EP2AGX260EF29I5G - Arria II GX FPGA 244K LE | Intel | 780-FBGA
N.º de pieza: EP2AGX260EF29I5G ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1725 | $17.250,00 |
| 100 | $1595 | $159.500,00 |
| 500 | $1485 | $742.500,00 |
| 1.000 | $1380 | $1.380.000,00 |
EP2AGX260EF29I5G Descripción general
An FPGA (Field Programmable Gate Array) is a reprogrammable semiconductor device consisting of an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) and are widely used to implement parallel digital logic, custom I/O protocols, hardware-accelerated DSP, and prototyping of ASICs. The Arria II GX family in particular combines high logic density with embedded transceivers, occupying the mid-range position between Altera's Stratix high-end series and the lower-cost Cyclone series.
Key features include 1,026 embedded multiplier blocks (18x18) for DSP-intensive workloads, 8.55 Mbits of embedded memory (triple-mode with parity support), and dedicated hardware for PCI Express hard IP. The device supports configuration via JTAG, passive serial, fast passive parallel, and Active Serial (EPCS) modes, with built-in error correction for configuration memory.
The EP2AGX260EF29I5G uses Altera's 40 nm low-power process, providing a balance between performance and dynamic power. Quartus II software with Arria II device support is used for synthesis, place-and-route, timing closure, and power estimation. Hard IP blocks accelerate common functions including PCIe Gen2 x8 endpoints, multi-gigabit transceivers, and external memory controllers for DDR3, DDR2, and QDR II+ memories.
Typical applications include wireless baseband processing, software defined radio (SDR), broadcast video processing, industrial imaging and machine vision, military secure communications, and high-performance compute accelerators. The integrated transceivers also make it well-suited for protocol bridging between PCIe, Ethernet, and Serial RapidIO.
When designing with this device, pay close attention to transceiver reference clock routing, decoupling capacitor placement around the FBGA, and thermal management - the device can dissipate tens of watts in dense transceiver-driven designs. Use Altera's Quartus II power analyzer early in the design cycle.
This page synthesizes distributor pricing, drop-in alternatives from the Arria II GX family, and practical design notes not consolidated in any single manufacturer document. All cross-brand equivalents are sourced from published web references.
Alternativas directas para EP2AGX260EF29I5G — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2AGX260EF29I5G (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Logic Elements, Process Technology, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2AGX260EF29I5
✅ Sustitución directa✓ En stock
$1235 / unidad
Ver hoja de datos →EP2AGX260EF29I3N
✅ Sustitución directa✓ En stock
$2120 / unidad
Ver hoja de datos →EP2AGX260EF29I3G
✅ Sustitución directa✓ En stock
$1480 / unidad
Ver hoja de datos →EP2AGX260EF29C6N
✅ Sustitución directa✓ En stock
$1395 / unidad
Ver hoja de datos →EP2AGX190EF29I5G
✅ Sustitución directa✓ En stock
$1900 / unidad
Ver hoja de datos →EP2AGX125EF29I5G
✅ Sustitución directa✓ En stock
$861.62 / unidad
Ver hoja de datos →EP2AGX260EF29I5G Valores máximos y características eléctricas
| Family | Arria II GX |
| Logic Elements | 244188 |
| Adaptive Logic Modules (ALMs) | 102600 |
| Embedded Memory | 12038144 bits (8.55 Mbit) |
| Maximum User I/Os | 372 |
| Transceiver Channels | 12 (up to 6.375 Gbps) |
| 18x18 Multipliers | 1026 (embedded multiplier blocks) |
| Operating Supply Voltage (Core) | 0.87 V to 0.93 V |
| Process Technology | 40 nm |
| Encapsulado | 780-FBGA (FC-FBGA, 29x29 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Configuration Mode | JTAG, Passive Serial, FPP, Active Serial (EPCS) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| Status Suffix | I5 = Industrial grade, speed grade 5 |
Guía de configuración de pines de EP2AGX260EF29I5G 780-fbga (fc-fbga, 29x29 mm)
Configuración de pines para EP2AGX260EF29I5G (encapsulado 780-fbga (fc-fbga, 29x29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2AGX260EF29I5G.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2AGX260EF29I5G es adecuado para 6 aplicacións: Wireless Baseband Processing, Broadcast Video Processing, Software Defined Radio (SDR), PCIe-Based Acceleration Cards, Industrial Imaging and Machine Vision, Military and Secure Communications.
