EP2AGX125DF25C4G - Arria II GX FPGA 118K LE 572-FCBGA | Intel
N.º de pieza: EP2AGX125DF25C4G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $488.36 | $488,36 |
| 10 | $469.2 | $4.692,00 |
| 100 | $441.05 | $44.105,00 |
| 250 | $420 | $105.000,00 |
| 500 | $399.95 | $199.975,00 |
EP2AGX125DF25C4G Descripción general
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor belonging to the programmable logic device family (PLD), sitting hierarchically above CPLDs and below fixed-function ASICs in design flexibility. FPGAs contain configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM, and hard IP cores such as transceivers and PLLs, allowing parallel hardware acceleration of compute-intensive algorithms in networking, video, and industrial imaging without the NRE cost of an ASIC.
Key features of the EP2AGX125DF25C4G include up to 8 high-speed serial transceivers supporting PCI Express Gen1/Gen2 and multiple gigabit serial protocols, dedicated 18x18 multipliers for DSP, and on-chip memory that supports true dual-port and FIFO modes. The device integrates embedded memory and DSP blocks to enable single-chip implementation of high-bandwidth pipelines for video processing, baseband modulation, and protocol bridging.
The Arria II GX architecture targets mid-range, transceiver-rich designs. Hard IP for PCIe Gen2, 8B/10B and scrambling engines, and reference-clock PLLs reduce soft-logic area, while the 40 nm process balances logic density with dynamic power. Designers typically use the Quartus II design suite with Qsys for system integration and ModelSim for RTL simulation.
Typical applications include telecom line cards, video broadcast equipment, industrial machine vision, wireless baseband processing, and high-speed serial protocol bridging where deterministic latency and parallel processing matter more than raw sequential CPU throughput. The -4 speed grade and 0.9 V VCC supply make this variant a cost-effective choice for commercial-temperature product deployments.
Designers should plan PCB layout for the FCBGA's controlled-impedance differential pairs, length-matched transceiver lanes, and a multi-rail decoupling network, since the part's PLL and transceiver performance is highly sensitive to power-supply noise. Adequate thermal relief is required at sustained high toggle rates; designers should follow Intel's Arria II GX PCB guidelines for via-in-pad and stack-up recommendations.
This page synthesizes distributor pricing, package details, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para EP2AGX125DF25C4G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2AGX125DF25C4G (mismo factor de forma y huella) — difiere en Package, Speed Grade, DSP Blocks, Mounting Type, Logic Elements.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2AGX125DF25C6N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP2AGX125DF25I4N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP2AGX125DF25C7N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP2AGX125DF29C4G
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP2AGX95DF25C4G
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$360 / unidad
Ver hoja de datos →EP2AGX125DF25C4G Valores máximos y características eléctricas
| Family | Arria II GX |
| Logic Elements (LE) | 118,143 |
| Embedded Memory Bits | 8,315,904 bits |
| User I/O Count | 260 |
| Operating Frequency (max) | 500 MHz |
| Process Technology | 40 nm |
| Core Voltage (VCC) | 0.9 V |
| Speed Grade | -4 (commercial) |
| Encapsulado | 572-ball FCBGA, 25 mm |
| Tipo de montaje | Surface Mount |
| Transceivers | Up to 8 multi-gigabit transceivers |
| DSP Blocks | 18x18 dedicated multipliers |
| Hard PCIe IP | PCIe Gen1/Gen2 compliant |
| Estado RoHS | Compliant |
Guía de configuración de pines de EP2AGX125DF25C4G 572-ball fcbga, 25 mm
Configuración de pines para EP2AGX125DF25C4G (encapsulado 572-ball fcbga, 25 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2AGX125DF25C4G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2AGX125DF25C4G es adecuado para 6 aplicacións: Telecom Line Card Bridging, Video Broadcast Processing, Industrial Machine Vision, Wireless Baseband Processing, High-Speed Protocol Bridge, Test & Measurement Instrumentation.
Telecom Line Card Bridging
The EP2AGX125DF25C4G's 8 multi-gigabit transceivers and hard PCIe Gen2 endpoint IP make it well suited for telecom line-card bridging between backplane SERDES lanes and host CPUs. With 118,143 logic elements, designers can implement protocol adaptation, rate matching, and traffic shaping alongside the hard SERDES. The 500 MHz fabric headroom and 0.9 V core allow dense timing closure at commercial temperature.
Recomendado
Video Broadcast Processing
For video broadcast head-ends and studio routers, the EP2AGX125DF25C4G offers 8,315,904 embedded memory bits to buffer SDI/HDMI/DVB ASI streams while 18x18 DSP multipliers accelerate chroma resampling, scaling, and overlay blending. Designers commonly pair the device with external HDMI/SDI serializers and feed multi-stream pipelines at 3 Gbps, with the hard PCIe IP linking into a host CPU for stream control.
