EP2AGX260EF29C4N - 244K LE Arria II GX FPGA, 780-FCBGA | Altera
N.º de pieza: EP2AGX260EF29C4N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 100 | $1560 | $156.000,00 |
| 500 | $1410 | $705.000,00 |
| 1.000 | $1295 | $1.295.000,00 |
EP2AGX260EF29C4N Descripción general
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect. Within the broader taxonomy, an FPGA sits below ASIC in performance-per-watt but above general-purpose microcontrollers in raw parallel throughput, making it ideal for protocol bridging, signal processing, and hardware acceleration where time-to-market outweighs the cost of custom silicon.
Key features include 10260 logic array blocks, 4 PCI Express hard IP blocks, 8.5 Gbps transceivers on dedicated GXB channels, dedicated DDR2/DDR3 memory controller hard IP, and configuration via passive serial, fast passive parallel, or JTAG. The 0.9 V core reduces dynamic power relative to the previous 90 nm Arria GX family while the integrated PCIe and PHY simplify board-level design.
Typical applications include PCI Express Gen1/Gen2 endpoint cards, multi-gigabit serial backplane aggregation, digital video broadcast studio equipment, software-defined radio baseband pre-processing, and ASIC prototyping. Its combination of logic density and serial bandwidth makes it a frequent choice for designers migrating from Stratix II or Cyclone III designs that require a mid-bandwidth transceiver companion.
When designing with this device, plan a multi-layer PCB with continuous ground and power planes; the FC-BGA's high pin count and high-speed transceivers demand controlled-impedance routing, length matching within 25 mils across GXB lanes, and a minimum of 6 PCB layers to maintain signal integrity.
Alternativas directas para EP2AGX260EF29C4N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2AGX260EF29C4N (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Speed Grade, Mounting Type, Process Technology.
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EP2AGX260EF29C4G
✅ Sustitución directa✓ En stock
$1955.55 / unidad
Ver hoja de datos →EP2AGX260EF29C4
✅ Sustitución directa✓ En stock
$339.5 / unidad
Ver hoja de datos →EP2AGX260EF29C5N
✅ Sustitución directa✓ En stock
$1565 / unidad
Ver hoja de datos →EP2AGX260EF29C6N
✅ Sustitución directa✓ En stock
$1395 / unidad
Ver hoja de datos →EP2AGX260EF29I5N
✅ Sustitución directa✓ En stock
$1950 / unidad
Ver hoja de datos →EP2AGX260EF29C7N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP2AGX260EF29C4N Valores máximos y características eléctricas
| Family | Arria II GX |
| Logic Elements | 244188 |
| Logic Array Blocks (LABs) | 10260 |
| Embedded Memory Bits | 12038144 |
| User I/O Pins | 372 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Max Core Frequency | 500 MHz |
| Transceivers | 8.5 Gbps GXB channels |
| PCI Express Hard IP Blocks | 4 |
| Memory Interfaces | DDR2/DDR3 hard controllers |
| Encapsulado | 780-ball FC-BGA (FBGA) |
| Package Code | HBGA, BALL, 780 terminals |
| Tipo de montaje | Surface Mount (FC-BGA) |
| Estado RoHS | Compliant |
| Operating Temperature Grade | Commercial (0C to 85C) |
| Speed Grade | C4 |
Guía de configuración de pines de EP2AGX260EF29C4N hbga, ball, 780 terminals
Configuración de pines para EP2AGX260EF29C4N (encapsulado hbga, ball, 780 terminals). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2AGX260EF29C4N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2AGX260EF29C4N es adecuado para 6 aplicacións: PCI Express Gen1/Gen2 Endpoint Card, Multi-Gigigabit Serial Backplane Aggregation, Software Defined Radio Baseband Pre-Processing, ASIC Prototyping and Emulation, Broadcast Video Processing and Conversion, Industrial Motor Control and Servo Drives.
PCI Express Gen1/Gen2 Endpoint Card
The EP2AGX260EF29C4N integrates four PCI Express hard IP blocks operating at Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) line rates, eliminating the need for external PHY silicon in many endpoint designs. Its 244K logic elements comfortably absorb protocol stack, DMA engine, and user application logic for RAID HBAs, capture cards, and FPGA co-processing boards. Designers can place the EP2AGX260EF29C4N at the root complex side with up to x8 lanes while dedicating remaining logic to value-add processing.
Recomendado
Multi-Gigigabit Serial Backplane Aggregation
With up to 16 GXB transceiver channels supporting data rates up to 8.5 Gbps each, the EP2AGX260EF29C4N serves as a backplane aggregation node in telecom and datacom switches. The combination of 372 user I/Os and high-speed serial bandwidth makes it well suited for bridging between SFP+ optical modules and switch fabrics. Its 12 Mbits of internal RAM buffers packet bursts without external RLDRAM in many designs, simplifying the bill of materials.
Recomendado
Software Defined Radio Baseband Pre-Processing
The EP2AGX260EF29C4N provides 244K logic elements plus hundreds of dedicated DSP blocks ideal for channelization, digital up/down-conversion, and crest-factor reduction in SDR base stations. Its GXB transceivers interface cleanly with wideband ADC/DAC pairs running at 1+ Gsps, while the FPGA fabric performs real-time FIR filtering and FFT pre-processing. The 12 Mbit embedded memory handles burst buffering for OFDMA symbols.
