EP2C8F256C6N - Cyclone II FPGA, 8K LEs, 256-FBGA | Altera
N.º de pieza: EP2C8F256C6N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $42.88 | $42,88 |
| 10 | $39.42 | $394,20 |
| 100 | $36.5 | $3.650,00 |
| 500 | $33.95 | $16.975,00 |
| 1.000 | $31.2 | $31.200,00 |
EP2C8F256C6N Descripción general
A Field-Programmable Gate Array is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all of which can be re-defined by the user after manufacture via a hardware description language (HDL) bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) and bridge the gap between fixed-function ASICs and microcontrollers, offering parallelism, deterministic timing, and the ability to implement custom data-path, glue-logic, and DSP functions in a single device.
Key features of the EP2C8F256C6N include 18 embedded 18x18 multipliers for DSP, up to 250 MHz internal operation, support for DDR/DDR2/QDRII memory interfaces via dedicated PHY, four phase-locked loops (PLLs), and a 1.2V core supply. The device is supported by the Quartus II design suite and is shipping in volume today, although Intel has since launched newer Cyclone families (Cyclone III/IV/V) as drop-in successors. Engineers migrating from Cyclone II typically move to Cyclone IV E for the closest functional compatibility and 1.2V core voltage.
Typical applications include industrial control and factory automation, video surveillance and image processing, automotive infotainment and driver-assistance, telecommunications line cards, consumer electronics glue logic, and low-volume ASIC prototyping. The 182 user I/Os make it well suited for bridging multiple bus standards (PCI, I2C, SPI, parallel video) in a single device.
When designing with this device, verify that the 256-FBGA PCB land pattern is already in your library and confirm the I/O bank voltage (3.3V LVCMOS/LVTTL) matches your downstream memory and peripheral interfaces. Plan for a JTAG header (10-pin or 20-pin) for in-system programming via the Quartus II Programmer. Note that the -C6 speed grade (6 = slowest commercial) limits Fmax compared to -C7 or -C8 variants.
This page synthesizes distributor pricing, drop-in compatible variants, and design considerations curated from the manufacturer datasheet and authorized distributor listings to help engineers shorten the component-selection cycle.
Alternativas directas para EP2C8F256C6N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2C8F256C6N (mismo factor de forma y huella) — difiere en Package, RoHS Status, Speed Grade, Process Technology, Configuration Modes.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2C8F256C7N
✅ Sustitución directa✓ En stock
$8.31 / unidad
Ver hoja de datos →EP2C8F256C8
✅ Sustitución directa✓ En stock
$28.4 / unidad
Ver hoja de datos →EP2C8F256C6
✅ Sustitución directa✓ En stock
$8.1 / unidad
Ver hoja de datos →EP3C8F256C6N
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EP2C8AF256I8N
✅ Sustitución directa✓ En stock
$21.4 / unidad
Ver hoja de datos →EP2C8F256C6N Valores máximos y características eléctricas
| Series | Cyclone II |
| Manufacturer | Altera (Intel PSG) |
| Logic Elements (LEs) | 8,256 |
| Total RAM Bits | 165,888 |
| User I/O Count | 182 |
| Number of Logic Array Blocks (LABs) | 516 |
| Embedded 18x18 Multipliers | 18 |
| Number of PLLs | 4 |
| Encapsulado | 256-LBGA (FineLine BGA), 17x17 mm |
| Speed Grade | C6 |
| Operating Temperature (Commercial) | 0C to +85C |
| Core Voltage | 1.2 V |
| Process Node | 90 nm |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Guía de configuración de pines de EP2C8F256C6N 256-lbga (fineline bga), 17x17 mm
Configuración de pines para EP2C8F256C6N (encapsulado 256-lbga (fineline bga), 17x17 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2C8F256C6N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2C8F256C6N es adecuado para 6 aplicacións: Industrial Control and Factory Automation, Video Surveillance and Image Processing, Automotive Infotainment and Driver Assistance, Telecommunications Line Cards, Consumer Electronics Glue Logic, ASIC Prototyping and Emulation.
Industrial Control and Factory Automation
The EP2C8F256C6N's 8,256 logic elements and 182 user I/Os make it well suited for industrial PLC and factory-automation controllers where multiple fieldbus protocols (Modbus, Profibus, EtherCAT slave) must be bridged simultaneously. The 18 embedded 18x18 multipliers accelerate real-time PID loops and motor-control math, while 165,888 bits of embedded RAM buffer sensor-data streams without requiring external SRAM. The 256-FBGA package exposes 4 PLLs for clean timing of multi-rate industrial networks, and the 1.2V core plus LVCMOS 3.3V I/O banks match typical 24V-rail-derived industrial power trees.
Recomendado
Video Surveillance and Image Processing
With 18 dedicated 18x18 multipliers and 165,888 bits of embedded block RAM, the EP2C8F256C6N can implement real-time video-processing pipelines (Sobel edge detection, motion estimation, JPEG encoding) at CIF/D1 resolutions. The 182 user I/Os accommodate parallel ITU-R BT.656 / BT.1120 video buses plus DDR2 frame-buffer memory, and the dedicated DDR/DDR2 PHY offloads memory-controller logic from the FPGA fabric. Quartus II Megafunction libraries (altsyncram, altmult_add) accelerate BRAM and multiplier instantiation.
