EP20K400FC672-1XGZ - 400K Gate APEX-20KE FPGA, 502 I/O, 672-FBGA | Intel
N.º de pieza: EP20K400FC672-1XGZ ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 250 | $209 | $52.250,00 |
| 500 | $195 | $97.500,00 |
EP20K400FC672-1XGZ Descripción general
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that uses configurable logic blocks (LUTs), programmable interconnects, and dedicated I/O cells to implement arbitrary digital circuits after PCB assembly. APEX-20KE sits in the hierarchy: APEX-20KE -> APEX 20K family -> programmable logic -> CMOS ASIC-replacement IC. The 2.5V core supply and CMOS process technology place it in the older high-density programmable logic generation, predating modern 28nm/14nm FPGAs but still widely deployed in long-lifecycle industrial and communications equipment.
Key features of the EP20K400FC672-1XGZ include 16,640 logic elements/cells, a propagation delay of 2.5 ns, and 212,992 bits of embedded memory. The 672-FBGA package exposes 502 general-purpose I/O pins supporting multiple I/O standards (LVTTL, LVCMOS, PCI, GTL+) per the APEX-20KE datasheet family. The -1 speed grade denotes the slowest commercial speed bin (compared to -2 and -3 grades), trading timing margin for cost.
Technically, the APEX-20KE combines look-up-table-based logic elements with embedded system blocks that can be configured as dual-port RAM, ROM, or content-addressable memory. The MultiCore architecture allows the embedded memory and logic fabric to be sized independently for each design, and the deterministic interconnect fabric supports high-speed datapath placement for DSP, telecom, and glue-logic functions.
Typical applications include telecommunications backplane glue logic, industrial control and factory automation controllers, network routers and switches, DSP coprocessing, and legacy ASIC replacement in long-lifecycle military and avionics systems. Engineers choose APEX-20KE specifically for designs that must remain bit-identical with installed OEM equipment, where migration to a newer FPGA family would require extensive re-validation.
A critical design consideration when using the EP20K400FC672-1XGZ is power-rail sequencing and I/O bank VCCIO configuration - mis-setting bank voltages can cause permanent damage to I/O buffers. Always use Altera Quartus II (legacy) or equivalent programming tools and follow the JTAG configuration sequence in the APEX-20KE handbook.
This page synthesizes distributor availability, drop-in APEX-20K family alternatives, and practical design guidance not found in the manufacturer datasheet alone.
Alternativas directas para EP20K400FC672-1XGZ — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP20K400FC672-1XGZ (mismo factor de forma y huella) — difiere en Package, Family, Operating Temperature, Process Technology, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP20K400FC672-1X
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP20K400EFC672-2X
✅ Sustitución directa✓ En stock
$118.9 / unidad
Ver hoja de datos →EP20K400EFC672-1XN
✅ Sustitución directa✓ En stock
$215 / unidad
Ver hoja de datos →EP20K400CFC672-9
✅ Sustitución directa✓ En stock
$325 / unidad
Ver hoja de datos →EP20K400EFC672-3
✅ Sustitución directa✓ En stock
$199.5 / unidad
Ver hoja de datos →EP20K400FC672-1XGZ Valores máximos y características eléctricas
| Family | APEX-20KE |
| Logic Elements / Cells | 16,640 |
| System Gates | 400,000 (typical) |
| Embedded Memory Bits | 212,992 |
| Maximum User I/O | 502 |
| Encapsulado | 672-pin FBGA (Fine-pitch BGA) |
| Temperatura de funcionamiento | 0C to +85C (commercial) |
| Core Supply Voltage | 2.5 V |
| Propagation Delay | 2.5 ns (per DigiChip listing) |
| Logic Family / Process | CMOS |
| Speed Grade | -1 (slowest commercial bin) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Unknown (legacy part, pre-dates widespread RoHS conversion) |
| Configuration Method | JTAG / passive serial / passive parallel (per APEX-20KE handbook) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+ (per APEX-20KE family datasheet) |
Guía de configuración de pines de EP20K400FC672-1XGZ 672-pin fbga (fine-pitch bga)
Configuración de pines para EP20K400FC672-1XGZ (encapsulado 672-pin fbga (fine-pitch bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP20K400FC672-1XGZ.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP20K400FC672-1XGZ es adecuado para 6 aplicacións: Telecommunications Backplane Glue Logic, Industrial Control and Factory Automation, Legacy ASIC Replacement, Network Router and Switch Datapath, DSP Coprocessor and Datapath Acceleration, Avionics and Military Communication Systems.
