EP2SGX90EF1152C4 - 90,960-Cell Stratix II GX FPGA
N.º de pieza: EP2SGX90EF1152C4 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1250 | $1.250,00 |
| 10 | $1180 | $11.800,00 |
| 100 | $1090 | $109.000,00 |
| 500 | $980 | $490.000,00 |
| 1.000 | $890 | $890.000,00 |
EP2SGX90EF1152C4 Descripción general
A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic, interconnect, memory, and I/O resources. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, which are used to implement digital processing, interface bridging, control, and protocol functions. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing. The Stratix II GX family adds high-speed transceiver-oriented functionality to the programmable-logic architecture, while the exact transceiver count and electrical characteristics must be confirmed from the complete manufacturer documentation.
The principal verified features are 90,960 cells, 558 I/O, 1.2 V technology supply, 90 nm process technology, and 1152-ball surface-mount packaging. The reported maximum frequency is 732.1 MHz in one source and 717 MHz in another source; therefore, the discrepancy is retained rather than reconciled by assumption. The device also appears in verified distributor data as a field-programmable gate array with 4,548 LABs. Its large logic capacity makes it suitable for parallel datapaths, multi-channel interface aggregation, and systems requiring configurable control and processing blocks.
The architecture combines programmable logic fabric with package-level I/O resources and is designed for high-density digital implementation. The 90 nm process supports a substantial logic-cell count while the 1.2 V supply designation provides a defined electrical boundary for system power planning. The available search results confirm the device family, cell count, process technology, frequency figures, and package type, but do not provide complete transceiver specifications, configuration-memory details, operating-temperature grades, or absolute maximum ratings.
Typical applications include communications infrastructure, industrial automation, high-speed test equipment, and embedded systems that require configurable digital processing. The 558 I/O resources support multiple parallel interfaces, while the 90,960-cell capacity can accommodate large state machines, protocol-processing logic, and data-path functions. The FC-FBGA package requires careful ball mapping, controlled-impedance routing, and thorough signal-integrity review during PCB design.
Designers should obtain the complete manufacturer datasheet and verify the target speed grade, I/O bank restrictions, transceiver configuration, power sequencing, thermal limits, and package ball assignments before release. Because the supplied data contains conflicting frequency values and omits several device specifications, those parameters are not inferred. Pricing and stock should be confirmed with the distributor at the time of purchase, as availability may change rapidly.
This page synthesizes verified distributor and manufacturer-oriented search results, preserves conflicting frequency figures, identifies the confirmed Stratix II GX architecture and 1152-ball package, and provides application and sourcing context beyond a single catalog listing. It does not replace the manufacturer datasheet or a formal PCB-level qualification.
Alternativas directas para EP2SGX90EF1152C4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP2SGX90EF1152C4 (mismo factor de forma y huella) — difiere en Package, Speed Grade, Operating Temperature, RoHS Status, Total RAM Bits.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP2SGX90EF1152C3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1280 / unidad
Ver hoja de datos →EP2SGX90EF1152C3ES
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2050 / unidad
Ver hoja de datos →EP2SGX90EF1152C3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1180 / unidad
Ver hoja de datos →EP2SGX60EF1152C4
✅ Sustitución directa✓ En stock
$1067.86 / unidad
Ver hoja de datos →EP2SGX60EF1152C4N
✅ Sustitución directa✓ En stock
$1350 / unidad
Ver hoja de datos →EP2SGX90EF1152C4 Valores máximos y características eléctricas
| Product Type | Field Programmable Gate Array (FPGA) |
| Family | Stratix II GX |
| Logic Cells | 90960 cells |
| Logic Array Blocks | 4548 LABs |
| User I/O | 558 I/O |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Reported Maximum Frequency | 732.1 MHz |
| Alternate Reported Maximum Frequency | 717 MHz |
| Package Type | FC-FBGA |
| Package Pin Count | 1152 pins |
| Alternate Package Description | FBGA-1152 |
| Package Mounting | Surface Mount |
| Lead-Free Status | Lead free |
| Estado RoHS | RoHS Compliant |
Guía de configuración de pines de EP2SGX90EF1152C4 surface mount
Configuración de pines para EP2SGX90EF1152C4 (encapsulado surface mount). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP2SGX90EF1152C4.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP2SGX90EF1152C4 es adecuado para 6 aplicacións: Communications Infrastructure, Industrial Automation Controllers, High-Speed Test and Measurement, Embedded Data Processing, Legacy Digital Design Migration, Parallel Interface Aggregation.
Communications Infrastructure
EP2SGX90EF1152C4 is a plausible platform for communications infrastructure because the verified data identifies 90,960 logic cells, 558 user I/O, and Stratix II GX family positioning. The large programmable fabric can host protocol adaptation, framing, packet processing, control logic, and multi-channel interface management in one device. However, the supplied results do not specify transceiver count, supported line rates, reference-clock requirements, or channel configurations. Engineers should therefore treat the FPGA as a capacity candidate rather than a fully qualified communications component until the official datasheet confirms the exact high-speed resources and I/O-bank constraints.
