EP20K600CF1020I7 - APEX 20KC 600K Gates FPGA | Altera/Intel
N.º de pieza: EP20K600CF1020I7 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
EP20K600CF1020I7 Descripción general
An FPGA (Field-Programmable Gate Array) is a programmable logic device category that allows engineers to implement arbitrary digital logic on a chip after manufacture. APEX 20KC belongs to the APEX (Advanced Programmable Logic Element Matrix) family hierarchy: PLD (Programmable Logic Device) -> CPLD/FPGA -> SRAM-based FPGA -> APEX family -> APEX 20K/20KE/20KC sub-families. APEX 20KC extends APEX 20K with faster interconnect and embedded memory blocks (ESBs) for true dual-port RAM, FIFO, and CAM functions.
Key features include PCI SIG Local Bus Specification Revision 2.2 compliance for 3.3V operation at 33 or 66 MHz with 32- or 64-bit data, high-speed external memory interfaces including DDR SDRAM and ZBT SRAM support, and the industrial temperature grade indicated by the I7 suffix (-40C to +85C). The PLCC-equivalent ball grid array enables high I/O density in a square 1020-ball footprint.
Technical depth comes from the MultiCore architecture integrating look-up tables (LUTs), product-term logic, and embedded system blocks (ESBs). Each ESB can be configured as dual-port RAM up to 32,640 bits, supporting true dual-port operation, FIFO buffers, and content-addressable memory. The high gate count and 1.6 ns propagation delay support complex datapath and glue-logic integration on a single device.
Typical applications include high-speed telecommunications backplane interfaces, industrial control and factory automation, PCI bus bridging, ASIC prototyping, and high-performance DSP pre/post-processing. The wide I/O count suits designs that need parallel buses and memory expansion.
When designing, ensure the 1.8V core supply decoupling is placed close to the device and that I/O banking matches the chosen I/O standard. The 1020-ball FC-FBGA requires X-ray inspection or BGA rework stations for prototype bring-up. Industrial-grade parts (I7 suffix) are screened for -40C to +85C operation.
This page synthesizes distributor pricing, drop-in APEX 20KC alternatives from the Site MPN list, and practical design notes that complement the manufacturer APEX 20K family datasheet.
Alternativas directas para EP20K600CF1020I7 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP20K600CF1020I7 (mismo factor de forma y huella) — difiere en Package, Speed Grade, Maximum Operating Frequency, Process Technology, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP20K600CF1020C7
✅ Sustitución directa✓ En stock
$212.4 / unidad
Ver hoja de datos →EP20K600CF1020C8
✅ Sustitución directa✓ En stock
$92 / unidad
Ver hoja de datos →EP20K600CF1020C9
✅ Sustitución directa✓ En stock
$165 / unidad
Ver hoja de datos →EP20K600CF1020I7 Valores máximos y características eléctricas
| Family | APEX 20KC |
| Series | EP20K600 |
| System Gates | 600,000 |
| Logic Elements / Cells | 24,320 |
| Maximum Operating Frequency | 375.94 MHz |
| Process Technology | 0.15 um CMOS |
| Supply Voltage (Nominal) | 1.8 V |
| Supply Voltage Range | 1.71 V to 1.89 V |
| I/O Lines | 588 |
| Propagation Delay | 1.6 ns |
| Encapsulado | 1020-ball FC-FBGA (S-PBGA-B1020) |
| Package Code | HBGA, square grid array |
| Terminal Pitch | 1.000 mm |
| Temperature Grade | Industrial (-40C to +85C) - I7 suffix |
| PCI Compliance | PCI SIG Local Bus Spec Rev 2.2 (3.3V, 33/66 MHz, 32/64-bit) |
| Memory Interfaces | DDR SDRAM, ZBT SRAM |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de EP20K600CF1020I7 hbga, square grid array
Configuración de pines para EP20K600CF1020I7 (encapsulado hbga, square grid array). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP20K600CF1020I7.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP20K600CF1020I7 es adecuado para 6 aplicacións: PCI Bus Bridge / Interface, High-Speed Memory Interface (DDR SDRAM / ZBT SRAM), ASIC Prototyping and Emulation, Industrial Control and Factory Automation, Telecommunications Backplane Interface, Legacy Design Replication and Field Upgrades.
PCI Bus Bridge / Interface
The EP20K600CF1020I7's 588 I/O lines and PCI SIG Local Bus Specification Revision 2.2 compliance make it ideal for PCI bridge designs. The device natively supports 32- or 64-bit PCI at 33 or 66 MHz on a 3.3 V rail, replacing multi-chip discrete bridge solutions. The 24,320 logic elements absorb target-logic, FIFOs, and configuration-space registers; embedded system blocks (ESBs) implement 0- to 32-byte transaction FIFOs without external SRAM. Unlike a dedicated PCI bridge ASIC, this FPGA lets engineers tune arbitration latency and add custom DMA channels.
