EP2S130F1508I4N - Stratix II FPGA, 132K LE, 1508-FBGA | Intel
N.º de pieza: EP2S130F1508I4N ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1750 | $17.500,00 |
| 100 | $1620 | $162.000,00 |
| 500 | $1495 | $747.500,00 |
| 1.000 | $1390 | $1.390.000,00 |
EP2S130F1508I4N Descripción general
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor containing an array of configurable logic blocks (CLBs/LABs), programmable routing, and dedicated hard-IP blocks such as memory, DSP, and high-speed transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which in turn belong to logic ICs and ultimately the integrated circuits (semiconductors) hierarchy. Stratix II devices specifically target high-performance digital signal processing, telecom, and ASIC-prototyping workloads where the combination of high logic density, abundant embedded memory, and a generous user-I/O count is essential.
Key features of the EP2S130F1508I4N include 12 on-chip PLLs for clock synthesis and skew management, dedicated 18-bit x 18-bit hardware multipliers arranged as DSP blocks, support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and a hard Nios II embedded processor soft-core option. The 1508-FCBGA package provides a large thermal pad for low thermal resistance, while the 1126 user I/Os offer ample connectivity for parallel memory buses, high-speed serial links via serializer/deserializer (SERDES) on companion Stratix II GX devices, and external PHY interfaces.
Architecturally, the Stratix II family introduced the Adaptive Logic Module (ALM) - an 8-input fracturable LUT that delivers approximately 40 percent higher performance and 25 percent lower logic area than previous generations. Combined with the TriMatrix embedded memory architecture (three distinct RAM block sizes), this makes the EP2S130 the highest-density Stratix II variant, suitable for prototyping mid-to-large ASIC designs, high-end DSP pipelines, multi-channel telecom baseband processing, and high-throughput data acquisition systems.
Typical applications include ASIC prototyping, multi-channel telecom infrastructure (SDH/SONET, OTN), high-speed data acquisition, software-defined radio (SDR) baseband processing, and high-end video/image processing systems. Designers choose this part when maximum logic density and embedded memory in a single device outweigh the need for the latest transceivers.
When designing with the EP2S130F1508I4N, ensure a 4-layer or better PCB with continuous power planes and adequate decoupling on the 1.2 V VCCINT and 3.3 V VCCIO rails - the device draws significant inrush current during configuration. Industrial-grade temperature (the I4 suffix) is verified for -40C to +100C ambient operation.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and parametric comparisons that complement the Intel Stratix II Device Handbook, helping engineers source, qualify, and select the right Stratix II variant for production and prototype builds.
Alternativas directas para EP2S130F1508I4N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2S130F1508I4N (mismo factor de forma y huella) — difiere en Package, Speed Grade, Operating Temperature, RoHS Status, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2S130F1508I4
✅ Sustitución directa✓ En stock
$3950 / unidad
Ver hoja de datos →EP2S130F1508C5N
✅ Sustitución directa✓ En stock
$1390 / unidad
Ver hoja de datos →EP2S130F1508C4N
✅ Sustitución directa✓ En stock
$4435.83 / unidad
Ver hoja de datos →EP2S130F1508C5NRB
✅ Sustitución directa✓ En stock
$1990 / unidad
Ver hoja de datos →EP2S130F1508C5RB
✅ Sustitución directa✓ En stock
$2050 / unidad
Ver hoja de datos →EP2S130F1508I4N Valores máximos y características eléctricas
| Family | Stratix II |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Total RAM Bits | 6,747,840 |
| Total Embedded Memory | 6,474 Kbit (M512 + M4K + M-RAM) |
| User I/Os | 1126 |
| Maximum Internal Frequency | 717 MHz |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V |
| I/O Supply Voltage (VCCIO) | 1.5 V to 3.3 V |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Encapsulado | 1508-BBGA, FCBGA (40 x 40 mm, 1.0 mm pitch) |
| Tipo de montaje | Surface Mount (SMT) |
| Process Technology | 90 nm CMOS |
| Embedded Multipliers | 18-bit x 18-bit DSP blocks |
| PLLs | 12 |
| Estado RoHS | Compliant (lead-free) |
| Logic Family | CMOS |
| Temperature Grade | Industrial (I) |
Configuración de pines de EP2S130F1508I4N
| Pin Multiple | Bank 1-16 user I/O — 1126 user I/Os distributed in 16 I/O banks across the BGA perimeter |
| Pin Multiple | VCCINT — 1.2 V core supply balls (1.15 V to 1.25 V) |
| Pin Multiple | VCCIO — I/O supply balls (1.5 V to 3.3 V per bank) |
| Pin Multiple | VCCPD — 3.3 V pre-driver supply |
| Pin Multiple | VCCA — 2.5 V analog supply for PLLs and SERDES |
| Pin Multiple | VCCD_PLL — 1.2 V digital supply for PLL blocks |
| Pin Multiple | GND — Ground balls (majority of substrate ball count) |
| Pin Multiple | TCK/TMS/TDO/TDI — JTAG boundary-scan interface (per IEEE 1149.1) |
| Pin Multiple | MSEL[2..0] — Configuration mode select (AS/PS/JTAG) |
| Pin Multiple | nCONFIG / nSTATUS / CONF_DONE — Configuration control signals |
| Pin Multiple | DATA[7..0] — Configuration data (PS mode) |
| Pin Multiple | DCLK — Configuration clock |
Aplicaciones típicas
EP2S130F1508I4N es adecuado para 6 aplicacións: ASIC Prototyping, Telecom Baseband and SDH/SONET, High-Speed Data Acquisition, Software-Defined Radio (SDR) Baseband, High-End Video and Image Processing, Industrial Automation Controllers.
