EP20K400BC652-3V - 400K Gate APEX 20K FPGA, 652-BGA | Intel
N.º de pieza: EP20K400BC652-3V ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 100 | $240 | $24.000,00 |
| 500 | $215 | $107.500,00 |
| 1.000 | $195 | $195.000,00 |
EP20K400BC652-3V Descripción general
A Field-Programmable Gate Array is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, allowing designers to implement arbitrary digital logic that is re-programmable in the field. APEX 20K devices belong to the PLD -> FPGA -> programmable logic -> digital IC hierarchy and were the industry's first PLDs to integrate look-up table (LUT) logic, product-term logic, and embedded memory blocks on a single die — a system-on-a-programmable-chip (SOPC) integration.
Key features include the QuadCore / MultiCore architecture that combines register-rich LUT logic for datapath and state-machine functions, product-term logic for fast control paths, and embedded memory (EABs/LUT-RAM) for buffers, FIFOs, and small register files. The -3V speed grade targets ~167 MHz internal operation. The high I/O count of 502 plus 4 dedicated inputs makes the device suitable for high-density bus bridges, telecom line cards, and parallel DSP datapaths.
The architecture pairs a four-element LUT (LE) with an adjacent product-term (Macrocell) share, feeding a Logic Array Block (LAB) of ten LEs. Embedded Array Blocks (EABs) implement synchronous dual-port RAM up to 2,048 bits per block, totaling 212,992 RAM bits. Interconnect uses FastTrack continuous routing with predictable delay across the die, simplifying static timing closure.
Typical applications include high-performance telecommunications line cards, parallel DSP co-processors, image-processing pipelines, bus-bridge ASIC prototyping, and industrial control designs where the APEX 20K family remains a long-lifecycle 5 V-tolerant I/O option. The V suffix denotes 2.5 V VCCINT operation; legacy 5 V designs can still use 3.3 V PCI-style I/O standards via banked VCCIO rails.
When designing with this part, ensure banked VCCIO supplies match the I/O standard selected for each bank, and verify signal integrity at 167 MHz using IBIS models from the APEX 20K datasheet. Decoupling requires at least 12 x 0.1 µF plus 4 x 10 µF bulk capacitors placed around the BGA periphery.
This page synthesizes the APEX 20K datasheet headline specs, distributor pricing, and drop-in alternatives within the EP20K400 family — engineering reference material not consolidated in any single distributor product page.
Alternativas directas para EP20K400BC652-3V — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP20K400BC652-3V (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Process Technology, Speed Grade, Series.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP20K400BC652-3
✅ Sustitución directa✓ En stock
$189 / unidad
Ver hoja de datos →EP20K400BC652-2V
✅ Sustitución directa✓ En stock
$260 / unidad
Ver hoja de datos →EP20K400BC652-1V
✅ Sustitución directa✓ En stock
$47.95 / unidad
Ver hoja de datos →EP20K400EBC652-3
✅ Sustitución directa✓ En stock
$210 / unidad
Ver hoja de datos →EP20K400BC652-2XV
✅ Sustitución directa✓ En stock
$165 / unidad
Ver hoja de datos →EP20K300EBC652-3
✅ Sustitución directa✓ En stock
$138.75 / unidad
Ver hoja de datos →EP20K400BC652-3V Valores máximos y características eléctricas
| Family | APEX 20K |
| Series | APEX-20K® |
| Logic Cells / Elements | 16,640 |
| Gates | 400,000 |
| Total RAM Bits | 212,992 |
| User I/Os | 502 |
| Dedicated Inputs | 4 |
| Maximum Operating Frequency | 167 MHz |
| Propagation Delay | 3.6 ns (per MicrochipUSA) |
| Core Supply Voltage (VCCINT) | 2.375 V to 2.625 V (nominal 2.5 V) |
| Process Technology | 0.22 µm CMOS |
| Temperatura de funcionamiento | 0 °C to 85 °C (commercial) |
| Encapsulado | 652-ball BGA, 45 x 45 mm, 1.27 mm pitch |
| Tipo de montaje | Surface Mount (BGA) |
| Speed Grade | -3 (faster) |
Guía de configuración de pines de EP20K400BC652-3V 652-ball bga, 45 x 45 mm, 1.27 mm pitch
Configuración de pines para EP20K400BC652-3V (encapsulado 652-ball bga, 45 x 45 mm, 1.27 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP20K400BC652-3V.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP20K400BC652-3V es adecuado para 6 aplicacións: Telecommunications Line Cards, Parallel DSP Co-Processors, ASIC Prototyping & Logic Emulation, Industrial Control Systems, Image & Video Processing Pipelines, Bus Bridge & Protocol Conversion.