Recomendado
ASIC Prototyping and Emulation
The EP2AGX260EF29C4N is a popular ASIC prototyping vehicle because its 244K logic elements and 12 Mbit memory can map complex SoC designs split across multiple FPGAs. Combined with abundant transceivers for chip-to-chip bridging and 372 user I/Os for bring-up visibility, it accelerates pre-silicon software development and hardware regression testing. The 780-ball FC-BGA package accommodates high-speed probe access for logic analyzer attachment.
Recomendado
Broadcast Video Processing and Conversion
Studio video equipment for SDI/HD-SDI/3G-SDI routing, conversion, and processing benefits from the EP2AGX260EF29C4N's 244K logic elements and integrated transceivers. The FPGA fabric handles protocol bridging (HDMI to SDI, frame-rate conversion, de-interlacing) while the GXB channels clock out serial digital video streams. The 372 user I/Os support parallel video buses plus ancillary audio and metadata interfaces common in broadcast installations.
Recomendado
Industrial Motor Control and Servo Drives
High-end industrial servo drives and CNC controllers leverage the EP2AGX260EF29C4N's logic density and fast transceivers to implement multi-axis control loops, EtherCAT or SERCOS III master interfaces, and encoder processing in a single FPGA. The deterministic 0.9 V core and 40 nm low-power process keep thermal output manageable in enclosed industrial cabinets. The 780-ball FC-BGA footprint is well suited to conduction-cooled chassis designs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2AGX260EF29C4N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2AGX260EF29C4G | EP2AGX260EF29C4 | EP2AGX260EF29C5N | EP2AGX260EF29C6N | EP2AGX260EF29I5N | EP2AGX260EF29C7N |
|---|---|---|---|---|---|---|---|
| Package | 780-FCBGA (29x29 mm) | 780-FCBGA (29x29 mm) - same | 780-FCBGA (29x29 mm) - same | 780-FCBGA (29x29 mm) - same | 780-FCBGA (29x29 mm) - same | 780-FCBGA (29x29 mm) - same | 780-FCBGA (29x29 mm) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | C4 | C4 | C4 | C5 (faster) | C6 (faster) | I5 (industrial temp, faster) | C7 (fastest) |
| Operating Temperature | Commercial (0C to 85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to 100C) | Commercial |
| Logic Elements | 244188 | 244188 | 244188 | 244188 | 244188 | 244188 | 244188 |
| Embedded Memory | 12038144 bits | 12038144 bits | 12038144 bits | 12038144 bits | 12038144 bits | 12038144 bits | 12038144 bits |
| User I/O | 372 | 372 | 372 | 372 | 372 | 372 | 372 |
| Lead-Free / RoHS | No (SnPb balls) | Yes (Pb-free) | No (SnPb balls) | No (SnPb balls) | No (SnPb balls) | No (SnPb balls) | No (SnPb balls) |
Diferenciadores clave
- Pb-free RoHS drop-in option for new designs (frente a EP2AGX260EF29C4G)
- Higher speed grade options for tighter timing margins (frente a EP2AGX260EF29C5N)
- Industrial temperature variant for harsh environments (frente a EP2AGX260EF29I5N)
Notas de diseño
The 780-ball FC-BGA requires a high-density PCB with at least 6 layers (4 routing, ground, power) and 1.0 mm ball-pitch escape routing using microvias (laser-drilled, 0.1 mm pad). Continuous power and ground planes must extend under the entire BGA footprint to provide low-inductance return paths for the 0.9 V core. Use a via-in-pad design for transceiver GXB balls to minimize stub effect above 5 GHz.
Implement the Altera-recommended PowerTree with separately decoupled rails: 0.9 V VCC, 1.4 V VCCA_GXB for transceiver PLLs, 2.5 V VCCA_PLL for clock PLLs, and a 1.5 V/1.8 V VCCIO for user I/O banks. Use a multi-phase synchronous buck regulator for the 0.9 V core to handle load transients exceeding 20 A during configuration. Power-on sequencing must satisfy VCCIO >= VCC per Altera handbook to prevent I/O latch-up.
Estimated: at maximum toggle rate on 244K logic elements with all 12 Mbits of memory active and GXB channels running 8.5 Gbps, total package power reaches approximately 8-10 W. The 29x29 mm FC-BGA requires a thermal pad with exposed die-down lid; attach a heatsink via thermal interface material (TIM) rated for 0.05 C/W or better. In enclosed chassis without airflow, derate to 70% utilization to keep junction below 100C.
Common pitfalls include: (1) failing to match GXB lane lengths within 25 mils causing link-up failure, (2) omitting the 2.5 V VCCA_PLL rail leading to configuration failure, (3) leaving JTAG TCK floating which prevents configuration via download cable, (4) selecting the wrong speed grade (C4 vs C5) and failing timing closure on PCIe Gen2 paths. Always run Quartus II timing analysis across all speed corners before committing to layout.
Información de cumplimiento
EP2AGX260EF29C4N is non-RoHS due to SnPb solder balls (-N suffix). The -G suffix variant (EP2AGX260EF29C4G) is RoHS compliant and a drop-in replacement. REACH compliance per Intel/Altera product statements; AEC-Q100 not applicable to FPGAs.