Telecommunications Backplane Glue Logic
The EP20K400FC672-1XGZ's 16,640 logic elements and 502 I/O pins make it well suited for telecommunications backplane glue logic where it bridges ASICs, network processors, and physical-layer devices. With 2.5ns propagation delay and APEX-20KE MultiCore architecture, it can implement bus converters, FIFO buffers, and protocol adaptation logic on TDM, ATM, and SONET/SDH backplanes. The 672-FBGA package exposes 502 I/O, more than enough to fan out 32-bit data buses plus control planes. Compared to discrete 74-series glue logic, one EP20K400E consolidates hundreds of packages and supports in-field reprogramming - critical for telecom OEMs iterating on protocol firmware across product generations.
Recomendado
Industrial Control and Factory Automation
The EP20K400FC672-1XGZ is widely deployed in industrial PLCs, motor controllers, and factory-automation backplanes where long product lifecycles demand FPGA logic that will remain in production for 10-20+ years. With 16,640 LEs, the device can implement multi-axis motion controllers, encoder interfaces (Quadrature, SSI, BiSS), and deterministic real-time state machines. The 212,992 bits of embedded memory support fast lookup tables for PID control loops. Although this commercial-grade -1 speed bin part is rated 0C to +85C, the APEX-20K family shares the same 672-FBGA pinout with industrial -C variants like the EP20K400CFC672-9 for harsher environments. Pin-compatible migration enables designers to drop the same PCB footprint across temperature grades.
Recomendado
Legacy ASIC Replacement
The EP20K400FC672-1XGZ excels at legacy ASIC replacement in long-lifecycle products where re-spinning a mask set is uneconomical. With 400,000 system gates and 16,640 LEs, it can replicate most mid-complexity ASICs while remaining in-system programmable for design corrections and feature additions. The 672-FBGA package replicates most 0.18-0.35um ASIC pad layouts when migrated with a chip-on-board adapter. For OEMs maintaining avionics, medical imaging, or military-communications equipment originally designed in 2000-2005, the EP20K400FC672-1XGZ offers bit-equivalent logic replication. The obsolete status is acceptable here because the host system itself is end-of-life, but pin-compatible APEX-20KE family parts (EP20K400EFC672-2X) can be substituted for supply resilience.
Recomendado
Network Router and Switch Datapath
The EP20K400FC672-1XGZ can implement Ethernet switch fabric interfaces, packet header inspection engines, and Layer-2/3 forwarding logic in legacy router and switch platforms. With 502 I/O and 16,640 logic elements, the device supports multiple Gigabit Ethernet MACs, TCAM interfaces, and high-speed packet-classification state machines. The 212,992-bit embedded memory provides low-latency packet buffers and route-lookup tables. While modern switches use purpose-built NPU silicon, the EP20K400FC672-1XGZ remains valuable for extending the life of installed base equipment where full board replacement is impractical. Its 2.5ns propagation delay is sufficient for 200 MHz internal datapath operation, and the 672-FBGA package supports the high pin count required for parallel PHY interfaces.
Recomendado
DSP Coprocessor and Datapath Acceleration
The EP20K400FC672-1XGZ provides 16,640 logic elements that can implement custom FIR filters, FFT engines, and video-processing pipelines as a coprocessor alongside a host DSP or microcontroller. The APEX-20KE MultiCore architecture supports efficient multiplier mapping through dedicated carry chains, enabling high-throughput DSP datapaths at lower power than software-only implementations. Embedded memory (212,992 bits) can be configured as coefficient ROM or sample RAM for signal-processing kernels. Engineers historically paired the EP20K400FC672-1XGZ with TI TMS320C6x DSPs to offload compute-intensive tasks in radar, sonar, and baseband processing. For higher-throughput designs, the EP20K400EFC672-3 (speed grade -3) provides additional timing margin.