Recomendado
Industrial Machine Vision
Machine vision systems use the EP2AGX125DF25C4G to ingest CoaXPress or GigE Vision streams from multiple cameras and perform real-time preprocessing - Bayer demosaicing, lens correction, and feature extraction - on dedicated 18x18 multipliers. The 260 user I/Os connect directly to industrial image sensors and motor-control feedback lines, while 8.3 Mbits of block RAM buffer full HD frames on-chip.
Recomendado
Wireless Baseband Processing
In small-cell and picocell baseband units, the EP2AGX125DF25C4G implements channel coding, FFT/iFFT, and crest-factor reduction in DSP blocks, with transceivers handling CPRI/OBSAI fronthaul to the radio unit. The device's high block-RAM density and 500 MHz fabric support multi-carrier LTE signal processing at sample rates well within the device's bandwidth budget.
Recomendado
High-Speed Protocol Bridge
Designers use the EP2AGX125DF25C4G as a PCIe Gen2-to-multi-protocol bridge, connecting host CPUs to legacy serial buses (I2C, SPI, UART, custom LVDS). Hard PCIe IP minimizes soft-logic area, freeing logic elements for DMA engines, interrupt controllers, and protocol-state machines. The FCBGA's high ball count supports wide parallel buses to external memory.
Recomendado
Test & Measurement Instrumentation
Bench-top instruments use the EP2AGX125DF25C4G for waveform generation, mixed-signal capture, and protocol-aware triggering at sample rates up to 1 GSPS. Designers instantiate the device's SERDES channels for proprietary inter-card interfaces and use 18x18 multipliers for real-time FFT-based spectrum analysis. Wide supply tolerance and Quartus II timing closure simplify hardware iterations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2AGX125DF25C4G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2AGX125DF25C6N | EP2AGX125DF25I4N | EP2AGX125DF25C7N | EP2AGX125DF29C4G | EP2AGX95DF25C4G |
|---|---|---|---|---|---|---|
| Package | 572-ball FCBGA 25 mm | 572-ball FCBGA 25 mm - same | 572-ball FCBGA 25 mm - same | 572-ball FCBGA 25 mm - same | 572-ball FCBGA 29 mm | 572-ball FCBGA 25 mm - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 118,143 | 118,143 | 118,143 | 118,143 | 118,143 | ~95,000 |
| Speed Grade | -4 (commercial) | -6 (slower) | -4 (industrial) | -7 (slowest) | -4 (commercial) | -4 (commercial) |
| Embedded Memory Bits | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 | 8,315,904 | ~6.8 Mbits |
| User I/Os | 260 | 260 | 260 | 260 | 260 | 260 |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Core Voltage (VCC) | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Operating Temperature | Commercial (0C to +85C) | Commercial | Industrial | Commercial | Commercial | Commercial |
Diferenciadores clave
- Highest commercial speed grade (-4) in the F25 FCBGA family (frente a EP2AGX125DF25C6N)
- Maximum logic density in the F25 package footprint (frente a EP2AGX95DF25C4G)
- Compact F25 package vs larger F29 sibling (frente a EP2AGX125DF29C4G)
Notas de diseño
The 572-ball FCBGA 25 mm package requires a high-density PCB stack-up with microvia or via-in-pad construction. Per Intel's Arria II GX layout guidelines, route the multi-gigabit transceiver lanes on the top layers with controlled differential impedance (typically 100 ohm differential), length-match intra-pair skew to within 5 mil, and length-match inter-pair to within 100 mil for PCIe Gen2 compliance. Maintain continuous reference planes beneath all SERDES routes.
The Arria II GX device requires multiple supply rails: 0.9 V core, 1.1 V PLL, 1.5 V/1.8 V/2.5 V/3.0 V I/O, and transceiver supplies. Use a star-ground topology with at least 1 uF MLCC + 10 uF bulk decoupling per supply pin, placed within 100 mil. Follow Intel's Power Distribution Network (PDN) design guide and target a PDN impedance below 1 mOhm from DC to 100 MHz for noise-sensitive transceiver and PLL supplies.
Estimated: at full utilization (118K LE at 80% toggle rate, all 8 transceivers at 3.75 Gbps), the EP2AGX125DF25C4G dissipates approximately 6-9 W. The FCBGA 25 mm package theta_JA (with JEDEC 4-layer PCB) is roughly 12 C/W, implying a 72-108 C junction temperature rise above ambient. Designers should allocate thermal vias beneath the BGA, an inner-layer copper flood, and potentially a heatsink for sustained commercial-temperature operation. For Industrial-grade variants, derate accordingly.
Common pitfalls include: (1) leaving unused transceiver channels unterminated - they must be powered down in the Quartus II configuration or they draw excess current; (2) mismatched reference clocks between adjacent transceiver channels cause PCIe Gen2 link-training failures; (3) ignoring MSL3 moisture sensitivity - the FCBGA must be baked or floor-life managed per JEDEC J-STD-033; (4) wrong I/O standard bank voltage - each bank is independently powered but shares VREF rails.
Información de cumplimiento
RoHS and REACH compliance per Intel Arria II GX product family declaration. AEC-Q100 is not applicable for FPGAs - see Intel automotive Cyclone or Arria V variants for AEC-Q100 qualified parts.
