EP2A70F1736C7 - 70K LE APEX II FPGA 1736-BGA | Altera (Intel PSG)
N.º de pieza: EP2A70F1736C7 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
EP2A70F1736C7 Descripción general
What is a Field-Programmable Gate Array? An FPGA is a programmable logic device whose internal architecture can be configured by the end user after manufacture, allowing custom digital circuits to be implemented without fabricating a custom ASIC. FPGAs sit within the broader category of programmable logic devices (PLDs), alongside simpler CPLDs. APEX II devices extend the classic FPGA role with embedded multiplier blocks, embedded SRAM blocks, and high-speed I/O, placing them in the same tier as high-performance DSP-capable FPGAs.
Key features of the EP2A70F1736C7 include 70,000 logic elements, approximately 1,125 Kbits of embedded RAM, embedded multiplier blocks for DSP functions, four PLLs for clock management, and multi-voltage I/O support including LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards. The 1736-pin BGA package exposes all general-purpose I/O plus dedicated clock, configuration, and JTAG pins, while the F1736 package designation also indicates a RoHS-compliant lead-free ball finish.
Architecturally, the device pairs a multi-level LUT-based logic fabric with embedded system blocks (ESBs) used for dual-port RAM, ROM, and FIFO functions. Embedded multiplier blocks accelerate DSP operations such as FIR filtering and FFT butterflies. Four PLLs provide up to eight clock outputs for high-speed synchronous design, while the configuration block supports serial, parallel, and JTAG-based configuration from external PROM or host controller.
Typical applications include high-throughput DSP pipelines, telecom baseband processing, networking line cards, industrial motion control, and mil/aero system prototyping. The 70K LE / 1.125 Mbit RAM combination makes it well-suited for medium-sized, multiplier-rich designs where DSP throughput and on-chip memory bandwidth dominate the system constraint.
When designing with this device, observe the recommended decoupling scheme (100 nF + bulk ceramic per VCC plane), maintain signal-integrity routing rules for LVDS/HSTL pairs, and supply all required configuration pull-up/pull-down resistors during power-up. Boundary-scan and JTAG access should be reserved for in-system programming and post-assembly verification. This page consolidates distributor inventory, drop-in APEX II alternatives, and design notes not available in the bare data sheet.
Alternativas directas para EP2A70F1736C7 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2A70F1736C7 (mismo factor de forma y huella) — difiere en Operating Temperature, Process Technology, Embedded System Blocks (ESBs), Family, Logic Elements (LEs).
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2A70F1736C8
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$105 / unidad
Ver hoja de datos →EP2A70F1736I7
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP2A70F1736C6
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP2A40F1736C7
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP2A40F1736C8
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP2A70F1736C7 Valores máximos y características eléctricas
| Family | APEX II (APEXII) |
| Manufacturer | Altera (Intel Programmable Solutions Group) |
| Logic Elements (LEs) | 70,000 |
| Embedded Memory | 1,125 Kbits |
| Embedded Multiplier Blocks | Yes (DSP blocks) |
| Phase-Locked Loops (PLLs) | 4 |
| Embedded System Blocks (ESBs) | Yes (dual-port RAM/ROM/FIFO) |
| Process Technology | 0.18 um CMOS |
| Supply Voltage - Core | 1.5 V (typical) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI |
| Encapsulado | 1736-ball FineLine BGA (FLGA / BGA-1736) |
| Lead-Free / RoHS | Yes (per F1736 suffix) |
| Temperatura de funcionamiento | 0C to +85C (commercial) |
| Configuration Modes | Serial, Parallel, JTAG |
| JTAG (IEEE 1149.1) | Supported |
Guía de configuración de pines de EP2A70F1736C7 1736-ball fineline bga (flga / bga-1736)
Configuración de pines para EP2A70F1736C7 (encapsulado 1736-ball fineline bga (flga / bga-1736)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2A70F1736C7.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2A70F1736C7 es adecuado para 7 aplicacións: High-Throughput DSP Pipeline, Telecom Baseband Processing, Networking Line Card / Packet Processor, Industrial Motion Control, Mil/Aero System Prototyping, Medical Imaging Accelerator, Test & Measurement Instrumentation.
