EP2AGX65DF29I5N - Arria II GX FPGA, 60K LE, 780-BGA | Intel
N.º de pieza: EP2AGX65DF29I5N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1285 | $1.285,00 |
| 10 | $1210 | $12.100,00 |
| 100 | $1145 | $114.500,00 |
| 500 | $1080 | $540.000,00 |
| 1.000 | $1015 | $1.015.000,00 |
EP2AGX65DF29I5N Descripción general
An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC belonging to the broader semiconductor hierarchy of integrated circuits. FPGAs contain an array of configurable logic blocks (CLBs), embedded memory blocks, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. Unlike an ASIC, an FPGA's function is defined post-manufacture by loading a user bitstream, enabling rapid prototyping, hardware reconfiguration, and lower NRE costs. FPGAs are commonly used as a bridge between a CPU/MCU and high-speed I/O, or as standalone processing engines for digital signal processing, packet inspection, and protocol bridging.
Key features of the EP2AGX65DF29I5N include 2,530 Logic Array Blocks (LABs), 12 dedicated transceivers, 8-input adaptive logic modules (ALMs), and integrated hard IP for PCIe Gen1 and Gen2, multi-gigabit transceivers, and external memory interfaces. The device supports DDR3, DDR2, DDR, and QDRII+ memory controllers with PHY, and offers hardened PCI Express Gen1 (x1/x4/x8) and Gen2 (x1/x4) endpoints for direct system connectivity without consuming fabric logic. Configuration is supported via fast passive parallel, passive serial, JTAG, and AES-256 encrypted bitstreams.
The architecture is optimized for low-power, mid-density designs that require 3.125 Gbps to 6.375 Gbps serial links with deterministic latency, common in broadcast video, military communications, and test & measurement. Compared with higher-end Stratix devices, the Arria II GX balances transceiver performance with cost efficiency, offering a compelling power/performance ratio for cost-sensitive applications.
Typical applications include HD-SDI video routers, wireless backhaul, 3G/4G baseband processing, software-defined radio (SDR), PCI Express endpoint cards, and high-speed serial interface bridging. Industrial temperature grade (-40C to +100C) and the 780-BGA package make the EP2AGX65DF29I5N suitable for harsh-environment embedded computing.
When designing with this device, ensure proper power sequencing of the 0.9 V core, 1.5 V transceiver, and 2.5 V/3.3 V I/O rails, and provide matched impedance routing for the high-speed serial links. PCB layout must follow Intel's BGA escape and decoupling guidelines to maintain signal integrity at multi-gigabit data rates.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone, giving procurement and engineering teams a consolidated reference for the EP2AGX65DF29I5N.
Alternativas directas para EP2AGX65DF29I5N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2AGX65DF29I5N (mismo factor de forma y huella) — difiere en Package, Speed Grade, Mounting Type, Operating Temperature, Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2AGX65DF29I5G
✅ Sustitución directa✓ En stock
$689.49 / unidad
Ver hoja de datos →EP2AGX65DF29I5
✅ Sustitución directa✓ En stock
$1980 / unidad
Ver hoja de datos →EP2AGX65DF29I3N
✅ Sustitución directa✓ En stock
$175 / unidad
Ver hoja de datos →EP2AGX65DF29C6N
✅ Sustitución directa✓ En stock
$218.75 / unidad
Ver hoja de datos →EP2AGX65DF29C6G
✅ Sustitución directa✓ En stock
$245.3 / unidad
Ver hoja de datos →EP2AGX45DF29I5N
✅ Sustitución directa✓ En stock
$318 / unidad
Ver hoja de datos →EP2AGX65DF29I5N Valores máximos y características eléctricas
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Embedded Memory (bits) | 5,371,904 |
| Logic Array Blocks (LABs) | 2,530 |
| User I/Os | 364 |
| Transceivers | 12 |
| Max Transceiver Data Rate | 6.375 Gbps |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Encapsulado | 780-Ball FCBGA |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Hard PCIe IP | PCIe Gen1 x1/x4/x8, Gen2 x1/x4 |
| Memory Interface Support | DDR3, DDR2, DDR, QDRII+ with PHY |
| Configuration Modes | FPP, PS, JTAG, AES-256 |
| Estado RoHS | Compliant |
Guía de configuración de pines de EP2AGX65DF29I5N 780-ball fcbga
Configuración de pines para EP2AGX65DF29I5N (encapsulado 780-ball fcbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2AGX65DF29I5N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2AGX65DF29I5N es adecuado para 6 aplicacións: HD-SDI / 3G-SDI Video Router, Wireless Backhaul Modem, Software Defined Radio (SDR), PCI Express Endpoint Card, Industrial Machine Vision, Test & Measurement Instrumentation.
