EP3SE50F780I4LN - Stratix III E FPGA 47.5K LE 780-FBGA | Altera
N.º de pieza: EP3SE50F780I4LN ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1439.77 | $1.439,77 |
| 10 | $1295.79 | $12.957,90 |
| 100 | $1151.81 | $115.181,00 |
| 500 | $1007.84 | $503.920,00 |
| 1.000 | $863.86 | $863.860,00 |
EP3SE50F780I4LN Descripción general
What is a Stratix III E FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric is built from an array of configurable logic blocks (CLBs), programmable routing, dedicated DSP and memory blocks, and a periphery of high-speed transceivers and general-purpose I/Os. Stratix III E belongs to Altera's high-performance, low-power 65 nm FPGA family, sitting in the device hierarchy as: Stratix III E -> Stratix III family -> Stratix series -> high-end FPGA -> programmable logic device -> semiconductor IC.
Key features of the EP3SE50F780I4LN include 488 maximum user I/Os, 1,900 LABs, 5,760,000 bits of embedded RAM, dedicated 18x18 multipliers and DSP blocks, and up to 12 high-speed transceivers depending on package option. The 780-FBGA package supports high pin-count designs with controlled impedance signal routing, while the 'I4' speed grade and 'L' enhanced feature suffix position this device for industrial-grade high-throughput DSP, telecom, and signal-processing applications.
The device architecture uses 65 nm process technology, a fine-grained ALM-based fabric, multi-track routing, and dedicated hardware for DSP, memory interfacing, and external memory controllers (DDR/DDR2/QDRII). Hard IP for PCI Express, Gigabit Ethernet, and SERDES up to 6.375 Gbps is integrated, enabling protocol bridging without consuming soft logic.
Typical applications include high-throughput digital signal processing (radar, beamforming), telecom baseband and backhaul cards, ASIC prototyping, high-speed serial interface bridging, and military/aerospace compute nodes. With 488 I/Os and 5.76 Mbit embedded memory, the device supports multi-channel data acquisition and image processing pipelines.
When designing with this part, allocate sufficient PCB layers (typically 12+) to maintain signal integrity on the FCBGA escape routing. Use the Quartus II design suite (or later Quartus Prime) for synthesis, place-and-route, and timing closure; the device requires configuration via JTAG, passive serial, or fast passive parallel mode.
This page synthesizes distributor inventory, parametric drop-in alternatives, and practical Stratix III design notes not consolidated in the manufacturer datasheet alone.
Alternativas directas para EP3SE50F780I4LN — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SE50F780I4LN (mismo factor de forma y huella) — difiere en Package, Family, Logic Elements, DSP Blocks, Core Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SE50F780I4L
✅ Sustitución directa✓ En stock
$1198.5 / unidad
Ver hoja de datos →EP3SE50F780I4
✅ Sustitución directa✓ En stock
$1195 / unidad
Ver hoja de datos →EP3SE50F780I4LG
✅ Sustitución directa✓ En stock
$2380 / unidad
Ver hoja de datos →EP3SE50F780I4G
✅ Sustitución directa✓ En stock
$1320 / unidad
Ver hoja de datos →EP3SE110F780I4LN
✅ Sustitución directa✓ En stock
$1920 / unidad
Ver hoja de datos →EP3SE50F780C4LN
✅ Sustitución directa✓ En stock
$650 / unidad
Ver hoja de datos →EP3SE50F780I3N
✅ Sustitución directa✓ En stock
$1550 / unidad
Ver hoja de datos →EP3SE50F780I4LN Valores máximos y características eléctricas
| Family | Stratix III E |
| Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Adaptive Logic Modules (ALMs) | 19,000 |
| Embedded Memory (bits) | 5,760,000 |
| Maximum User I/Os | 488 |
| Encapsulado | 780-BBGA, FCBGA (FineLine BGA) |
| Operating Voltage (Core) | 0.85 V to 1.2 V |
| Process Technology | 65 nm |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Speed Grade | I4 |
| Transceivers | Up to 12 (package dependent) |
| DSP Blocks | Dedicated 18x18 multipliers + DSP |
| Configuration Modes | JTAG, Passive Serial, Fast Passive Parallel |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Guía de configuración de pines de EP3SE50F780I4LN 780-bbga, fcbga (fineline bga)
Configuración de pines para EP3SE50F780I4LN (encapsulado 780-bbga, fcbga (fineline bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SE50F780I4LN.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SE50F780I4LN es adecuado para 7 aplicacións: High-Throughput Digital Signal Processing, Telecom Baseband and Backhaul Cards, ASIC Prototyping and Emulation, High-Speed Serial Interface Bridging, Industrial Control and Machine Vision, Military and Aerospace Avionics, Medical Imaging and Diagnostic Equipment.
