EFM32GG330F1024-QFN64 - 48MHz Cortex-M3 Giant Gecko MCU | Silicon Labs
N.º de pieza: EFM32GG330F1024-QFN64 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $9.12 | $91,20 |
| 100 | $8.2 | $820,00 |
| 500 | $7.35 | $3.675,00 |
| 1.000 | $6.5 | $6.500,00 |
EFM32GG330F1024-QFN64 Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (flash), working memory (RAM), and a configurable set of analog and digital peripherals. In the taxonomy of embedded silicon, an MCU sits below microprocessors (MPUs, which require external memory) and above general-purpose logic ICs; the Giant Gecko specifically belongs to the energy-friendly EFM32 family, which sits inside the broader Cortex-M3 ecosystem (ARM Cortex-M -> 32-bit MCU -> embedded controller -> semiconductor). Silicon Labs' EFM32 line is known for aggressive low-energy techniques, fast wake-up from sleep, and rich peripherals aimed at battery-powered and energy-harvesting applications.
Key features include hardware AES crypto, USB device controller with on-chip transceiver, configurable peripherals routed through Silicon Labs' Peripheral Reflex System (PRS), and a low-energy RTC with calendar mode. The 64-pin QFN package (9x9 mm body, 0.5 mm pitch, exposed pad) provides 53 general-purpose I/Os with configurable push-pull, open-drain, and pull resistors. CoreMark performance is approximately 1.25 DMIPS/MHz, and the energy modes EM0-EM4 enable sub-microamp sleep with <2 microsecond wake-up.
Architecturally, the EFM32GG330F1024 pairs a Cortex-M3 core (with MPU, WIC, NVIC) with 1024 kB flash (with cache) and 128 kB SRAM, plus dedicated crypto and DMA blocks. The peripheral reflex system allows peripherals to interact without CPU intervention, freeing the core for application logic. Energy Mode 4 (EM4) shuts down most of the chip but retains a single wake-up pin and RAM retention, achieving the lowest quiescent current in the family.
Typical applications include energy-harvesting wireless sensor nodes, USB-powered smart meters, secure connected home gateways, battery-powered industrial sensors, and low-power medical wearables. The 1 MB flash supports over-the-air (OTA) firmware update staging for connected devices requiring field-upgradable code.
When designing with this device, route the exposed pad (EP) to a continuous ground pour with multiple vias for thermal dissipation and low-impedance ground return. Decouple VDD and VDDX with 100 nF X7R ceramic caps placed within 2 mm of each supply pin. The QFN package requires precise PCB land pattern and reflow profile per IPC-7351; moisture sensitivity level (MSL) handling per J-STD-033 is required during assembly.
This page synthesizes distributor pricing, drop-in same-package alternatives, AEO-optimized FAQ, and practical layout notes not consolidated on the Silicon Labs product page.