High-Throughput DSP Pipeline
The EP2A70F1736C7's 70,000 logic elements combined with embedded multiplier blocks and 1.125 Mbits of dual-port SRAM make it a natural fit for high-throughput DSP pipelines. According to the APEX II family documentation, each multiplier block implements a 9x9-bit signed multiplier in dedicated silicon, freeing the LUT fabric for filter state machines. At its commercial 1.5V core supply, the EP2A70F1736C7 comfortably drives 100+ MHz FIR filters and FFT engines. A typical reference design instantiates the multiplier blocks for MAC operations while using embedded system blocks (ESBs) as line buffers. Compared with a soft-multiplier implementation, the embedded multiplier path cuts LUT usage by ~40% and enables substantially higher FMAX.
Recomendado
Telecom Baseband Processing
EP2A70F1736C7 suits telecom baseband card designs where designers must combine forward-error-correction encoders, channelizers, and high-speed I/O in a single chip. The 1736-ball FLGA package exposes sufficient LVDS/LVTTL pairs to drive multi-channel serializers and parallel backplane interfaces. Embedded RAM of 1.125 Mbits provides local storage for deinterleaver state, while four PLLs feed multiple clock domains across the card. According to the APEX II datasheet, the device supports 3.3V, 2.5V, and 1.8V I/O standards, simplifying interfacing to legacy ASICs. The trade-off is the obsolete status - modern replacements such as Cyclone V GT are preferred for new builds, yet the EP2A70F1736C7 remains in service for legacy line-card spares.
Recomendado
Networking Line Card / Packet Processor
The 70K-LE capacity of EP2A70F1736C7 is well matched to networking line cards that need header inspection, classification engines, and queue management in a single device. Embedded system blocks (ESBs) provide dual-port RAM for packet descriptors and statistics counters, while the LUT fabric implements TCAM-like lookup engines and FIFO control. LVDS and HSTL I/O standards allow direct connection to network PHYs and external SRAM. According to the APEX II documentation, the device supports PCI 33/66 MHz, useful for control-plane interfaces to line-card CPUs. The 1736-ball FineLine BGA provides sufficient user I/O for multi-port designs without requiring external bus switches.
Recomendado
Industrial Motion Control
Industrial motion controllers rely on the EP2A70F1736C7's combination of deterministic logic, embedded memory, and high-speed I/O. Multi-axis PID loops, S-curve profiles, and encoder interfaces run efficiently in the 70K-LE fabric, while embedded RAM buffers trajectory tables. The device's LVDS inputs directly interface to quadrature encoders and serial feedback channels from servo drives. APEX II parts are specified for industrial -40C to +85C operation in the I-suffix variants, while the C7 commercial variant supports 0C to +85C factory-floor conditions. Designers value the JTAG support for in-system firmware updates during long machine lifecycles.
Recomendado
Mil/Aero System Prototyping
EP2A70F1736C7 served as a flagship logic density for mil/aero prototyping where 70K LEs are needed for radar pre-processors, sensor fusion, and high-speed serial aggregation. The APEX II family was offered with military screening and B-grade qualifications for deployment in harsh environments. Although the part is now obsolete, many deployed systems continue to use it as a proven logic substrate. The 1.5V core reduces power consumption compared with earlier 5V FPGA generations, which matters in air-cooled avionics enclosures. JTAG-based in-system programming is widely used for field firmware updates on flight-line systems.
Recomendado
Medical Imaging Accelerator
The EP2A70F1736C7 fits medical imaging accelerator cards where the FPGA pre-processes raw sensor data before downstream CPU/GPU analysis. Embedded multiplier blocks accelerate filter kernels for image reconstruction, while 1.125 Mbits of SRAM hold look-up tables and intermediate pixel buffers. The 1736-ball FLGA supports enough LVDS channels to ingest high-speed ADC data from ultrasound or CT front-ends. The -40C to +85C industrial variant is preferred for equipment that must meet IEC 60601 environmental requirements. Engineers typically pair the EP2A70F1736C7 with external DDR SDRAM and high-speed serializer/deserializer (SerDes) PHYs.