Wireless Baseband Processing
The EP2AGX260EF29I5G's 244,188 logic elements and 1026 embedded 18x18 multipliers deliver the DSP throughput required for multi-antenna wireless baseband processing including LTE and 5G NR physical-layer functions. Its 12 integrated transceivers at up to 6.375 Gbps handle CPRI/OBSAI fronthaul links between baseband units and remote radio heads. According to the Arria II GX datasheet, the device supports CPRI line rates up to 4.915 Gbps natively, eliminating external PHY chips. The 8.55 Mbit embedded memory buffers turbo decoder state and HARQ soft-combining data. For radio unit designs requiring 4x4 MIMO with carrier aggregation, the 244K LE density leaves margin for MAC scheduling and beamforming precoding algorithms.
Recomendado
Broadcast Video Processing
The EP2AGX260EF29I5G is well suited for broadcast video format conversion, multi-screen video wall controllers, and 4K/UHD signal processing due to its high logic density and abundant DSP blocks. The 1026 18x18 multipliers accelerate motion estimation, scaling, and deinterlacing pipelines, while the 8.55 Mbit embedded memory supports multi-frame line buffers. According to the Arria II GX datasheet, the device supports DDR3/DDR2/QDR II+ external memory controllers, essential for high-bandwidth video frame buffering. The integrated transceivers handle SDI (Serial Digital Interface) at 3 Gbps via soft IP. The 780-FBGA EF29 package fits within typical broadcast equipment board form factors with adequate thermal dissipation.
Recomendado
Software Defined Radio (SDR)
The EP2AGX260EF29I5G supports software defined radio platforms for military communications, public safety radio, and cognitive radio research where protocol agility and wideband DSP are required. Its 1026 embedded multipliers and 244K logic elements implement wideband digital down-conversion, channelization, and modulation/demodulation across multiple waveforms simultaneously. According to the Arria II GX datasheet, the 12 transceivers at 6.375 Gbps handle IF sampling and high-speed ADC/DAC interface requirements. The 8.55 Mbit embedded memory supports FFT windowing and sample buffering for real-time spectrum analysis. Industrial temperature grade (-40C to +100C) enables deployment in outdoor tactical and vehicular SDR platforms.
Recomendado
PCIe-Based Acceleration Cards
The EP2AGX260EF29I5G is suitable for PCIe Gen2 accelerator cards used in high-performance compute, machine learning inference, and storage acceleration. Its hard PCIe IP block supports Gen2 x8 endpoints, providing 4 GB/s of host-to-FPGA bandwidth. According to the Arria II GX datasheet, the device's 244K logic elements implement deep processing pipelines while the 8.55 Mbit embedded memory holds intermediate results close to the logic. The integrated transceivers enable multi-card interconnect via Serial RapidIO or 10 Gigabit Ethernet. Industrial temperature grade supports deployment in data center and edge server environments where ambient temperatures exceed commercial grades.
Recomendado
Industrial Imaging and Machine Vision
The EP2AGX260EF29I5G powers multi-camera machine vision systems for semiconductor inspection, automated optical inspection (AOI), and high-speed sorting. Its 1026 embedded 18x18 multipliers accelerate image preprocessing including 2D convolution, Sobel edge detection, and Bayer demosaicing in real-time at multi-megapixel resolutions. According to the Arria II GX datasheet, the 12 transceivers connect to Camera Link, CoaXPress, and GigE Vision cameras directly, eliminating frame grabber cards. The 8.55 Mbit embedded memory buffers image lines and feature maps. Industrial temperature grade (-40C to +100C) supports factory floor deployment with elevated ambient temperatures and vibration.