Recomendado
High-Speed Memory Interface (DDR SDRAM / ZBT SRAM)
With 588 I/Os and APEX 20KC ESBs (Embedded System Blocks) configurable as dual-port RAM up to 32,640 bits, the EP20K600CF1020I7 implements DDR SDRAM and ZBT SRAM controllers in a single device. The 375.94 MHz internal frequency and 1.6 ns propagation delay satisfy the 200 MHz DDR setup/hold margins required by telecom backplane designs. ESB-based FIFOs replace external IDT/ZBT chips, reducing board area. Industrial -40C to +85C screening suits outdoor telecom shelves.
Recomendado
ASIC Prototyping and Emulation
The 600,000 system gates and 24,320 logic elements make the EP20K600CF1020I7 a high-capacity ASIC prototyping vehicle. Engineers partition multi-million-gate ASICs across multiple APEX 20KC FPGAs using the MultiCore interconnect; pin-to-pin compatibility within the CF1020 speed grades allows swapping industrial parts for prototyping without board rework. JTAG and Quartus II flows support rapid place-and-route iteration, while the FC-FBGA package delivers the signal-integrity margin required for 100+ MHz multi-FPGA partition clocks.
Recomendado
Industrial Control and Factory Automation
Industrial temperature screening (-40C to +85C) and 1.6 ns propagation delay qualify the EP20K600CF1020I7 for factory-floor controllers that combine PLC logic, servo loop computation, and high-speed fieldbus interfaces (e.g., Profibus, EtherCAT). The 588 I/Os absorb multi-axis encoder counters, PWM generators, and discrete I/O scan chains. APEX 20KC's ESB-based dual-port RAM allows dual-CPU arbitration between a control MCU and a safety MCU without external glue logic, reducing BOM cost in volume automation equipment.
Recomendado
Telecommunications Backplane Interface
The EP20K600CF1020I7's 588 I/Os accommodate backplane glue logic that aggregates T1/E1, T3/E3, and low-speed SERDES traffic before forwarding to network processors. PCI 2.2 compliance enables direct connection to standard PMC carrier cards; APEX 20KC's high fan-out per LE supports the wide OR-tying and clock-tree structures used in ATCA/cPCI backplane designs. Industrial temperature grade supports outdoor telecom cabinets, while the FC-FBGA package handles the thermal load of sustained telecom operation.
Recomendado
Legacy Design Replication and Field Upgrades
For engineers maintaining deployed equipment that originally used APEX 20KC silicon, the EP20K600CF1020I7 in the CF1020 package is the canonical drop-in match for board repairs and field replacements. The same 1020-ball FC-FBGA footprint allows direct substitution onto legacy PCBs without board rework. Quartus II 6.0 programming files remain bit-compatible with the I7 speed grade, so existing JTAG programming flows can be reused - critical for long-lifecycle military, aerospace, and industrial customers who cannot migrate to newer Cyclone families.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP20K600CF1020I7 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP20K600CF1020C7 | EP20K600CF1020C8 | EP20K600CF1020C9 | EP20K600CB652I7 | EP20K600CB652I8 |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA (1.000 mm pitch) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 652-ball BGA - DIFFERENT footprint | 652-ball BGA - DIFFERENT footprint |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Speed Grade | -7 (fastest) | -7 | -8 | -9 | -7 | -8 |
| Core Voltage | 1.8 V (1.71-1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Diferenciadores clave
- Industrial temperature grade with speed grade -7 (frente a EP20K600CF1020C7)
- 1020-ball FC-FBGA offers 588 I/O - 55% more than 652-ball package (frente a EP20K600CB652I7)
- Fastest speed grade -7 in APEX 20K 600K family (frente a EP20K600CF1020C9)
Notas de diseño
Estimated: the 1020-ball FC-FBGA package handles 2-3 W typical APEX 20KC dissipation in still air. For industrial (-40C to +85C) operation, provide at least 4-6 layer PCB with a continuous ground plane beneath the BGA, 8 thermal vias (0.3 mm drill, 1.0 mm pitch) directly under the die, and 200 LFM of airflow in enclosed chassis. Without airflow, junction-to-ambient thermal resistance rises sharply and may force a derating of clock frequency at the high temperature end.
The 1.000 mm ball pitch requires PCB land pads of 0.50 mm diameter with non-solder-mask-defined (NSMD) finish for reliable reflow. Use 0.4 mm laser-drilled micro-vias in a dog-bone fanout to escape the inner rows. Maintain a continuous reference plane on layers 2 and (N-1) for impedance-controlled signals; trace impedance of 50 ohms single-ended is the standard target for APEX 20KC LVCMOS/LVTTL I/O.
Do not confuse the I7 temperature suffix with industrial grade only - I7 specifically denotes -40C to +85C, while I8 is also industrial. C7/C8/C9 are commercial. APEX 20KC configuration data is volatile (SRAM-based) and must be loaded from a configuration PROM (EPCS or compatible) on every power-up; designs without a configuration plan will not boot. Decouple VCCINT with 0.1 uF and 10 uF X5R ceramics within 5 mm of each power pin pair.
Información de cumplimiento
EP20K600CF1020I7 was launched before modern RoHS/REACH documentation was standardized; compliance data not available in verified sources. Not AEC-Q100 qualified (FPGAs are not typical automotive ICs).