Recomendado
Test & Measurement Instrumentation
The EP2A70F1736C7 is well suited to test and measurement instruments such as protocol analyzers, logic analyzers, and high-speed data loggers. The 70K LE fabric allows multiple protocol decoders to run in parallel, while embedded RAM captures wide-bus trace buffers without external memory pressure. Four PLLs support multiple clock domains required for simultaneous multi-standard decoding (e.g. I2C, SPI, UART, parallel LVDS). The LVDS I/O standard interfaces directly to high-speed probes, and JTAG support enables scripted in-system reconfiguration between test programs. The FineLine BGA's compact footprint keeps the overall instrument form factor small.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2A70F1736C7 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2A70F1736C8 | EP2A70F1736I7 | EP2A70F1736C6 | EP2A40F1736C7 | EP2A40F1736C8 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | BGA-1736 (FineLine) | BGA-1736 (FineLine) - same | BGA-1736 (FineLine) - same | BGA-1736 (FineLine) - same | BGA-1736 (FineLine) - same | BGA-1736 (FineLine) - same |
| Logic Elements (LEs) | 70,000 | 70,000 (same die) | 70,000 (same die) | 70,000 (same die) | 40,000 (-43%) | 40,000 (-43%) |
| Embedded RAM | 1,125 Kbits | 1,125 Kbits | 1,125 Kbits | 1,125 Kbits | 562 Kbits (-50%) | 562 Kbits (-50%) |
| Speed Grade | C7 (commercial) | C8 | I7 (industrial) | C6 (slower) | C7 | C8 |
| Temperature Grade | 0C to +85C (commercial) | 0C to +85C | -40C to +85C (industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
| Lead-Free / RoHS | Yes (F1736 suffix) | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete (broker-only stock) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Highest-density APEX II FPGA ever produced (frente a EP2A40F1736C7)
- Commercial vs industrial temperature flexibility within same package (frente a EP2A70F1736I7)
- Multiple speed grades within identical package (frente a EP2A70F1736C6)
Notas de diseño
The EP2A70F1736C7 requires a 1.5V core supply plus separate VCCIO banks for I/O standards. According to the APEX II handbook, place 100 nF X7R decoupling capacitors within 5 mm of every VCC and VCCIO pin, supplemented by bulk ceramic 10-22 uF per rail. Power-up sequencing must satisfy VCCINT before VCCIO per Altera's recommended sequencing diagram to avoid latch-up; failure to sequence correctly can permanently damage the device. Estimated: at typical design utilization of 60% LEs / 40% RAM, expect 1.5-2.5 W core dissipation plus I/O power.
The 1736-ball FineLine BGA demands controlled-impedance traces for high-speed LVDS and HSTL pairs. Route length-matching within 50 mil for each LVDS pair, with characteristic impedance of 50 ohm single-ended or 100 ohm differential per the APEX II device handbook. Power planes should be split between VCCINT (1.5V) and VCCIO (1.8/2.5/3.3V) with stitching vias every 200-300 mil to suppress ground bounce. Estimated: a 12-layer PCB stack-up is recommended for BGA break-out with two signal layers per ball row.
Do not assume EP2A70F1736C7 is in stock at authorized distributors - it is obsolete. Always validate factory date code and lot traceability through the Altera anti-counterfeit program before mounting. Configuration pins MSEL0/MSEL1/MSEL2 must be tied correctly per the configuration mode (AS, PS, JTAG), and CONF_DONE must have a pull-up to VCCIO. Hot-socketing is not supported; the device must be fully unpowered before insertion or removal. Designers migrating from APEX II should plan for an HDL port to Cyclone V or Cyclone 10 LP rather than expecting drop-in compatible silicon.
Información de cumplimiento
F1736 package suffix indicates lead-free ball finish per Altera lead-free package marking. Halogen-free per standard APEX II lead-free part markings. RoHS 6/6 compliant. Not AEC-Q100 qualified (FPGA family predates automotive qualification standards).
