EP20K300EBC652-2X - APEX-20KE FPGA 300K Gates 652-BGA | Intel
N.º de pieza: EP20K300EBC652-2X ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 50 | $245 | $12.250,00 |
| 100 | $225 | $22.500,00 |
| 500 | $195 | $97.500,00 |
EP20K300EBC652-2X Descripción general
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated memory/DSP blocks into a single semiconductor. FPGAs belong to the broader hierarchy of digital logic -> programmable logic -> FPGA. APEX-20KE devices introduced MultiCore architecture that merges look-up table (LUT) logic, product-term logic, and embedded memory blocks, making them among the first FPGAs marketed for SOPC integration.
Key features include 408 maximum user I/O pins, support for LVDS I/O, 1152 macrocells of logic capacity, and an industrial temperature grade. The part carries the speed grade -2 (mid-range) and the 'X' suffix, indicating a lead-free / RoHS-compliant package. The FineLine BGA-652 footprint (45x45 mm) provides ample signal escape for high I/O count designs but requires multi-layer PCB design with controlled-impedance routing.
The APEX-20KE family is fabricated on a 1.8V CMOS process and supports LVTTL, LVCMOS, and LVDS I/O standards. It features embedded memory blocks, four phase-locked loops (PLLs), and dedicated clock networks. Combined LUT and product-term logic resources allow implementation of register-intensive datapaths, state machines, and embedded memory functions in one device.
Typical applications include telecommunications infrastructure, ASIC prototyping, high-speed data acquisition systems, and industrial control. The combination of high logic density, embedded memory, and 408 I/O pins makes EP20K300EBC652-2X well-suited for bus-intensive designs such as PCI bridges, network switches, and multi-channel DSP pipelines.
When designing with this FPGA, ensure proper power decoupling close to each supply pin and verify that the PCB BGA land pattern matches the 45x45 mm FineLine BGA specification. The -2 speed grade offers a balanced trade-off between performance and cost; -1 (faster) and -3 (slower) variants exist for different timing margins.
This page synthesizes distributor pricing, parametric specs, drop-in alternative cross-references, and practical BGA layout notes not found in the manufacturer datasheet alone.
Alternativas directas para EP20K300EBC652-2X — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP20K300EBC652-2X (mismo factor de forma y huella) — difiere en Total RAM Bits, Operating Temperature, Process Technology, Series, Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP20K300EBC652-2
✅ Sustitución directa✓ En stock
$384.08 / unidad
Ver hoja de datos →EP20K300EBC652-1X
✅ Sustitución directa✓ En stock
$615.8 / unidad
Ver hoja de datos →EP20K300EBC652-1
✅ Sustitución directa✓ En stock
$215 / unidad
Ver hoja de datos →EP20K200EBC652-2X
✅ Sustitución directa✓ En stock
$195 / unidad
Ver hoja de datos →EP20K400EBC652-2X
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$142 / unidad
Ver hoja de datos →EP20K300EBC652-2X Valores máximos y características eléctricas
| Series | APEX-20KE |
| Family | APEX 20K |
| Typical Gates | 300,000 |
| Logic Elements / Macros | 11,520 / 1152 |
| Total RAM Bits | 147,456 |
| Number of I/O | 408 |
| Voltage - Supply | 1.71 V to 1.89 V |
| Encapsulado / Carcasa | 652-BGA (FineLine BGA, 45x45 mm) |
| Supplier Device Package | 652-BGA |
| Speed Grade | -2 |
| Temperatura de funcionamiento | 0C to +85C (commercial) |
| Tipo de montaje | Surface Mount |
| I/O Standard Support | LVTTL, LVCMOS, LVDS |
| Estado RoHS | Compliant (X suffix) |
| Process Technology | 1.8V CMOS |
Guía de configuración de pines de EP20K300EBC652-2X 652-bga
Configuración de pines para EP20K300EBC652-2X (encapsulado 652-bga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP20K300EBC652-2X.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP20K300EBC652-2X es adecuado para 6 aplicacións: Telecommunications Infrastructure, ASIC Prototyping, High-Speed Data Acquisition Systems, Industrial Control Systems, Network Switches and Routers, DSP and Image Processing Pipelines.
