EP20K600CB652I9N - 600K APEX 20KC FPGA, 652-BGA, Industrial | Altera
N.º de pieza: EP20K600CB652I9N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $225 | $2.250,00 |
| 100 | $195 | $19.500,00 |
| 500 | $175 | $87.500,00 |
| 1.000 | $158 | $158.000,00 |
EP20K600CB652I9N Descripción general
An FPGA is a programmable logic device that combines the flexibility of software-defined hardware with near-ASIC performance. The APEX 20KC family extends the earlier APEX 20K architecture with enhanced multiplier blocks, dual-port RAM, and support for high-speed LVDS I/O. Within the broader IC taxonomy, FPGAs belong to programmable logic devices (PLDs), which sit inside logic ICs and ultimately under integrated circuits (ICs).
Key features include 480 general-purpose I/O pins (488 total I/O with 4 dedicated inputs), 250MHz maximum internal clock frequency, embedded MultiTrack interconnect, and support for high-speed LVDS and PCI interfaces. The 652-ball BGA package supports high pin density while preserving signal integrity for memory-bus and backplane designs. Configuration is loaded via Altera's passive serial, passive parallel, or in-system programmability via JTAG.
The EP20K600CB652I9N uses a look-up table (LUT) and embedded memory-based architecture. Logic elements (LEs) are grouped into MegaLAB structures that share routing resources, balancing utilization and timing closure for large designs. The device also includes embedded ESB (Embedded System Block) RAM and CAM resources, allowing distributed memory without consuming LUT logic.
Typical applications include telecommunications infrastructure, ASIC prototyping, high-speed DSP pipelines, and custom parallel processing engines. Industrial and military designs historically adopted APEX 20KC for its combination of high logic capacity, embedded RAM, and I/O bandwidth.
When designing with EP20K600CB652I9N, ensure 1.8V core and 3.3V I/O supply decoupling are properly designed. The 652-BGA package requires careful PCB layout with controlled-impedance traces and adequate thermal dissipation via internal copper planes and ground vias under the BGA.
This page consolidates verified distributor pricing, same-package drop-in alternatives, and practical design notes beyond the Altera APEX 20KC datasheet. Reviewers can use this as an authoritative cross-reference for sourcing decisions.
Alternativas directas para EP20K600CB652I9N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP20K600CB652I9N (mismo factor de forma y huella) — difiere en Package, Process Technology, Device Type, Operating Temperature, Maximum Operating Frequency.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP20K600CB652I9
✅ Sustitución directa✓ En stock
$165 / unidad
Ver hoja de datos →EP20K600CB652I8N
✅ Sustitución directa✓ En stock
$175 / unidad
Ver hoja de datos →EP20K600CB652I7N
✅ Sustitución directa✓ En stock
$158 / unidad
Ver hoja de datos →EP20K600CB652C9N
✅ Sustitución directa✓ En stock
$128 / unidad
Ver hoja de datos →EP20K600CB652C8N
✅ Sustitución directa✓ En stock
$115 / unidad
Ver hoja de datos →EP20K600CB652C7N
✅ Sustitución directa✓ En stock
$305 / unidad
Ver hoja de datos →EP20K600CB652I9N Valores máximos y características eléctricas
| Family | APEX 20KC |
| Logic Elements | 24,320 |
| System Gates | 600,000 |
| Maximum Operating Frequency | 250 MHz |
| Process Technology | 0.15 um CMOS |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V |
| Total I/O Pins | 488 |
| General-Purpose I/O | 480 |
| Dedicated Inputs | 4 |
| Encapsulado | 652-BGA (PBGA652) |
| Terminal Pitch | 1.27 mm |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Configuration Method | Passive Serial / Passive Parallel / JTAG |
| Embedded Memory | ESB (Embedded System Block) RAM / CAM |
| I/O Standards | LVDS, PCI, LVTTL, LVCMOS |
Guía de configuración de pines de EP20K600CB652I9N 652-bga (pbga652)
Configuración de pines para EP20K600CB652I9N (encapsulado 652-bga (pbga652)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP20K600CB652I9N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP20K600CB652I9N es adecuado para 7 aplicacións: Telecommunications Line Card Processing, ASIC Prototyping and Emulation, High-Speed DSP Pipeline Implementation, Industrial Control and Automation Backplane, Custom Parallel Processing Engine, Legacy PCI Bus Interface Bridge, Military and Aerospace Signal Processing.