Recomendado
Industrial Automation Controllers
EP2SGX90EF1152C4 can support industrial automation designs requiring many parallel control and monitoring paths. Its 558 verified user I/O resources are useful for motor-control interfaces, sensor aggregation, deterministic control state machines, and multiple field-bus bridges. The 90,960-cell fabric provides substantial room for timing, safety-sequence, protocol, and supervisory functions, while the 1.2 V technology supply gives designers a defined starting point for power-tree review. The supplied material does not provide industrial temperature qualification, I/O voltage ranges, or long-term availability commitments, so those items must be confirmed before deployment in factory equipment.
Recomendado
High-Speed Test and Measurement
EP2SGX90EF1152C4 may fit high-speed test and measurement equipment that needs parallel acquisition control, waveform sequencing, data formatting, and configurable timing logic. The 90,960-cell capacity can support multiple processing lanes, while 558 I/O can connect converters, trigger systems, clocks, and control peripherals. Search results report frequency values of 732.1 MHz and 717 MHz, but they do not define measurement bandwidth, internal clock limits, or speed-grade conditions. The FPGA should not be specified for a test bandwidth until the complete datasheet confirms the relevant timing, transceiver, and I/O performance.
Recomendado
Embedded Data Processing
EP2SGX90EF1152C4 is well suited to embedded systems that combine substantial programmable logic with numerous external interfaces. The 90,960-cell fabric can implement filters, state machines, packet inspection, sensor fusion preprocessing, and custom control accelerators. Its 558 I/O resources allow connection to memory, converters, communications controllers, and application-specific peripherals. The 90 nm process and 1.2 V technology supply provide the confirmed technology context, but no complete power, thermal, configuration, or memory-interface specifications are present in the supplied data. System designers must validate these details and the legacy toolchain before architecture commitment.
Recomendado
Legacy Digital Design Migration
EP2SGX90EF1152C4 is relevant to legacy digital design migration because it combines a high 90,960-cell capacity with a well-defined Stratix II GX family identity and a 1152-ball BGA package. Existing board designs can potentially retain the same package family, but migration still requires comparison of every ordering suffix, I/O assignment, power rail, clock, configuration signal, and timing constraint. The verified data does not provide a complete pin map or a formal replacement cross-reference, so migration should begin with the official package drawing and device documentation rather than a part-number-only substitution.
Recomendado
Parallel Interface Aggregation
EP2SGX90EF1152C4 can serve as a programmable aggregation point for systems with many parallel digital interfaces. The verified 558-I/O count provides a useful boundary for planning camera, sensor, memory, control, and communications connections, while the 90,960-cell fabric can perform format conversion, buffering, sequencing, and protocol bridging. Because the package is a 1152-ball FC-FBGA, signal integrity depends on correct escape routing, reference-plane continuity, and validated I/O-bank usage. The supplied data does not specify supported I/O standards, maximum toggling rates, or package ball assignments, so those constraints must come from the manufacturer datasheet before schematic release.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP2SGX90EF1152C4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP2SGX90EF1152C3N | EP2SGX90EF1152C3ES | EP2SGX90EF1152C3 | EP2SGX60EF1152C4 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | FC-FBGA / FBGA-1152 | FBGA-1152 | FBGA-1152 | FBGA-1152 | FBGA-1152 |
Diferenciadores clave
- Higher confirmed logic-cell capacity than the 60-series family listings (frente a EP2SGX60EF1152C4)
- Large confirmed user-I/O resource count (frente a EP2SGX90EF1152C3N)
- Stratix II GX positioning for configurable high-density logic (frente a EP2S90F1508C5N)
Notas de diseño
Use the official 1152-ball FC-FBGA land pattern and ball map as the layout source of truth. The verified package description confirms 1152 terminals but does not provide complete pin assignments. Confirm power, ground, configuration, clock, I/O, and high-speed ball locations before schematic capture. Maintain short power connections, continuous reference planes, and controlled-impedance escapes. Validate the selected footprint against the assembly house’s BGA capability and the package drawing before fabrication.
The supplied data identifies a 1.2 V technology supply, but it does not provide the complete voltage rails, tolerances, sequencing requirements, current limits, or power-up behavior. Do not design a production power tree from the 1.2 V figure alone. Obtain the manufacturer’s recommended operating conditions and decoupling guidance, then calculate worst-case current from the selected configuration, clocking, I/O activity, and enabled functional blocks. Add local bulk and high-frequency decoupling according to the official reference design.
No thermal resistance, junction-temperature range, or power-consumption specification is present in the verified data. A junction-temperature estimate is therefore not valid. Request the device thermal report, estimate worst-case dissipation after design implementation, and define airflow, copper spreading, and board temperature limits from the resulting requirement. Because the package is a dense 1152-ball FC-FBGA, thermal validation should include the assembled PCB, nearby power components, enclosure conditions, and intended ambient range.
Do not infer pin compatibility from the EP2SGX family name or from a matching 1152-ball package. The supplied cross-reference results do not confirm that the listed alternatives have identical ballouts, speed grades, logic capacity, I/O assignments, or configuration requirements. Treat every alternative as a review candidate until the manufacturer provides a formal cross-reference. Also resolve the reported 732.1 MHz versus 717 MHz frequency discrepancy by checking the exact speed grade, test condition, and ordering-code documentation.
Información de cumplimiento
The verified Besen Chips search result identifies the part as lead free and RoHS compliant. REACH, AEC-Q100, halogen-free, and conflict-minerals declarations were not provided.