Telecommunications Infrastructure
The EP20K300EBC652-2X fits telecommunications infrastructure because its 300,000 typical gates, 408 user I/O pins, and 147,456 bits of embedded RAM enable integration of wide datapaths such as TDM/SONET framers, ATM cell processors, and protocol bridges. With 1.8V CMOS core and LVDS-capable I/O, the device meets telecom jitter budgets while supporting backplane speeds common in SONET/SDH line cards. The MultiCore LUT plus product-term architecture lets designers implement glue logic alongside high-throughput datapaths, reducing chip count on dense line cards. PLLs provide the multiple clock domains needed for transmit and receive paths. The 652-BGA footprint allows escape routing for hundreds of differential pairs needed in telecom backplane designs. Designers should verify AC timing margins at the -2 speed grade against the specific serializer/deserializer (SERDES) companion device.
Recomendado
ASIC Prototyping
The EP20K300EBC652-2X is widely used for ASIC prototyping thanks to its 300,000-gate capacity, which can absorb most mid-complexity ASIC netlists. The 11,520 logic elements and 1152 macrocells provide a balanced LUT-and-product-term fabric ideal for emulating ASIC cell libraries, while 147,456 bits of embedded RAM map directly to ASIC SRAM blocks. Engineers port ASIC RTL into the Quartus tool flow, run real-world vector validation at near-ASIC speeds, and iterate before taping out. The 652-BGA 45x45 mm package exposes enough user I/O (408 pins) to break out full ASIC boundary-scan chains plus internal observation logic. With the -2 speed grade, designers can validate timing closure at representative frequencies before committing to silicon, saving mask costs.
Recomendado
High-Speed Data Acquisition Systems
The EP20K300EBC652-2X is well matched to high-speed data acquisition systems where 408 user I/O pins can absorb parallel ADC/DAC buses and 147,456 bits of embedded RAM provide sample buffering. The 1.8V core draws low power per logic element, while LVDS-capable I/O supports direct connection to modern high-speed ADCs without external translators. PLLs on the device generate the multiple clock phases needed for interleaved ADC sampling, and the MultiCore architecture lets designers place FIR filters, FFT engines, and trigger logic adjacent to memory for low-latency DSP pipelines. Engineers typically pair the FPGA with high-pin-count BGA PCB layout techniques - microvia escape routing and matched-length differential pairs - to preserve signal integrity above 200 MHz DDR rates.
Recomendado
Industrial Control Systems
The EP20K300EBC652-2X serves industrial control systems by consolidating motor-control loops, PLC logic, and HMI backplane interfaces into one device. The 408 user I/O easily handle multi-axis encoder inputs, PWM outputs to inverters, and industrial fieldbus connections such as Profibus or CAN. The MultiCore LUT/product-term architecture simplifies implementation of IEC 61131-3 logic alongside custom DSP routines. Embedded RAM blocks hold commutation tables and trajectory profiles without external memory. The 1.8V core supply supports industrial 24V-bus-powered designs with intermediate buck regulation, and the -2 speed grade provides deterministic timing for safety-critical control loops. Designers should pair the FPGA with galvanic isolation on field-side I/O for industrial EMC compliance.
Recomendado
Network Switches and Routers
The EP20K300EBC652-2X is a strong fit for network switch and router line cards, where 408 user I/O pins handle multiple Gigabit Ethernet MAC interfaces, SPI/parallel management buses, and external PHY connections. The 147,456 bits of embedded RAM implement packet buffers and FIFO queues efficiently, reducing external SRAM requirements. LVDS-capable I/O support direct connection to network PHYs and switch fabric ASICs, while the 1.8V core reduces board power compared with older 3.3V FPGAs. PLLs generate the multiple clock domains required for line-rate packet processing. The 652-BGA 45x45 mm package allows escape routing for hundreds of high-speed SERDES-adjacent signals on multi-layer backplanes.