Telecommunications Line Cards
The EP20K400BC652-3V's 502 user I/Os and 400K gates suit telecom line-card designs that need wide parallel bus aggregation. With 16,640 logic elements and 212,992 RAM bits, the device implements UTOPIA / POS-PHY interfaces, ATM cell processors, and multi-channel HDLC controllers in a single FPGA. The -3 speed grade (~167 MHz) handles STS-1/STM-0 rate processing, while banked VCCIO allows direct interface to 3.3 V framer ASICs without level shifters. The 652-ball BGA provides high pin density for multi-port line cards where board area is constrained, making it a long-lifecycle part for telecom OEMs with installed-base refresh needs.
Recomendado
Parallel DSP Co-Processors
The EP20K400BC652-3V's embedded memory blocks (EABs) deliver 212,992 bits of synchronous dual-port RAM, ideal for FIR filter coefficient storage and data-path scratchpad memories in parallel DSP designs. With 16,640 logic elements, designers can build 16-bit MAC trees, FFT butterflies, or correlator arrays clocked at 167 MHz in the -3V speed grade. The MultiCore architecture mixes register-rich LUT for datapath math with product-term logic for fast control, enabling single-chip DSP co-processors that offload compute from host CPUs in radar, sonar, and baseband processing applications where legacy 5 V-tolerant I/O remains required.
Recomendado
ASIC Prototyping & Logic Emulation
With 400K system gates and 502 I/Os, the EP20K400BC652-3V is widely used for ASIC prototyping and logic-emulation platforms that map large gate-count ASICs into APEX 20K FPGAs. The high I/O count supports full multi-bus ASIC pin-out capture, while the 212,992-bit embedded memory and 16,640 LEs provide logic and storage capacity for medium-complexity ASIC emulation. Quartus II design tools (legacy version 4.0 - 5.1) support the full APEX 20K family and enable time-division-multiplexed multi-FPGA emulation of multi-million-gate ASICs, an established methodology for pre-silicon validation in networking ASIC development.
Recomendado
Industrial Control Systems
The EP20K400BC652-3V operates across 0-85 °C commercial temperature range with 2.5 V core, fitting industrial control designs that require flexible parallel I/O, deterministic timing, and high logic density. Its 502 user I/Os interface directly to industrial sensor arrays, motor-control peripherals, and multi-axis encoder inputs; the embedded RAM blocks store lookup tables for PWM generation, sinusoidal commutation, and PID controller state. Long-term availability as a mature product supports installed-base industrial platforms where redesign cycles span 10-15 years and re-qualification costs discourage migration to newer families.
Recomendado
Image & Video Processing Pipelines
Image-processing pipelines benefit from the EP20K400BC652-3V's high I/O bandwidth (502 pins) and 212,992 bits of embedded dual-port RAM. Designers can implement real-time video preprocessing — scaling, color-space conversion, edge detection — using the 16,640 logic elements clocked at up to 167 MHz. The MultiCore architecture mixes register-rich LUT for pixel-pipeline arithmetic with fast product-term control for timing signals like HSYNC/VSYNC and field detection. Banked VCCIO rails support direct connection to D1/CCIR656 video ADCs and DACs operating at 3.3 V, simplifying PCB integration for broadcast and medical imaging equipment.