High-Throughput Digital Signal Processing
The EP3SE50F780I4LN's 47,500 logic elements and dedicated 18x18 multiplier DSP blocks enable high-sample-rate DSP pipelines for radar, software-defined radio, and beamforming arrays. With 5.76 Mbit embedded memory and 488 I/Os, the FPGA can ingest multi-channel ADC data at hundreds of MSPS while performing FFTs, FIR filtering, and matrix operations in parallel. The I4 industrial speed grade preserves timing margin at -40C to +100C, suitable for outdoor base stations and avionics signal conditioning. Its 65 nm low-power architecture balances performance per watt versus higher-node predecessors.
Recomendado
Telecom Baseband and Backhaul Cards
Stratix III E devices including EP3SE50F780I4LN integrate hard IP for PCI Express Gen1/Gen2 and SERDES up to 6.375 Gbps, supporting CPRI, OBSAI, and 10G Ethernet backhaul without consuming soft logic. The 488 user I/Os accommodate multi-standard framer/mapper interfaces and external QDRII/DDR2 memory controllers for line-card buffering. Industrial temperature grade and NRND supply make this part well-suited to existing LTE and early-5G small-cell deployments where design re-validation cost dominates BOM savings.
Recomendado
ASIC Prototyping and Emulation
With 47,500 LE and 5.76 Mbit embedded RAM, the EP3SE50F780I4LN serves as an effective ASIC prototype target for mid-complexity SoCs in the 5-10M gate range (after FPGA-to-ASIC conversion ratios). The 780-FBGA package exposes 488 I/Os to map ASIC pad ring logic directly, and Quartus II supports gate-level netlist import for ASIC RTL flows. Multi-FPGA partitioning tools (e.g., Certify, Synopsys Certify) split large ASIC designs across multiple Stratix III boards, making EP3SE50F780I4LN a cost-effective node in emulation farms.
Recomendado
High-Speed Serial Interface Bridging
The EP3SE50F780I4LN integrates up to 12 high-speed transceivers at rates up to 6.375 Gbps, ideal for bridging between PCIe, Serial RapidIO, Aurora, and custom serial protocols. With 488 I/Os and 5.76 Mbit RAM, the FPGA can buffer protocol translation tables while maintaining line-rate throughput. Industrial temperature grade supports factory-floor and outdoor cabinet deployments. Pair with external retimer PHY for extended reach over backplane or copper cable assemblies in storage and networking equipment.
Recomendado
Industrial Control and Machine Vision
The EP3SE50F780I4LN's industrial -40C to +100C temperature range and 488 I/Os suit it to PLC controllers, multi-axis motor drives, and high-speed machine vision inspection systems. On-chip DSP blocks accelerate real-time image preprocessing (filtering, thresholding, edge detection) for multi-camera linescan applications. Embedded memory buffers raw Bayer data while external DDR2/QDRII handles higher-resolution frame storage. The 780-FBGA package's thermal performance supports sealed IP65 enclosures with conduction cooling.
Recomendado
Military and Aerospace Avionics
Stratix III E FPGAs including EP3SE50F780I4LN have been widely adopted in avionics and military signal-processing subsystems where radiation tolerance via software mitigation and long lifecycle outweigh raw performance. The 47,500 LE, 488 I/Os, and dedicated DSP blocks support radar warning receivers, electronic counter-countermeasures, and flight-control computing. Industrial temperature range plus the L-tier enhanced feature set position this part for ruggedized conduction-cooled VPX and VME form-factor boards. Altera/Intel's military product longevity program historically extends Stratix support beyond commercial timelines.