Recomendado
Avionics and Military Communication Systems
The EP20K400FC672-1XGZ has historical qualification in avionics and military-communications subsystems where MultiCore architecture, 502 I/O, and 16,640 LEs supported MIL-STD-1553 interfaces, ARINC 429 bus controllers, and secure-radio signal-processing chains. Although the base -1 speed grade is commercial temperature, the APEX-20KE family shares the 672-FBGA pinout with extended-temperature variants for harsh-environment deployment. The device's deterministic interconnect fabric and JTAG boundary-scan support simplify DO-254 design assurance workflows. For new avionics designs, pin-compatible EP20K400CFC672-9 (industrial temperature) or EP20K400EFC672-2X (enhanced logic, higher speed) provide alternatives without PCB rework.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP20K400FC672-1XGZ — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP20K400FC672-1X | EP20K400EFC672-2X | EP20K400EFC672-1X | EP20K400CFC672-9 | EP20K400EFC672-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-FBGA | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) |
| Family | APEX-20KE (F-variant) | APEX-20KE (F-variant) | APEX-20KE (E-variant) | APEX-20KE (E-variant) | APEX-20KE (C-variant) | APEX-20KE (E-variant) |
| Speed Grade | -1 | -1 | -2 (faster) | -1 | -9 (industrial) | -3 (fastest) |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Max User I/O | 502 | 502 | 502 | 502 | 502 | 502 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +85C (industrial) | 0C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete (limited stock) | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Bit-identical -GZ shipping variant simplifies BOM management (frente a EP20K400FC672-1X)
- Lower-cost -1 speed grade for cost-sensitive legacy designs (frente a EP20K400EFC672-2X)
- Standard F-variant logic for deterministic resource budgeting (frente a EP20K400EFC672-1X)
- Proven longevity in installed-base telecom and industrial equipment (frente a Cyclone-series Intel FPGAs)
Notas de diseño
The EP20K400FC672-1XGZ requires three separate power rails: VCCINT (2.5V core), VCCIO (per I/O bank, typically 3.3V or 2.5V), and VCCP (PCI clamp supply). Power-rail sequencing requires VCCINT to ramp first, followed by VCCIO and VCCP within 100ms; reverse sequencing can latch-up the I/O buffers. Estimated core current at full toggling of 16,640 LEs at 100 MHz is approximately 1.5-2.0 A, requiring a 2.5V regulator rated at least 3 A with low-ESR ceramic decoupling (10 x 0.1uF + 4 x 10uF). Add a bulk 220uF tantalum cap on the VCCINT rail for transient margin.
The 672-FBGA package uses 1.0mm ball pitch, which requires 4-layer PCB minimum with microvia-in-pad or 6-layer with stacked microvias for reliable BGA assembly. Per the APEX-20KE hardware reference, route all global clocks (CLK0-CLK3) on the inner layer directly beneath the package with controlled impedance (50 ohm single-ended). Provide a dedicated ground plane under the FBGA die and stitch vias around the perimeter at 5mm spacing. Differential pair routing is recommended for LVDS clock distribution if extended beyond 50mm.
Three common pitfalls cause EP20K400FC672-1XGZ prototypes to fail: (1) MSEL pins not tied correctly for the desired configuration mode - the device defaults to AS mode and will hang if no serial flash is connected; (2) nCONFIG held low during power-up prevents configuration, often traced to a slow-ramping 3.3V rail; (3) I/O bank VCCIO voltage mismatch when mixing 3.3V LVTTL and 5V-tolerance inputs - the APEX-20KE I/O banks are NOT 5V-tolerant, so a level shifter is required. Always verify with Quartus II pin planner before board bring-up.
Estimated thermal dissipation for the EP20K400FC672-1XGZ at 100% utilization (16,640 LEs toggling at 100 MHz) is approximately 3-4 W. With theta_JA of approximately 12 C/W (676-FBGA, 1.0mm pitch, JEDEC EIA/JESD51 still-air test board), the junction temperature rise is roughly 36-48 C above ambient. For forced-air cooling, ensure at least 1.0 m/s airflow across the BGA; for conduction-cooled chassis, the PCB inner-plane copper pour directly beneath the package provides the primary heat path. Derate ambient temperature by 10 C if no airflow is available.
Información de cumplimiento
EP20K400FC672-1XGZ is a legacy Altera/Intel FPGA from the early 2000s; RoHS/REACH compliance status was not specified in the verified web data. Engineers should request the latest material-compliance documentation directly from the surplus distributor before use in RoHS-restricted markets. AEC-Q100 is not applicable (FPGA, not automotive-grade qualified).