Alternativas directas para EFM32GG330F1024-QFN64 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EFM32GG330F1024G-E-QFN64R
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EFM32GG330F1024-QFN64T
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EFM32GG330F512-QFN64
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EFM32GG330F256-QFN64
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EFM32GG840F1024-QFN64
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EFM32GG330F1024-QFN64 Valores máximos y características eléctricas
| Core | ARM Cortex-M3 (32-bit) |
| Maximum CPU Clock | 48 MHz |
| Performance | 1.25 DMIPS/MHz |
| Flash Memory | 1024 kB |
| RAM | 128 kB |
| Digital I/O Pins | 53 |
| Timers | 4 x 16-bit |
| USB | USB 2.0 Full-Speed Device with on-chip transceiver |
| Crypto Accelerator | AES-128/256 hardware |
| Tensión de alimentación | 1.98 V to 3.8 V (typical 3.3 V) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Encapsulado | 64-QFN (9x9 mm, 0.5 mm pitch, exposed pad) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
Configuración de pines de EFM32GG330F1024-QFN64
| Pin 1 | VDD — Digital supply voltage |
| Pin 2 | PA0 — Port A GPIO 0 |
| Pin 3 | PA1 — Port A GPIO 1 |
| Pin 4 | PA2 — Port A GPIO 2 |
| Pin 5 | PA3 — Port A GPIO 3 |
| Pin 6 | PA4 — Port A GPIO 4 |
| Pin 7 | PA5 — Port A GPIO 5 |
| Pin 8 | PA6 — Port A GPIO 6 |
| Pin 9 | PA7 — Port A GPIO 7 |
| Pin 10 | PA8 — Port A GPIO 8 |
| Pin 11 | PA9 — Port A GPIO 9 |
| Pin 12 | PA10 — Port A GPIO 10 |
| Pin 13 | PA11 — Port A GPIO 11 |
| Pin 14 | PA12 — Port A GPIO 12 |
| Pin 15 | PA13 — Port A GPIO 13 |
| Pin 16 | PA14 — Port A GPIO 14 |
| Pin 17 | PA15 — Port A GPIO 15 |
| Pin 18 | GND — Ground |
| Pin 19 | PB0 — Port B GPIO 0 |
| Pin 20 | PB1 — Port B GPIO 1 |
| Pin 21 | PB2 — Port B GPIO 2 |
| Pin 22 | PB3 — Port B GPIO 3 |
| Pin 23 | PB4 — Port B GPIO 4 |
| Pin 24 | PB5 — Port B GPIO 5 |
| Pin 25 | PB6 — Port B GPIO 6 |
| Pin 26 | PB7 — Port B GPIO 7 |
| Pin 27 | PB8 — Port B GPIO 8 |
| Pin 28 | PB9 — Port B GPIO 9 |
| Pin 29 | PB10 — Port B GPIO 10 |
| Pin 30 | PB11 — Port B GPIO 11 |
| Pin 31 | PB12 — Port B GPIO 12 |
| Pin 32 | PB13 — Port B GPIO 13 |
| Pin 33 | PB14 — Port B GPIO 14 |
| Pin 34 | PB15 — Port B GPIO 15 |
| Pin 35 | VDD — Digital supply voltage |
| Pin 36 | RESETn — Reset input (active low) |
| Pin 37 | PC0 — Port C GPIO 0 |
| Pin 38 | PC1 — Port C GPIO 1 |
| Pin 39 | PC2 — Port C GPIO 2 |
| Pin 40 | PC3 — Port C GPIO 3 |
| Pin 41 | PC4 — Port C GPIO 4 |
| Pin 42 | PC5 — Port C GPIO 5 |
| Pin 43 | PC6 — Port C GPIO 6 |
| Pin 44 | PC7 — Port C GPIO 7 |
| Pin 45 | PC8 — Port C GPIO 8 |
| Pin 46 | PC9 — Port C GPIO 9 |
| Pin 47 | PD0 — Port D GPIO 0 |
| Pin 48 | PD1 — Port D GPIO 1 |
| Pin 49 | PD2 — Port D GPIO 2 |
| Pin 50 | PD3 — Port D GPIO 3 |
| Pin 51 | PD4 — Port D GPIO 4 |
| Pin 52 | PD5 — Port D GPIO 5 |
| Pin 53 | PD6 — Port D GPIO 6 |
| Pin 54 | PD7 — Port D GPIO 7 |
| Pin 55 | USB_VBUS — USB VBUS sense |
| Pin 56 | USB_DM — USB D- data line |
| Pin 57 | USB_DP — USB D+ data line |
| Pin 58 | VDD_USB — USB supply voltage |
| Pin 59 | VSS_USB — USB ground |
| Pin 60 | GND — Ground |
| Pin 61 | VDD — Digital supply voltage |
| Pin 62 | VSS — Ground |
| Pin 63 | VSS — Ground |
| Pin 64 | EP — Exposed thermal pad (connect to ground) |
Aplicaciones típicas
EFM32GG330F1024-QFN64 es adecuado para 7 aplicacións: USB Smart Meter Data Logger, Energy-Harvesting Wireless Sensor Node, Secure Connected Home Gateway, Battery-Powered Industrial Sensor, Low-Power Medical Wearable, Building Automation Controller, USB HID Industrial Touch Panel.