Recomendado
Medical Imaging and Diagnostic Equipment
The EP3SE50F780I4LN supports ultrasound front-end beamforming and MRI reconstruction pipelines where parallel DSP throughput and embedded memory bandwidth are critical. With 47,500 LE and 5.76 Mbit embedded RAM, the FPGA can manage up to 64-channel beamformer sums and intermediate FIR filter stages without external memory round-trips. Industrial temperature and reliability data position this device for ultrasound carts, patient monitoring, and endoscopy video processors. Latency-critical control loops benefit from deterministic fabric timing at the I4 speed grade.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SE50F780I4LN — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SE50F780I4L | EP3SE50F780I4LG | EP3SE110F780I4LN | EP3SE50F780C4LN |
|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) | 780-BBGA, FCBGA (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 47,500 | 47,500 | 47,500 | 106,500 | 47,500 |
| Embedded Memory (bits) | 5,760,000 | 5,760,000 | 5,760,000 | 11,475,840 | 5,760,000 |
| Maximum User I/Os | 488 | 488 | 488 | 488 | 488 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | I4 | I4 | I4 | I4 | C4 |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Highest logic density in a 780-ball FCBGA for Stratix III E (frente a EP3CLS70F780I7N)
- Pin-compatible logic-density upgrade path (frente a EP3SE110F780I4LN)
- Hard SERDES IP up to 6.375 Gbps integrated (frente a EP3C80F780C8N)
Notas de diseño
The 780-ball FCBGA with 0.8 mm pitch (typical for Stratix III E F780) requires high-density PCB stack-up: at least 12 layers, with microvia-in-pad or HDI construction to escape the inner-row balls. Reference the Altera AN 532: 'Designing with High-Density BGA Packages' for via-in-pad and via tenting recommendations. Maintain continuous reference planes under the package and use 50 ohm controlled impedance for all high-speed signal traces. Decoupling: place 0.1 uF X7R caps within 100 mils of every power pin, plus bulk 22 uF/47 uF polymer caps per supply rail.
Estimated thermal dissipation: at 0.85V core, 47,500 LE running at 50% utilization, 200 MHz fMAX, the FPGA dissipates approximately 4-6 W steady state. The FCBGA package has theta_JA in the range of 8-12 C/W with a 4-layer JEDEC test board; expect junction-to-ambient thermal resistance around 10 C/W on a properly designed 12-layer board with thermal vias. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet to confirm before final layout. Add a heatsink or thermal interface material if junction temperature exceeds 90C at worst-case industrial corner.
Do not confuse the EP3SE50F780 family pinout with the larger EP3SE110/EP3SE260 F780 packages - the F780 ball assignment differs between logic densities even though the ball count is identical. Always re-export the Quartus pin assignments for the specific device selected. For configuration, ensure MSEL[2:0] pins match the desired mode (AS, PS, FPP, JTAG) and that nCONFIG, nSTATUS, and CONF_DONE have proper pull-ups. The I4 speed grade timing models must be paired with Quartus II 13.1 or earlier; Quartus Prime 17.x retains legacy Stratix III support but verify timing closure.
Stratix III E supports Smart Voltage ID (SmartVID) with a compatible external controller to dynamically adjust VCC core voltage based on process and temperature, reducing power by 20-40%. If not using SmartVID, tie the VID_EN pins to disable and supply fixed VCCINT. Sequence VCCINT before VCCPD per datasheet to avoid latch-up; use a multi-rail power manager like the LTM4677 or ISL8277. Always include a 10 uF/25V bulk cap at the regulator output plus 0.1 uF/1 uF X7R high-frequency bypass at each power pin.
The 488 user I/Os support LVDS, LVPECL, and various single-ended standards up to 1.6 Gbps per pair; SERDES channels support up to 6.375 Gbps. For DDR2/QDRII external memory interfaces up to 400 MHz, follow the Altera External Memory Interface Handbook: enforce matched trace lengths (within 25 mils for DQ/DQS groups), 50 ohm single-ended impedance with 100 ohm differential, and proper termination at the FPGA bank. Use IBIS models for board-level SI simulation before tape-out.
Información de cumplimiento
RoHS and REACH compliance per Altera/Intel product specifications. AEC-Q100 not applicable (FPGAs are not automotive-qualified). Halogen-free status to be confirmed via MDS. Lifecycle status: NRND since approximately 2018 per Altera/Intel product change notifications.