Telecommunications Line Card Processing
The EP20K600CB652I9N is well-suited for legacy telecommunications line-card processing because its 600,000 system gates, 24,320 logic elements, and 488 I/O pins provide sufficient capacity for protocol framing, multiplexing, and SERDES-like glue logic at the time of design. The 250MHz internal clock rate and native LVDS support enable backplane interconnect at rates typical of mid-2000s telecom infrastructure. The 652-BGA package preserves signal integrity for high-density buses between line cards and backplane, while embedded ESB RAM supports packet-buffer lookups. Modern designs typically migrate to Cyclone V or Arria V families, but legacy infrastructure can continue operation with this APEX 20KC part.
Recomendado
ASIC Prototyping and Emulation
Engineers historically chose the EP20K600CB652I9N for ASIC prototyping and emulation due to its high logic capacity (24,320 LEs) and abundant I/O (488 pins), which allowed multi-million-gate ASIC designs to be partitioned across one or more APEX 20KC devices. The 1.8V core and 0.15um CMOS process offered predictable timing closure when validating pre-silicon RTL. The 652-BGA package supports the wide parallel buses required for boundary-scan and trace signal breakout. Embedded ESB blocks provide distributed RAM for transaction logging during emulation. Today, modern prototyping platforms using Stratix or Virtex-7/UltraScale families are preferred, but legacy emulation rigs still rely on APEX 20KC devices.
Recomendado
High-Speed DSP Pipeline Implementation
The EP20K600CB652I9N supports mid-range DSP pipelines such as FIR filtering, FFT preprocessing, and video processing at line rates up to 250MHz. The APEX 20KC architecture includes dedicated multiplier blocks that accelerate multiply-accumulate operations common in DSP kernels, while embedded ESB RAM provides coefficient and sample storage close to the logic. The 480 general-purpose I/O pins enable multi-channel data acquisition at rates typical of baseband processing. Engineers using this part in DSP designs benefit from deterministic latency through the MultiTrack interconnect. Industrial video and machine-vision systems of the era adopted APEX 20KC for this combination of DSP throughput and I/O bandwidth.
Recomendado
Industrial Control and Automation Backplane
The EP20K600CB652I9N is appropriate for industrial control and automation backplane designs that require abundant I/O to interface sensors, actuators, and fieldbus networks. Its 488 I/O count and support for LVDS, LVTTL, and PCI signaling allow direct connection to backplane connectors, encoder interfaces, and high-speed serial links of the era. Industrial temperature grade (-40C to +100C) supports deployment in factory-floor enclosures. The 652-BGA package is mechanically robust when paired with proper PCB stiffeners and underfill, satisfying IEC 60068 vibration profiles common in industrial automation. New designs typically migrate to MAX 10 or Cyclone IV for active lifecycle support.
Recomendado
Custom Parallel Processing Engine
The EP20K600CB652I9N can be configured as a custom parallel processing engine for compute-intensive tasks like image preprocessing, packet classification, or cryptographic acceleration. Its 24,320 logic elements and embedded memory blocks can implement SIMD-style data paths with deterministic per-cycle latency, while the 250MHz clock rate delivers sufficient throughput for real-time workloads. The 488 I/O enable wide data buses for memory and interconnect. Engineers partition algorithms across multiple APEX 20KC devices when single-chip capacity is exceeded. This application pattern was widely used in military/aerospace signal-processing subsystems before modern SoC FPGAs dominated.