USB Smart Meter Data Logger
The EFM32GG330F1024-QFN64 is well suited to USB smart meter data loggers because the integrated USB 2.0 full-speed device controller eliminates the need for an external PHY, and the 1024 kB flash comfortably holds metering firmware plus 128 kB of RAM buffers for instantaneous power calculations. The 64-pin QFN footprint simplifies the USB connector integration while still exposing 53 GPIO for sensor and LCD interfaces. Compared with adding an external MCU + USB bridge, the single-chip solution reduces BOM cost and board area. The energy modes (EM0-EM4) also allow the meter to enter sub-microamp sleep between measurement intervals while keeping the RTC alive.
Recomendado
Energy-Harvesting Wireless Sensor Node
In energy-harvesting sensor nodes the EFM32GG330F1024-QFN64's five energy modes (EM0 to EM4 with <2 microsecond wake-up) allow operation from sub-milliwatt harvested sources. The Cortex-M3 at 48 MHz executes sensor-fusion and radio-stack tasks quickly, then returns to EM4 sleep where quiescent current is sub-microamp. With 1024 kB flash, the device can host a complete Thread/Zigbee/BLE software stack alongside application logic, and the 53 GPIO support multiple analog sensors through the 12-bit ADC. The QFN-64 exposed pad ensures low thermal impedance, important when the MCU bursts from sleep at full CPU load.
Recomendado
Secure Connected Home Gateway
The EFM32GG330F1024-QFN64's hardware AES-128/256 accelerator accelerates TLS handshake and secure-boot operations on connected home gateways, offloading the Cortex-M3 to handle protocol stacks. With 1024 kB flash and 128 kB RAM the MCU can run an embedded Linux-style application or full TCP/IP stack on RTOS, and the 53 GPIO support keypad, Zigbee radio control, and status LEDs. The USB full-speed device port enables local configuration via CDC-ACM or HID interfaces without extra glue logic. Silicon Labs' long-term silicon longevity program supports industrial-grade lifecycle requirements typical of gateway products.
Recomendado
Battery-Powered Industrial Sensor
Industrial sensors running from lithium primary cells or 2x AA batteries benefit from the EFM32GG330F1024-QFN64's wide 1.98-3.8 V supply range and energy modes EM2-EM4 with RTC retention. The 48 MHz Cortex-M3 can complete a measurement cycle in milliseconds before returning to sub-microamp sleep, achieving years of battery life. The 1024 kB flash supports field-upgradable firmware via secure boot using the on-chip AES block, and the 53 GPIO accommodate analog sensor inputs, RS-485 interface, and indicator LEDs. The 64-pin QFN (9x9 mm) is footprint-compatible with the EFM32GG840 for designs that later need an external memory bus.
Recomendado
Low-Power Medical Wearable
Wearable medical devices such as continuous glucose monitors, pulse oximeters, and ECG patches benefit from the EFM32GG330F1024-QFN64's 1.98-3.8 V supply range suitable for single-cell Li-ion or coin-cell batteries, and sub-microamp EM4 sleep that extends runtime to weeks. The hardware AES block secures patient data transmission to smartphones via USB or proprietary radios. The 53 GPIO support multiple bio-sensor inputs (PPG, ECG, temperature) and the 12-bit ADC samples at rates sufficient for heart-rate detection. The compact 9x9 mm QFN-64 fits wristbands and patches where PCB area is critical.
Recomendado
Building Automation Controller
Building automation controllers (HVAC, lighting, access) require a balance of deterministic real-time response, multiple communication interfaces, and reliable firmware. The EFM32GG330F1024-QFN64 delivers 48 MHz Cortex-M3 performance with 4 x 16-bit timers for PWM lighting control and 53 GPIO for relays, keypads, and sensor interfaces. The USB full-speed device port simplifies commissioning via laptop tools, and the AES accelerator secures BACnet/Modbus-over-TLS traffic. The wide -40 to +85 C industrial temperature range and QFN-64 exposed pad thermal performance suit DIN-rail and panel-mount enclosures with limited airflow.
