PT — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33FJ256GP710A-I/PT | DSPIC33FJ256GP510T-I/PT | DSPIC33FJ128MC710T-I/PT | DSPIC33FJ128MC706AT-I/PT |
|---|---|---|---|---|---|
| Package | 100-TQFP (12x12 mm) | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Performance | 16-bit dsPIC, 40 MIPS | 16-bit dsPIC, 40 MIPS | 16-bit dsPIC, 40 MIPS | 16-bit dsPIC, 40 MIPS | 16-bit dsPIC, 40 MIPS |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB | 128 KB |
| Silicon Revision | A revision | A revision | Original revision | Original revision | A revision |
| Peripheral Family Focus | General Purpose (GP) | General Purpose (GP) | General Purpose (GP) | Motor Control (MC) | Motor Control (MC) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Packaging | Tape & Reel (T suffix) | Tray (no T suffix) | Tape & Reel | Tape & Reel | Tape & Reel |
Diferenciadores clave
- A-revision silicon with corrected errata (frente a DSPIC33FJ256GP510T-I/PT)
- Double the Flash of MC-series same-footprint parts (frente a DSPIC33FJ128MC710T-I/PT)
- Identical die in tray packaging for prototyping (frente a DSPIC33FJ256GP710A-I/PT)
Notas de diseño
Provide one 0.1uF ceramic decoupling capacitor at each VDD/VSS pin pair of the 100-pin TQFP, placed within 2 mm of the pins, plus one bulk 10uF capacitor per power domain. The 12x12 mm TQFP center should have a via fan-out for the oscillator and analog reference routing to keep the crystal loop short. Follow the PIM (Plug-In Module) reference layout in Microchip document 70565A, which shows a proven 100-pin TQFP floor plan for the dsPIC33FJ256GP710.
The device has multiple PGECx/PGEDx programming pairs, and per Microchip guidance you must use them as pairs: if PGEC2 carries ICSPCLK, ICSPDAT must go to PGED2. Mixing pins from different pairs is a common bring-up failure. Fix the chosen pair at layout time, route it to a 5-pin (or greater) ICSP header with MCLR, VDD, VSS, and place no heavy pull-downs on PGED lines that would fight the programmer.
Run the device from a clean 3.3V rail; the dsPIC33F family specifies operation at 3.0V to 3.6V in the family datasheet. Estimated: at 40 MIPS with typical toggling I/O, core current is on the order of tens of milliamps, so a 300 mA LDO such as the MCP1700-family devices or a small buck covers the logic supply with margin. Connect AVDD to the analog supply through an RC or ferrite filter when using the on-chip ADC for motor current sensing to protect noise performance.
When using CAN, place the transceiver (e.g., MCP2551) within 20 mm of the CANTX/CANRX pins and keep the split termination node tied to a quiet ground. For motor-control PWM outputs driving gate drivers, keep each PWM trace short and matched within a pair, and route ADC sense lines away from PWM switching edges. Group analog reference decoupling (VDDCORE/AVDD regions per datasheet power-pin diagram) on a local island to minimize digital return coupling.
Información de cumplimiento
Compliance status not explicitly stated in the provided web data; verify via Microchip PCN system or distributor compliance certificates before BOM release.