Recomendado
Legacy PCI Bus Interface Bridge
The EP20K600CB652I9N natively supports the PCI interface standard, making it a common choice for legacy PCI bus bridges, adapter cards, and embedded host-bus controllers. Its 480 general-purpose I/O pins allow direct interface to the PCI bus alongside local memory and peripherals, while the 1.8V core and 3.3V I/O match the conventional PCI signaling levels. Embedded ESB RAM supports fast transaction buffering. The 652-BGA package accommodates the wide PCI connector footprint plus onboard memory. Industrial PCs and test equipment of the era used APEX 20KC to bridge PCI to custom ASICs or backplane buses.
Recomendado
Military and Aerospace Signal Processing
The EP20K600CB652I9N was deployed in military and aerospace subsystems including radar preprocessing, electronic warfare front ends, and secure communications modems. Its 600K-gate capacity, embedded multiplier blocks, and industrial temperature grade supported deployment in ruggedized enclosures with extended thermal envelopes. The 652-BGA package, when assembled with underfill and matched CTE substrates, satisfies the mechanical and thermal shock profiles of MIL-STD-810. Programmable logic flexibility allowed mission-specific algorithm updates without hardware re-spin. Long-life-cycle programs continue to source this part through legacy distributors as of 2026-09-08.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP20K600CB652I9N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP20K600CB652I9 | EP20K600CB652I8N | EP20K600CB652I7N | EP20K600CB652C9N | EP20K600CB652C8N | EP20K600CB652C7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 652-BGA (PBGA652) | 652-BGA (PBGA652) | 652-BGA (PBGA652) | 652-BGA (PBGA652) | 652-BGA (PBGA652) | 652-BGA (PBGA652) | 652-BGA (PBGA652) |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| Speed Grade | I9 (fastest) | I9 (fastest) | I8 | I7 | C9 | C8 | C7 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Total I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Lifecycle Status (2026-09-08) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Highest speed grade in the I-temperature APEX 20KC 652-BGA family (frente a EP20K600CB652I8N)
- Industrial temperature grade for harsh-environment deployment (frente a EP20K600CB652C9N)
- Highest logic density in the APEX 20KC family at this package size (frente a EP20K400CB652I9)
Notas de diseño
EP20K600CB652I9N requires separate 1.8V core and 3.3V I/O supplies with sequencing to avoid I/O latch-up at power-up. Estimated: total core current at 250MHz with high utilization can approach 1.5-2A; I/O current scales with switching frequency and bank loading. Decouple each supply rail with 100uF bulk plus 0.1uF and 10uF ceramic capacitors placed within 5mm of the BGA supply balls. Use a dedicated power plane per voltage domain to minimize return-path inductance.
The 652-BGA package with 1.27mm pitch requires via-in-pad or dog-bone fan-out and microvia stackups for high-layer-count boards. Maintain continuous ground reference planes beneath BGA rows and route matched-length differential pairs (LVDS/PCI) within 150um tolerance. Use thermal vias under the central BGA region to spread heat to internal copper planes; APEX 20KC dissipates 5-15W depending on toggle rate. Reflow profile should match JEDEC J-STD-020 for Pb-free assembly.
LVDS and PCI signaling on EP20K600CB652I9N requires 100 ohm differential impedance with 5 mil trace width/spacing on FR-4 stackup. Keep stubs short, use matched-length serpentine routing, and place AC-coupling capacitors near the receiver end. The MultiTrack interconnect provides deterministic delays within the device, but PCB routing asymmetry can dominate timing margins at 250MHz. Simulate critical interfaces with IBIS models before layout freeze.
Do not assume EP20K600CB652I9N logic density is fully available for user logic; embedded ESB blocks, clock networks, and I/O registers consume resources. Reserve 10-15% of LEs for routing headroom and avoid over-utilization that prevents timing closure. Configuration via JTAG requires TCK/TMS/TDO/TDI pull-ups per IEEE 1149.1. Always issue a CONFIG_DONE handshake check before driving mission-critical outputs. Verify Quartus II version supports the specific speed grade and silicon revision.
Información de cumplimiento
Compliance information not specified in the verified distributor data. APEX 20KC family predates mandatory RoHS documentation requirements for legacy Altera parts. AEC-Q100 not applicable to FPGAs of this era. Engineers should verify compliance with their franchised distributor if required.