HD-SDI / 3G-SDI Video Router
The EP2AGX65DF29I5N is well matched to HD-SDI and 3G-SDI video routers, where it must accept and re-transmit multiple SMPTE 259M, 292M, and 424M serial streams simultaneously. The 12 transceivers support 270 Mbps, 1.485 Gbps, and 2.97 Gbps cleanly, while the 5,371,904 bits of embedded RAM provide line buffers and frame stores for de-embedding ancillary data. The 60K logic elements handle matrix switching, EDH processing, and audio multiplexing. Compared with an ASIC, the Arria II GX allows late-stage feature changes and conditional logic updates without respin.
Recomendado
Wireless Backhaul Modem
For wireless backhaul modems and 3G/4G baseband processing, the EP2AGX65DF29I5N delivers 12 multi-gigabit transceivers up to 6.375 Gbps, sufficient for CPRI links to radio units and digital front-end processing. The 60K logic elements run Turbo/Convolutional decoding and digital predistortion, while the embedded memory buffers symbol-rate samples between antenna and baseband DSP. Industrial -40C to +100C temperature grade and hardened PCIe Gen2 IP for backplane connectivity to host processors.
Recomendado
Software Defined Radio (SDR)
The EP2AGX65DF29I5N is widely used in software-defined radio platforms, where its 12 transceivers down/up-convert multiple IF bands at rates up to 6.375 Gbps. The 40 nm process and 0.9 V core keep power low enough for field-deployed SDR, while the 5.3 Mbit embedded memory stages I/Q samples between DDC/DUC and the host processor. Engineers leverage the 364 user I/Os to interface to ADC/DAC subcards, and the 780-BGA package provides robust mechanical stability on ruggedized enclosures.
Recomendado
PCI Express Endpoint Card
The EP2AGX65DF29I5N integrates a hardened PCI Express Gen1 (x1/x4/x8) and Gen2 (x1/x4) endpoint, eliminating the need to consume fabric logic for PCIe implementation. For frame grabbers, data acquisition, and protocol bridge cards, the FPGA provides user I/O and DSP logic while the PCIe IP manages DMA transfers at up to 5 Gbps per lane. The 780-BGA F29 package supports the 12 transceiver channels used for PCIe x4 plus additional external serial links like SFP+ for test and measurement endpoints.
Recomendado
Industrial Machine Vision
In machine vision systems the EP2AGX65DF29I5N aggregates image data from multiple Camera Link, CoaXPress, or GigE Vision streams. Its 12 transceivers support 5+ Gbps CoaXPress downlinks, the embedded memory buffers full frames, and 60K logic elements execute image preprocessing, defect detection, and trigger logic. The -40C to +100C industrial temperature grade supports factory floor deployment, and the 780-BGA package withstands high-vibration mounting on robotic arms.