ASIC Prototyping
The EP2S130F1508I4N's 132,540 logic elements and 6,747,840 bits of TriMatrix embedded RAM make it ideal for ASIC prototyping of mid-to-large designs in the 6-7 M-gate range. Its 1126 user I/Os support full peripheral emulation including DDR/DDR2 memories, parallel busses, and external PHY interfaces. Compared to smaller Cyclone devices, the Stratix II family delivers approximately 40% better logic utilization via Adaptive Logic Modules (ALMs), letting designers map an entire ASIC partition onto a single FPGA. Power draw is significant (15-25 W typical) so a 4-layer PCB with continuous 1.2 V power planes and bulk decoupling near every VCCINT pin is mandatory.
Recomendado
Telecom Baseband and SDH/SONET
The 12 on-chip PLLs and 1126 user I/Os make the EP2S130F1508I4N suitable for telecom infrastructure such as SDH/SONET framers, OTN channel aggregators, and multi-channel baseband processing. With internal frequencies up to 717 MHz and ample DSP blocks (18-bit x 18-bit multipliers), it can implement QAM modulators, Viterbi decoders, and packet classifiers at line-rate. Industrial-grade -40C to +100C temperature range supports central-office and outdoor deployments. Companion transceivers (e.g., Stratix II GX variants) handle the SERDES layer when optical interfaces are required.
Recomendado
High-Speed Data Acquisition
The 1508-FCBGA EP2S130F1508I4N with its 1126 user I/Os and 6.7 Mbit embedded memory is well-matched to multi-channel data acquisition systems operating at hundreds of MSPS per channel. The TriMatrix memory architecture (M512/M4K/M-RAM) provides deterministic low-latency FIFO buffering between ADC samples and processing logic. Industrial-grade operation and a wide VCCIO range (1.5 V to 3.3 V) simplify interfacing to legacy LVTTL/LVCMOS ADC front-ends, while 18-bit x 18-bit DSP blocks enable per-channel decimation filters and FFT engines in real time.
Recomendado
Software-Defined Radio (SDR) Baseband
With 132K logic elements, 6.7 Mbit embedded memory, and 18-bit x 18-bit multipliers, the EP2S130F1508I4N provides the compute density required for SDR baseband processing of multiple simultaneous channels. Functions such as channelization (polyphase filter banks), demodulation, and MIMO matrix decomposition can be implemented directly in the FPGA fabric. Industrial temperature grade supports tactical, vehicular, and outdoor SDR deployments. The 12 PLLs generate the multiple clock domains required for ADC sampling, DAC update, and DSP blocks.
Recomendado
High-End Video and Image Processing
The 1126 user I/Os and 6.7 Mbit embedded RAM make the EP2S130F1508I4N ideal for multi-stream HD/4K video processing systems, real-time video analytics, and broadcast encoding. The TriMatrix memory architecture enables line buffers and frame buffers large enough to support 1080p/60 pipelines. Industrial-grade temperature supports indoor/outdoor signage and surveillance installations. Internal DSP blocks accelerate motion estimation, scaling, and color-space conversion at pixel clock rates up to 200 MHz without external DSP chips.