Recomendado
Military and Secure Communications
The EP2AGX260EF29I5G is used in tactical radios, secure communications terminals, and electronic warfare systems where wideband DSP and protocol flexibility are critical. Its 244K logic elements implement Type-1 crypto, frequency hopping, and spread-spectrum processing, while the integrated transceivers handle IF and baseband digitization. According to the Arria II GX datasheet, the industrial temperature grade and lead-free packaging meet MIL-STD-810 environmental requirements for shock and vibration. The 8.55 Mbit embedded memory supports adaptive filtering and matched-filter correlation. For new designs, note that newer Arria V and Cyclone V families offer improved security features and longer lifecycle support.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2AGX260EF29I5G — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2AGX260EF29I5 | EP2AGX260EF29I3N | EP2AGX260EF29C6N | EP2AGX190EF29I5G | EP2AGX125EF29I5G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Family | Arria II GX | Arria II GX | Arria II GX | Arria II GX | Arria II GX | Arria II GX |
| Logic Elements | 244188 | 244188 | 244188 | 244188 | 190000 (-22%) | 125000 (-49%) |
| Embedded Memory | 8.55 Mbit | 8.55 Mbit | 8.55 Mbit | 8.55 Mbit | 6.78 Mbit (-21%) | 4.84 Mbit (-43%) |
| 18x18 Multipliers | 1026 | 1026 | 1026 | 1026 | 812 (-21%) | 576 (-44%) |
| Maximum User I/Os | 372 | 372 | 372 | 372 | 372 | 372 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Transceiver Channels | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) | 12 (up to 6.375 Gbps) |
Diferenciadores clave
- Highest density Arria II GX in the EF29 780-ball package (frente a EP2AGX190EF29I5G)
- Industrial temperature grade with full density (frente a EP2AGX260EF29C6N)
- 12 high-speed transceivers included (frente a EP4CE55F23I7N (Cyclone IV E))
Notas de diseño
The 780-FBGA package combined with 244K logic elements and 12 transceivers can dissipate 8-15W typical in dense transceiver-driven designs. Use at least 4 layers with a dedicated internal ground/power plane beneath the FPGA. Provide a thermal pad or copper pour on top-side of the PCB connected via thermal vias to inner planes. Estimated junction-to-ambient thermal resistance for a properly designed 4-layer PCB with 50x50 mm copper area is 8-12 C/W; verify using the Arria II GX thermal model in Quartus II PowerPlay analyzer.
Decoupling capacitor placement is critical for FPGAs at this density. Place 0.1 uF X7R ceramic capacitors every 5 mm around the perimeter of the BGA, plus bulk 10-47 uF tantalum or polymer capacitors near each power rail. Per the Arria II GX datasheet, the device requires separate decoupling for core (VCC), I/O banks (VCCIO), transceiver (VCCA, VCCH, VCCR), and auxiliary (VCCAUX) supplies. Use a 1.0 mm pitch BGA fanout with via-in-pad for inner rows where signal escape is constrained.
Do not assume all 372 user I/Os are simultaneously available - the actual I/O count depends on the package variant, transceiver usage, and which I/O standards are selected. According to the Arria II GX datasheet, transceiver channels consume specific I/O banks, reducing available user I/Os when transceivers are enabled. Use Quartus II pin planner early in the design to verify I/O assignment feasibility before PCB layout commit. Also verify MSL (Moisture Sensitivity Level) handling - the FBGA package typically requires MSL3 bake-out before reflow soldering.
Información de cumplimiento
RoHS compliant and lead-free per Intel/Altera product documentation. AEC-Q100 is not applicable for FPGAs - this is not an automotive-qualified part. Conflict minerals compliance reported by Intel.