Recomendado
DSP and Image Processing Pipelines
The EP20K300EBC652-2X supports DSP and image-processing pipelines because its MultiCore LUT architecture enables efficient implementation of multipliers, MAC units, and FIR filters. The 147,456 bits of embedded RAM serve as coefficient stores and line buffers, while 11,520 logic elements handle pixel-rate datapaths and control FSMs. Designers can realize multi-channel video scaling, color-space conversion, and motion-estimation blocks in a single device. The 408 I/O pins absorb wide parallel video buses (BT.1120, LVDS display interfaces) and connection to external DDR memory for frame buffering. With the -2 speed grade, the device sustains pixel clocks above 100 MHz on common 1080p designs. PLLs generate independent pixel, memory, and processing clocks with low jitter.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP20K300EBC652-2X — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP20K300EBC652-2 | EP20K300EBC652-1X | EP20K300EBC652-1 | EP20K200EBC652-2X | EP20K400EBC652-2X |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 652-BGA (45x45 mm) | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same |
| Typical Gates | 300,000 | 300,000 | 300,000 | 300,000 | 200,000 | 400,000 |
| User I/O | 408 | 408 | 408 | 408 | 408 | 408 |
| Speed Grade | -2 | -2 | -1 (faster) | -1 (faster) | -2 | -2 |
| RoHS / Lead-Free | Yes (X suffix) | No (leaded) | Yes (X suffix) | No (leaded) | Yes (X suffix) | Yes (X suffix) |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Diferenciadores clave
- RoHS-compliant lead-free finish on the -X variant (frente a EP20K300EBC652-2)
- Balanced cost-performance at the -2 speed grade (frente a EP20K300EBC652-1X)
- 300K gates with 408 I/O in the 652-BGA (frente a EP20K200EBC652-2X)
- Mid-density sweet spot in APEX-20KE family (frente a EP20K400EBC652-2X)
Notas de diseño
The 652-ball FineLine BGA at 45x45 mm requires a high-density PCB with microvia or via-in-pad technology for reliable assembly. Place at least 8 to 12 ground-reference vias around the perimeter for thermal dissipation and return-current paths. Matched-length differential pair routing is mandatory for LVDS signals - typical intra-pair skew should be held under 5 ps. Use 4 to 6 PCB layers with continuous ground planes directly under the BGA to suppress power-plane resonance.
Decouple each VCCINT and VCCIO pin with a 0.1 uF ceramic capacitor placed within 5 mm of the ball, plus bulk tantalum or polymer capacitors at the voltage regulator outputs. The 1.8V core can draw peak currents exceeding 2 A during logic toggling - choose a regulator with at least 30% headroom and verify load-step response. Place PLL VCC pins on a quiet filtered supply (ferrite bead + decoupling) to minimize jitter.
Estimated thermal dissipation at 300K-gate utilization with 50% toggle rate is approximately 3 to 5 W. The FineLine BGA-652 junction-to-ambient thermal resistance (theta_JA) is approximately 12 C/W with a 4-layer JEDEC test board - so junction temperature rise above ambient is roughly 35 to 60 C. Designers should evaluate airflow or heatsink attachment if the design runs in an enclosed chassis. Do not exceed 85 C junction for the commercial temperature grade.
LVDS I/O pairs require 100 ohm differential termination near the receiver end; place the resistor within 5 mm of the FPGA ball to prevent reflection. Single-ended LVTTL/LVCMOS outputs should be series-terminated when driving traces longer than 50 mm. Use a 4-layer stackup (signal-gnd-power-signal) to maintain a 50 ohm controlled impedance for single-ended traces and 90 ohm for differential pairs.
Common mistakes include: (1) failing to configure all unused I/O pins as tri-stated inputs with weak pull-ups to prevent floating-pin oscillation, (2) using the wrong configuration mode (PS vs AS vs JTAG) for the chosen EPC configuration device, (3) ignoring the I/O bank voltage compatibility - mixing 3.3V and 2.5V standards in the same bank damages the device, (4) omitting CRC error checking in configuration bitstreams in safety-critical systems.
Información de cumplimiento
RoHS compliant per the X suffix in the part number; the X suffix denotes lead-free ball finish. AEC-Q100 is not applicable for this FPGA family (no automotive-grade variant). Halogen-free status not stated in available data.