Recomendado
USB HID Industrial Touch Panel
The EFM32GG330F1024-QFN64 is ideal for USB HID industrial touch panels because the integrated USB 2.0 full-speed device controller eliminates external PHY chips, and the Cortex-M3's 48 MHz performance handles USB HID polling plus touch scanning without latency. The 53 GPIO support up to a 24-line resistive touch matrix or I2C/SPI capacitive touch controllers, while the 128 kB RAM buffers HID reports and touch gestures. The 1024 kB flash hosts the full USB stack and HMI logic, and the 64-pin QFN exposed pad simplifies thermal management in sealed panel enclosures.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EFM32GG330F1024-QFN64 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EFM32GG330F1024G-E-QFN64R | EFM32GG330F1024-QFN64T | EFM32GG330F512-QFN64 | EFM32GG330F256-QFN64 | EFM32GG840F1024-QFN64 |
|---|---|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Maximum Clock | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash Memory | 1024 kB | 1024 kB | 1024 kB | 512 kB | 256 kB | 1024 kB |
| RAM | 128 kB | 128 kB | 128 kB | 128 kB | 128 kB | 128 kB |
| GPIO Pins | 53 | 53 | 53 | 53 | 53 | 53 |
| USB Controller | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device |
| AES Hardware Crypto | Yes (AES-128/256) | Yes (AES-128/256) | Yes (AES-128/256) | Yes (AES-128/256) | Yes (AES-128/256) | Yes (AES-128/256) |
| External Memory Bus (EBI) | No | No | No | No | No | Yes (EBI) |
Diferenciadores clave
- Largest flash density in the GG330 family on the 64-QFN footprint (frente a EFM32GG330F512-QFN64)
- USB and AES on-chip eliminates external PHY and crypto coprocessor (frente a EFM32GG840F1024-QFN64)
- Same QFN-64 pinout across all GG330 density variants for easy scaling (frente a EFM32GG330F256-QFN64)
Notas de diseño
The 64-QFN (9x9 mm) package has a central exposed thermal pad that MUST be soldered to a PCB ground pour with a thermal via array (typically 9 vias in a 3x3 grid, 0.3 mm drill, 0.5 mm pitch). This ensures low theta-JA for thermal dissipation and provides a low-inductance ground return for the high-speed USB signals. Per IPC-7351, the land pattern should match the recommended QFN-64 nominal footprint for reflow yield.
Decouple every VDD pin with a 100 nF X7R ceramic capacitor placed within 2 mm of the pin, plus a 4.7 uF bulk capacitor on the main supply rail. The USB pins (USB_VBUS, USB_DP, USB_DM, VDD_USB, VSS_USB) require dedicated 100 nF decoupling and a common-mode choke or ferrite for EMI compliance per USB 2.0 specification. Brown-out detection should be enabled in the Silicon Labs emlib to generate a clean reset on voltage dips.
Do not leave the exposed pad (EP, pin 64) floating - it MUST be soldered to ground for electrical and thermal performance; floating pads cause thermal runaway and signal-integrity issues. Avoid routing high-speed USB or analog signals under the QFN body. Confirm Moisture Sensitivity Level (MSL) per J-STD-033 and bake parts before assembly if exposure exceeds floor life.
Route USB_DP and USB_DM as a 90-ohm differential pair with matched length within 150 mil, keep traces over a continuous ground plane, and place the common-mode choke close to the connector. Place the 12-bit ADC reference decoupling (100 nF + 1 uF) within 3 mm of the VREF pin to minimize ADC noise. Keep high-current switching nodes (LED drivers, relay coils) away from the analog sections.
Información de cumplimiento
RoHS and lead-free compliant per Silicon Labs product page. Industrial temperature grade (-40 to +85 C); not AEC-Q100 qualified - Giant Gecko automotive variants are separate part numbers.