Recomendado
Automotive Infotainment and Driver Assistance
The EP2C8F256C6N's 182 I/Os support multiple automotive buses (CAN, LIN, MediaLB, MOST) plus LVDS display panels, while the embedded multipliers accelerate rear-view camera overlays and basic lane-departure-warning algorithms. The 256-FBGA package fits the typical 35x35 mm head-unit PCB envelope, and the 4 PLLs generate independent clocks for camera, audio, and display subsystems. Note: for under-hood AEC-Q100 applications, designers typically migrate to Cyclone IV E with -I8 industrial temperature grade.
Recomendado
Telecommunications Line Cards
In telecom line cards, the EP2C8F256C6N serves as a glue-logic and protocol-bridge device between network processors, SERDES PHYs, and TDM time-slot crossbars. The 182 user I/Os accommodate 4-bit parallel RapidIO or UTOPIA-Level-3 interfaces, while 165,888 bits of RAM buffer packet headers and lookup tables. The dedicated DDR2 PHY supports up to 333 MHz external memory for queuing, and 4 PLLs synthesize multiple reference-clock domains cleanly.
Recomendado
Consumer Electronics Glue Logic
Cost-sensitive consumer products (set-top boxes, e-readers, printers, smart appliances) often need flexible glue logic that traditional ASSPs cannot provide. The EP2C8F256C6N's 8,256 LEs easily handle HDMI CEC, I2C/SPI bridging, keyboard-scan matrices, and small LCD-controller functions, while the 182 I/Os absorb diverse board-level buses. The 256-FBGA's 17x17 mm footprint fits modern compact enclosures, and the 90 nm process keeps die cost low for high-volume SKUs.
Recomendado
ASIC Prototyping and Emulation
The EP2C8F256C6N serves as an affordable ASIC-prototyping vehicle for designs in the 5K-8K LE range, with 165,888 bits of RAM emulating register files and 18 multipliers prototyping DSP blocks. The 256-FBGA package exposes JTAG for in-system bitstream loading via Quartus II Programmer. Engineers can validate RTL, clock-tree structure, and I/O protocol behavior months before tap-out, dramatically reducing ASIC re-spin risk. For larger ASIC emulations, designers can stack multiple Cyclone II devices in a chain.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2C8F256C6N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2C8F256C7N | EP2C8F256C8 | EP2C8F256C6 | EP3C8F256C6N | EP2C8AF256I8N |
|---|---|---|---|---|---|---|
| Package | 256-LBGA | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same |
| Brand | Altera (Intel PSG) | Altera | Altera | Altera | Altera | Altera |
| Family | Cyclone II | Cyclone II | Cyclone II | Cyclone II | Cyclone III | Cyclone II |
| Speed Grade | C6 | C7 | C8 | C6 | C6 | I8 (industrial) |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 |
| Total RAM Bits | 165,888 | 165,888 | 165,888 | 165,888 | 165,888 | 165,888 |
| User I/Os | 182 | 182 | 182 | 182 | 182 | 182 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Unit Price (qty 1) | $42.88 | Slightly higher (~+5%) | Slightly higher (~+10%) | Same | Slightly lower (Cyclone III cost reduction) | Higher (industrial-grade premium) |
Diferenciadores clave
- Direct on-board upgrade path to faster speed grades (frente a EP2C8F256C7N / EP2C8F256C8)
- Industrial-temperature variant available in identical footprint (frente a EP2C8AF256I8N)
- Cyclone III successor with lower power in same footprint (frente a EP3C8F256C6N)
Notas de diseño
The EP2C8F256C6N requires a clean 1.2V core supply with peak current up to approximately 500 mA during configuration and high-utilization operation. Use a dedicated LDO (e.g., TI TPS7A4533) with at least 10 uF bulk + 0.1 uF bypass on each VCCINT ball, and 4.7 uF + 0.1 uF on each VCCIO bank. Decoupling placement should keep each capacitor within 100 mils of its corresponding power pin.
Estimated: at 250 MHz and typical 80% resource utilization, the EP2C8F256C6N dissipates approximately 0.5-0.8 W through the 256-FBGA package. The 17x17 mm BGA land with 4-layer FR4 PCB provides adequate thermal dissipation for commercial-temperature operation. For industrial-grade designs running at junction temperatures above 85C, add thermal vias under the central BGA balls and consider forced-air cooling.
The 256-FBGA uses a 1.0 mm ball pitch; PCB design must use NSMD (non-solder-mask-defined) pads with 0.45 mm diameter and laser-drilled or micro-via fan-out. Maintain at least 4 ground balls adjacent to each VCCIO bank to minimize simultaneous-switching noise. Use impedance-controlled traces (50 ohm single-ended, 100 ohm differential) for LVDS or DDR signals, and avoid routing signal traces under the BGA ball array.
Common pitfalls with the EP2C8F256C6N include: (1) confusing -C6 (slowest commercial) with -C8 (fastest commercial) when Fmax margin is critical; (2) ignoring I/O bank voltage grouping - VCCIO must match the downstream device (3.3V LVCMOS for most peripherals); (3) failing to assign a configuration mode (AS, PS, JTAG) correctly in the Quartus II Device Options; (4) overlooking the nCONFIG and nSTATUS pull-up resistors which are required for proper configuration.
Información de cumplimiento
RoHS compliant per Altera/Intel product page. Cyclone II family is not AEC-Q100 qualified; for automotive AEC-Q100 designs consider Cyclone IV E with industrial temperature grade.