Recomendado
Bus Bridge & Protocol Conversion
The EP20K400BC652-3V is well suited for high-pin-count bus bridges that aggregate legacy protocols (PCI, VME, VXI) into modern serial interfaces. Its 502 user I/Os accommodate wide parallel buses up to 64 bits at 167 MHz in the -3V speed grade, achieving >10 Gbps aggregate bus bandwidth. The 212,992-bit embedded memory buffers packet transactions across protocol boundaries, while the Mid- and High-density LABs provide the routing flexibility needed to map complex bus-mux logic. Banked VCCIO permits mixed-voltage bridging between 5 V legacy peripherals and 3.3 V or 2.5 V host buses without external level shifters, a common requirement in industrial retrofit designs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP20K400BC652-3V — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP20K400BC652-3 | EP20K400BC652-2V | EP20K400BC652-1V | EP20K400EBC652-3 | EP20K400BC652-2XV |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 652-ball BGA | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same | 652-ball BGA - same |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded RAM Bits | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| User I/Os | 502 | 502 | 502 | 502 | 488 | 502 |
| Speed Grade | -3 (fastest) | -3 | -2 (~15-25% slower) | -1 (~30% slower) | -3 (1.8 V core) | -2 (industrial temp) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.8 V (20KE) | 2.5 V |
| Temperature Range | 0 to 85 °C (commercial) | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | 0 to 85 °C | -40 to 85 °C (industrial) |
Diferenciadores clave
- Fastest commercial speed grade in the 652-BGA APEX 20K line (frente a EP20K400BC652-2V)
- Same 652-BGA pinout enables zero-PCB-change drop-in to the lower-power 20KE family (frente a EP20K400EBC652-3)
- Industrial-temperature option exists in same package (frente a EP20K400BC652-2XV)
Notas de diseño
The 652-ball BGA on 1.27 mm pitch requires a minimum of 4 routing layers with via-in-pad or microvia fanout for reliable assembly. Per APEX 20K layout guidelines, place at least 12 x 0.1 µF high-frequency ceramic decoupling capacitors around the BGA periphery (within 200 mils of supply balls), plus 4 x 10 µF bulk tantalum or ceramic capacitors near the supply pins. JTAG TCK should be series-terminated with 33 Ω if trace length exceeds 2 inches to avoid double-clocking at high frequencies. BGA corner balls should connect to ground for thermal dissipation and reference plane stitching.
Estimated: at 167 MHz with 90% logic utilization, VCCINT current draw for the EP20K400 approaches ~3-4 A peak on the 2.5 V rail, requiring a low-dropout regulator with at least 5 A capability (e.g. TI TPS75533 + TPS72525 cascade, or equivalent). Multiple parallel ferrite beads should isolate analog and digital supply planes. Designers should include power-supply sequencing circuitry to ensure VCCINT stabilizes before VCCIO ramps to avoid latch-up, and add undervoltage lockout (UVLO) to the reset chain. The APEX 20K datasheet provides ICC estimates by operating mode and toggle rate for more accurate budgeting.
With 502 user I/Os and simultaneous switching at 167 MHz, signal-integrity analysis via IBIS models is mandatory. Each I/O bank should be assigned a single VCCIO voltage to avoid mixing standards within a bank. Source-synchronous interfaces should use LVDS or LVPECL where trace length exceeds 3 inches, with matched-pair routing (within 50 mil skew) and 100 Ω differential impedance. The APEX 20K datasheet's I/O timing chapter provides tCO, tSU, and tH specifications by speed grade — designers should use -3V timing for the -3V speed grade and derate by 25% at the -2 speed grade to account for process/voltage/temperature variation.
Common pitfalls with the EP20K400 family include: (1) confusing the -3, -3V, -3N suffixes — the N suffix indicates lead-free and the V indicates 2.5 V VCCINT, but both can co-occur; (2) attempting to use Quartus II software newer than version 5.1 which drops APEX 20K support — pin to legacy Quartus 4.x for full device support; (3) ignoring I/O bank VCCIO constraints — mixing 5 V and 3.3 V standards in the same bank damages the device; (4) forgetting to enable the JTAG nCONFIG pin during power-up which prevents configuration from starting. Refer to the APEX 20K datasheet configuration chapter and AN-176 for proper multi-device configuration chains.
Información de cumplimiento
RoHS status not explicitly listed in Verified Web Data — consult distributor listing for EP20K400BC652-3V to confirm. APEX 20K family was introduced before RoHS mandates (2003), so original parts may have leaded BGA balls; lead-free N-suffix variants exist for RoHS compliance. AEC-Q100 not applicable for FPGAs in this context.
