DSPIC33FJ64GP306A-E/MR - 16-bit 40 MIPS DSC, 64KB Flash | Microchip
N.º de pieza: DSPIC33FJ64GP306A-E/MR ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
DSPIC33FJ64GP306A-E/MR Descripción general
A Digital Signal Controller combines the computational architecture of a digital signal processor with the peripheral integration and control-oriented instruction set of a microcontroller. DSCs sit within the broader semiconductor hierarchy as microcontrollers -> digital signal controllers -> embedded processors, and the dsPIC33F family is Microchip's flagship 16-bit DSC line, executing digital filter algorithms and high-speed precision digital control loops where standard MCUs lack the arithmetic throughput.
Key features include a fixed-point DSP engine with a barrel shifter and dual internal buses for efficient data handling, 40 MIPS maximum performance from a phase-locked-loop-scaled clock, boundary-scan (JTAG) test capability, and multiple low-power operating modes for energy-constrained designs. The dsPIC33FJ64GPX06A/X08A/X10A subfamily also provides advanced analog peripherals and seamless migration paths to PIC24 MCUs and dsPIC30F DSCs in similar packages, protecting software investment across revisions.
Architecturally, the device is fabricated on an advanced CMOS process and uses a modified Harvard bus structure with separate program and data paths, enabling single-cycle MAC (multiply-accumulate) execution for FIR/IIR filtering, PID loops, and FFT-based processing. The 'A' suffix denotes the enhanced second silicon revision of the original dsPIC33FJ64GP306, offering improved analog performance and errata resolution.
Typical applications include digital power supplies, motor control drives, industrial sensors, and audio signal processing. The extended -40C to +125C temperature grade makes it well suited to automotive-adjacent, heavy-equipment, and outdoor industrial environments where commercial-grade parts cannot survive.
When designing with this part, budget a clean 3.3V rail with local decoupling on all VDD/VSS pairs, and plan the clock tree so the PLL stays within the 40 MIPS ceiling. The VQFN exposed pad must be soldered to a grounded thermal land for both mechanical retention and signal integrity.
This page synthesizes verified distributor data, same-family drop-in alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Alternativas directas para DSPIC33FJ64GP306A-E/MR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con DSPIC33FJ64GP306A-E/MR (mismo factor de forma y huella) — difiere en Package, DSP Engine, Family Migration, Operating Temperature, Packaging.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
DSPIC33FJ64GP306A-I/MR
✅ Sustitución directa✓ En stock
$4.65 / unidad
Ver hoja de datos →DSPIC33FJ128GP306A-E/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$5.2 / unidad
Ver hoja de datos →DSPIC33FJ256GP306A-E/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33FJ32GP306A-E/MR
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
DSPIC33FJ64GP306A-E/MR Valores máximos y características eléctricas
| Core Type | dsPIC33F 16-bit DSC (RISC) |
| Maximum Clock Frequency / Performance | 40 MHz (40 MIPs) |
| Program Memory | 64KB (64K x 8) FLASH |
| Tensión de alimentación | 3.3 V |
| DSP Engine | Fixed-point, barrel shifter, MAC |
| Bus Architecture | Multiple internal bus |
| Boundary Scan | Yes (JTAG) |
| Low-Power Modes | Yes |
| Temperatura de funcionamiento | -40C to +125C (E grade) |
| Encapsulado | 64-VQFN, 9x9 mm |
| Tipo de montaje | Surface Mount |
| Packaging | Tube (EP suffix) |
| Family Migration | Seamless to PIC24 MCU and dsPIC30F DSC |
| Process Technology | Advanced CMOS |
| Silicon Revision | A (dsPIC33FJ64GP306A) |
Guía de configuración de pines de DSPIC33FJ64GP306A-E/MR 64-vqfn, 9x9 mm
Configuración de pines para DSPIC33FJ64GP306A-E/MR (encapsulado 64-vqfn, 9x9 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para DSPIC33FJ64GP306A-E/MR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
DSPIC33FJ64GP306A-E/MR es adecuado para 6 aplicacións: Digital Power Supplies, Industrial Motor Control, Audio Signal Processing, Industrial Sensing and Data Acquisition, High-Temperature Embedded Control, Embedded Control and Automation.
Digital Power Supplies
The DSPIC33FJ64GP306A-E/MR fits digital power supply control because its 40 MIPs core and fixed-point DSP engine execute current- and voltage-loop compensators at switching frequencies well beyond analog-controller limits, with single-cycle MAC operations accelerating PID and filter computations. Placed as the main controller, it reads feedback through on-chip analog inputs and drives PWM stages with deterministic latency. The 3.3V logic eases interfacing with gate drivers and supervisors. The extended -40C to +125C rating tolerates power-stage hot spots, while boundary-scan support simplifies in-circuit production test on dense power boards.
Recomendado
Industrial Motor Control
For motor drives, the DSPIC33FJ64GP306A-E/MR provides the 40 MIPs throughput needed for field-oriented control and sensorless estimation algorithms, executing high-speed precision control loops that Microchip specifically designed the dsPIC33F family to run. The fixed-point DSP engine with barrel shifter keeps Clarke/Park transforms and PI current loops within tight ISR budgets, while the extended -40C to +125C temperature grade withstands drive-enclosure heat without forced-air cooling. Firmware executes from 64KB FLASH, sufficient for FOC plus communication stacks, and low-power modes support standby energy targets in intermittently operated industrial equipment.