Recomendado
Test & Measurement Instrumentation
The EP2AGX65DF29I5N is used in oscilloscopes, logic analyzers, and protocol testers that require high-speed serial bus monitoring at 6.375 Gbps. The 12 transceivers probe multiple lanes of SATA, USB 3.0, PCIe Gen2, and DisplayPort, while the embedded 5.3 Mbit memory captures protocol bursts. The 60K logic elements handle pattern matching, state analysis, and trigger generation. Industrial temperature grade supports portable field testers used in outdoor cellular network commissioning.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2AGX65DF29I5N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2AGX65DF29I5G | EP2AGX65DF29I5 | EP2AGX65DF29I3N | EP2AGX65DF29C6N | EP2AGX65DF29C6G | EP2AGX45DF29I5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FCBGA (F29) | 780-FCBGA (F29) - same | 780-FCBGA (F29) - same | 780-FCBGA (F29) - same | 780-FCBGA (F29) - same | 780-FCBGA (F29) - same | 780-FCBGA (F29) - same |
| Logic Elements | 60,214 | 60,214 (same die) | 60,214 (same die) | 60,214 (same die) | 60,214 (same die) | 60,214 (same die) | 42,900 (-29%) |
| Embedded Memory (bits) | 5,371,904 | 5,371,904 (same die) | 5,371,904 (same die) | 5,371,904 (same die) | 5,371,904 (same die) | 5,371,904 (same die) | 4,292,480 (-20%) |
| Transceivers | 12 | 12 | 12 | 12 | 12 | 12 | 12 (same transceiver count, different logic capacity) |
| User I/Os | 364 | 364 | 364 | 364 | 364 | 364 | 364 |
| Speed Grade | 5 | 5 (same) | 5 (same) | 3 (slower, easier timing closure) | 6 (faster Fmax) | 6 (faster Fmax) | 5 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
Diferenciadores clave
- Industrial temperature grade with speed grade 5 (frente a EP2AGX65DF29C6N)
- Higher logic capacity within the same 780-FCBGA footprint (frente a EP2AGX45DF29I5N)
- Faster speed grade for timing-critical applications (frente a EP2AGX65DF29I3N)
Notas de diseño
The EP2AGX65DF29I5N requires multiple supply rails: VCC (0.9 V core), VCCPT (1.5 V), VCCAUX/VCCAUX_RX (2.5 V), VCCIO (1.5/1.8/2.5/3.3 V per bank), and the transceiver VCCH_GXB/VCCR_GXB (1.5 V/1.2 V). Intel mandates a power-on sequence of VCCPT first, then VCC/VCCAUX/VCCIO, then VCCH_GXB/VCCR_GXB to prevent device damage. Decoupling with 100 nF near every power pin, plus 10 uF bulk capacitors at supply leads, is recommended. Estimated: at full transceiver utilization the 60K-LE core can draw 4-6 W from VCC alone, requiring thermal management in enclosed enclosures.
Estimated: at 100% transceiver utilization, 60K LEs clocked at 250 MHz, and DDR3 interface active, total power consumption reaches approximately 8-10 W. The 780-FCBGA package's 0.5 mm ball pitch exposes a thermal pad underneath that should be soldered to a 6-layer PCB with a 4x4 thermal via array for heat evacuation. Without proper thermal management, junction temperature can exceed 100C, triggering thermal protection. Forced airflow or a heat spreader is recommended for production deployments at full performance.
Place decoupling capacitors within 50 mils of each power pin using the smallest case size (0201 or 0402). The 780-FCBGA escape requires 4-6 routing layers with 0.8-1.0 mil trace width for matched impedance. Transceiver channels need 100-ohm differential routing, length-matched within 5 mils for the TX and RX pairs of each lane. Reference Intel's Arria II GX PCB Design Guidelines (AN 521) for the exact stackup, via pattern, and length-matching rules. Power plane cuts around BGA should be avoided.
Three common pitfalls in EP2AGX65DF29I5N designs: (1) using wrong configuration mode - FPP x32 requires an external flash, while PS uses a single data line, and these are not interchangeable without recompile. (2) Mixing transceiver reference clock frequencies without recalculating VCO settings - each GXB block expects a specific refclk range. (3) Forgetting to assert the nSTATUS and CONFIG_DONE pull-ups to MSEL[3:0]-defined values, which can cause config failure. Always verify MSEL strap values against Quartus II Device Programming recommendations.
Información de cumplimiento
RoHS and lead-free per Intel product declaration. Industrial temperature grade is not AEC-Q100 qualified. Refer to the EP2AGX65DF29I5G suffix for Pb-free confirmation.