Recomendado
Industrial Automation Controllers
The EP2S130F1508I4N suits large industrial automation controllers that combine deterministic real-time logic with multi-protocol industrial networking. 1126 user I/Os accommodate parallel backplanes, encoder counters, and multi-axis servo control, while 132K LEs support complex soft-CPU clusters (Nios II cores) running deterministic control loops. Industrial-grade -40C to +100C operation handles factory floor thermal stress, and the 1.2 V core supply keeps controller power budgets manageable. The 1508-FCBGA package requires BGA-grade PCB assembly but provides excellent thermal dissipation for continuous operation.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2S130F1508I4N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2S130F1508I4 | EP2S130F1508C5N | EP2S130F1508C4N | EP2S130F1508C5NRB | EP2S130F1508C5RB |
|---|---|---|---|---|---|---|
| Package | 1508-BBGA, FCBGA (40x40 mm, 1.0 mm pitch) | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same |
| Brand | Intel (formerly Altera) | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand | Intel - same brand |
| Logic Elements | 132,540 | 132,540 - same | 132,540 - same | 132,540 - same | 132,540 - same | 132,540 - same |
| Total RAM Bits | 6,747,840 | 6,747,840 - same | 6,747,840 - same | 6,747,840 - same | 6,747,840 - same | 6,747,840 - same |
| User I/Os | 1126 | 1126 - same | 1126 - same | 1126 - same | 1126 - same | 1126 - same |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) - same | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -4 (I4 industrial) | -4 (industrial) | -5 (slower, commercial) | -4 (same speed, commercial) | -5 (slower, commercial) | -5 (slower, commercial) |
| RoHS / Lead-free | Yes (N suffix, RoHS compliant) | No (SnPb terminal) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (SnPb, RB suffix) |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
| Packaging Format | Tray (I4 industrial, N RoHS) | Tray (SnPb terminal) | Tray (RoHS) | Tray (RoHS) | Reel-pack (RoHS) | Reel-pack (SnPb) |
Diferenciadores clave
- Highest logic density in the Stratix II family (frente a EP2S130F1508C5N)
- RoHS-compliant lead-free terminal finish (frente a EP2S130F1508I4)
- Faster speed grade versus commercial -5 (frente a EP2S130F1508C5N)
- 1126 user I/Os - higher than any Cyclone II variant (frente a EP2C70F896I8N)
- 12 PLLs for complex clocking (frente a EP2C50F484I8N)
Notas de diseño
Estimated: The EP2S130F1508I4N draws approximately 1.0-1.5 A on VCCINT (1.2 V) plus 0.3-0.8 A on VCCIO (3.3 V) during configuration and typical user-mode operation, equating to 15-25 W total power depending on logic utilization and toggle rate. Decoupling must include 0.1 uF and 10 uF MLCCs within 5 mm of every VCCINT pin plus 1 uF bulk capacitors per VCCIO bank. Use a 4-layer PCB with continuous 1.2 V and 3.3 V power planes and a low-impedance ground plane to meet inrush during configuration. Reference Intel AN 258: Power Design for Stratix II Devices.
Estimated: With theta_JA around 14 C/W for the 1508-FCBGA on a 4-layer JEDEC test board, the EP2S130F1508I4N can dissipate roughly 7 W at 100C ambient before reaching 100C junction. Above this, an external heatsink with thermal interface material and forced airflow (200-400 LFM) is required. Industrial-grade operation requires junction temperature stays below 100C; ensure a thermal pad on the underside of the BGA is soldered to a copper pour on the PCB for heat removal.
BGA breakout on the 1508-FCBGA with 1.0 mm pitch requires 0.4 mm via-in-pad with 0.2 mm/0.3 mm trace/space to escape 4-5 mm of inner-row balls. Stagger microvias through 4-6 layers for full escape; reference Intel AN 114: BGA PCB Design Guidelines. Use 0.5 mm microvia aspect ratio with high-Tg FR-4 (Tg > 170C) or low-loss laminate for signal integrity on high-speed LVDS pairs. Ground-pour stitching vias every 3-5 mm around the BGA perimeter to control impedance and EMI.
Do not leave MSEL[2..0] floating - they must be tied to VCCPD through a 4.7 kohm resistor or directly to VCCPD/GND to select Active Serial (AS), Passive Serial (PS), or JTAG configuration mode. Configuration will fail silently if MSEL drifts. Always include a 100 ohm series damping resistor on the TCK line and a 10 kohm pull-up on nCONFIG. Reference Intel AN 322: Configuring Stratix II Devices for production board bring-up.
Differential pair length matching to within 150 ps (about 25 mm on FR-4) is required for LVDS interfaces to maintain 50 ps of skew at 717 MHz internal frequency. Use a 100 ohm differential impedance with 50 ohm single-ended via the Altera PCB impedance calculator. Reference the Stratix II Device Handbook section on High-Speed I/O Interface Design for layout guidelines for DDR/DDR2 memory controller channels.
Información de cumplimiento
RoHS compliant per the N suffix in part number; lead-free matte-Sn terminal finish. Not AEC-Q100 qualified (FPGAs typically are not). REACH compliance per Intel product declarations.