Recomendado
Audio Signal Processing
The dsPIC33F General Purpose (GP) subfamily targets applications including audio, and the DSPIC33FJ64GP306A-E/MR supports FIR/IIR filtering, sample-rate conversion, and level processing at audio rates: a 40 MIPs core executes a single-cycle MAC, letting a 128-tap filter run at 48 kHz sampling with margin to spare. The multiple internal bus architecture streams samples between peripherals and RAM without core contention. Operating from 3.3V it interfaces directly with audio codecs and line-level circuitry, and its QFN-64 footprint integrates DAC, amplifier, and control logic on one compact board for conferencing and public-address products.
Recomendado
Industrial Sensing and Data Acquisition
In industrial sensing nodes, the DSPIC33FJ64GP306A-E/MR combines a 16-bit control core with the dsPIC33F subfamily's advanced analog peripherals, digitizing transducer signals and applying DSP-based calibration, linearization, and noise filtering in-firmware. The dsPIC33Fs are explicitly designed to execute digital filter algorithms, making them a strong fit for vibration, pressure, and temperature sensing with embedded FFT analysis. The extended -40C to +125C rating survives panel-mounted installations near machinery, low-power modes reduce consumption in battery-backed monitors, and boundary-scan (JTAG) supports automated production verification across the sensor fleet.
Recomendado
High-Temperature Embedded Control
Equipment installed in hot environments - pumps, compressors, outdoor enclosures, heavy vehicles - needs controllers rated beyond commercial limits. The DSPIC33FJ64GP306A-E/MR's -40C to +125C extended grade directly addresses this: the same silicon reliability targets apply across the whole range, so firmware need not derate near the ceiling. Its 40 MIPs performance covers supervisory logic plus DSP preprocessing on one die, eliminating a separate signal processor. The 64-VQFN (9x9 mm) package keeps board area small, and Microchip's seamless migration to PIC24 MCUs and dsPIC30F DSCs in similar packages future-proofs long-lifetime industrial programs.
Recomendado
Embedded Control and Automation
As a general-purpose DSC, the DSPIC33FJ64GP306A-E/MR anchors embedded automation boards that need both control I/O and signal processing: PLC remote modules, actuator controllers, and protocol converters. The 64KB FLASH hosts a real-time executive plus communication stacks; the 16-bit core with multiple internal buses sustains deterministic scanning, and the DSP engine handles on-board diagnostics such as signature analysis of actuator current waveforms. Seamless migration within the dsPIC33F and PIC24 families lets one PCB design scale memory or peripherals without layout changes, protecting automation OEMs across product generations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para DSPIC33FJ64GP306A-E/MR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | DSPIC33FJ64GP306A-I/MR | DSPIC33FJ128GP306A-E/MR | DSPIC33FJ256GP306A-E/MR | DSPIC33FJ32GP306A-E/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Program Memory | 64KB | 64KB | 128KB | 256KB | 32KB |
| Core Performance | 16-bit, 40 MIPs | 16-bit, 40 MIPs | 16-bit, 40 MIPs | 16-bit, 40 MIPs | 16-bit, 40 MIPs |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +125C |
| DSP Engine / Barrel Shifter | Yes | Yes | Yes | Yes | Yes |
| Pin-to-Pin Compatibility | Reference | Pin-to-pin, same die | Pin-to-pin | Pin-to-pin | Pin-to-pin |
Diferenciadores clave
- Extended temperature grade on identical silicon (frente a DSPIC33FJ64GP306A-I/MR)
- Scalable FLASH without PCB change (frente a DSPIC33FJ256GP306A-E/MR)
- Full DSP throughput at 3.3V (frente a DSPIC33FJ32GP306A-E/MR)
Notas de diseño
The 64-VQFN (9x9 mm) package has a center exposed pad that must be soldered to a grounded land pattern - it provides mechanical retention and the primary ground path. Use an array of thermal vias under the pad, and do not flood solder paste with one large aperture; segment it into a 3x3 or 4x4 grid to avoid voiding. Verify pin 1 orientation against the family datasheet pin diagram before stencil release.
Decouple every VDD/VSS pair with a 0.1uF ceramic placed within 2 mm of the pin, plus one bulk 10uF near the device, following standard dsPIC33F family power guidelines. The PLL multiplies the oscillator up to the 40 MIPS ceiling, so rail noise directly raises clock jitter - use an LDO or well-filtered 3.3V rail. Observe internal-regulator/PLL sequencing requirements in the family datasheet to guarantee a clean reset.
Estimated: at 40 MIPS the core current is in the tens-of-milliampere range (exact figure in the family datasheet electrical characteristics); with 3.3V supply this yields well under 0.5 W dissipation, so no heatsink is needed. However, in a -40C to +125C application, budget junction temperature as Tj = Ta + P * theta_JA and verify theta_JA for your PCB copper area against the datasheet table - the E-grade ceiling assumes adequate board thermal relief.
Información de cumplimiento
Compliance data was not present in the provided verified web data; consult the Microchip product page or certificate of conformance for current RoHS/REACH status.
