EP4CE10F17C7N - 10,320-Cell 1.2V FPGA | Altera | 256-LBGA
N.º de pieza: EP4CE10F17C7N ✓ ActivoEP4CE10F17C7N Descripción general
An FPGA is a programmable semiconductor in which configurable logic blocks, memory resources, input/output blocks, and clocking or power-management resources implement a system function. The FPGA hierarchy places this device within the broader categories of programmable logic devices and semiconductors. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured for different designs, accelerating prototyping, product updates, and hardware customization.
The EP4CE10F17C7N uses 60 nm FPGA technology according to the product comparison information. Its 10,320 logic elements provide substantial parallel-processing capacity, while 414 kbit of embedded memory supports data buffering, lookup tables, packet handling, and control functions. The 179 I/O count gives the design a broad connection interface for external memories, clocks, serial links, sensors, actuators, and general-purpose digital buses. The 1.2V core supply is suitable for modern low-voltage digital systems when paired with appropriate I/O supply rails.
The F17 package is identified as a 256-pin FBGA in product listings, while the ordering page also identifies the device as a 256-LBGA variant. The compact ball-grid package supports high-density PCB routing, but it requires careful escape routing, controlled power delivery, thermal planning, and assembly process control. The C7 suffix denotes the particular Cyclone IV E ordering configuration and should be retained during procurement or replacement review rather than treating only the base EP4CE10 designation as sufficient.
Typical uses for this FPGA include industrial control, communications equipment, test and measurement systems, embedded video or signal-processing platforms, and general-purpose logic consolidation. A designer can use the logic cells for parallel algorithms, the embedded memory for buffering or state, and the 179 I/O for external interfaces. In multi-rail systems, the I/O voltage requirements and pin-compatible interface standards should be checked against the selected board-level connections.
For a new layout, place decoupling capacitors close to the power and ground balls, use a controlled-impedance escape strategy for high-speed signals, and verify thermal performance across the intended ambient range. Because the device is supplied in a fine-pitch BGA package, assembly alignment, stencil design, via-in-pad considerations, and solder-paste volume control can materially affect yield. Use the manufacturer's pin-assignment and package documentation before assigning any external signal.
This product page combines the official EP4CE10F17C7N ordering information with practical guidance on package constraints, resource matching, selection, and drop-in comparison. It is intended to help engineers move from the device identification and core specifications to a board-level decision while retaining the exact ordering part number.
Alternativas directas para EP4CE10F17C7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP4CE10F17C7N (mismo factor de forma y huella) — difiere en Device Type, Logic Elements, Package, Mounting Type, Process Technology.
EP4CE10F17C6N
✅ Sustitución directaConsulte el precio
Ver hoja de datos →EP4CE10F17C8N
✅ Sustitución directaConsulte el precio
Ver hoja de datos →EP4CE10F17C7
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP4CE10F17C7N Valores máximos y características eléctricas
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone IV E |
| Logic Elements | 10,320 LE |
| Embedded Memory | 414 kbit |
| Logic Cells | 47 |
| Number of I/O | 179 I/O |
| Core Supply Voltage | 1.2 V |
| Process Technology | 60 nm |
| Package Type | 256-LBGA |
| Package Pin Count | 256 pins |
| Package Family | FBGA-256 |
| Tipo de montaje | Surface Mount |
| Programmable Logic | Cyclone IV E FPGA |
| Ordering Part Number | EP4CE10F17C7N |
| Manufacturer | Altera |
| Estado RoHS | Compliant |
Guía de configuración de pines de EP4CE10F17C7N fbga-256
Configuración de pines para EP4CE10F17C7N (encapsulado fbga-256). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP4CE10F17C7N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP4CE10F17C7N es adecuado para 6 aplicacións: Industrial Control and Automation, Communications Interface Consolidation, Test and Measurement Equipment, Embedded Signal Processing, Medical and Diagnostic Control, Video and Display Processing.
Industrial Control and Automation
The EP4CE10F17C7N fits programmable machine-control logic where parallel decision paths, sequencing, and I/O density are more important than a fixed control ASIC. Its 10,320 logic elements can implement timers, state machines, interlocks, motion sequencing, and communication protocols, while 179 I/O provides connections to sensors, actuators, encoders, and discrete industrial interfaces. The 1.2 V core supply and 256-LBGA package support compact embedded control assemblies, but the design must account for industrial I/O voltage levels, grounding, isolation, and thermal conditions. Use the official F17 pin assignment and verify the C7 timing grade before releasing production hardware.
Recomendado
Communications Interface Consolidation
The EP4CE10F17C7N is suitable for communications systems that need programmable protocol handling, buffering, and data-path control in a compact package. The 10,320 logic elements can support parallel framing, filtering, clock-domain crossing, and stateful interface logic, while the 423,936 embedded-memory bits provide local storage for packet or transaction data. Its 179 I/O allows connection to transceivers, memories, and parallel buses without relying on a large fixed-function logic device. Engineers should use the 1.2 V core rail and determine the appropriate I/O voltage separately. Signal-integrity work, especially clock routing and high-speed escape routing from the 256-LBGA, should follow the manufacturer layout guidance.
Recomendado
Test and Measurement Equipment
The EP4CE10F17C7N can consolidate acquisition, timing, trigger, and control functions in programmable test equipment. Its 10,320 logic elements are useful for parallel counters, digital pattern generation, protocol engines, and instrument-control logic, while the embedded memory can support sample buffering and intermediate state. The 179 I/O provides flexible connectivity to converters, sensors, memory devices, and host interfaces. Because the device is packaged as a 256-LBGA, precision escape routing and clean reference-clock distribution are important for repeatable measurements. Confirm the speed grade and timing margins for the highest-frequency acquisition path, and use the official pin and electrical tables to define decoupling and I/O standards.
Recomendado
Embedded Signal Processing
The EP4CE10F17C7N is appropriate for parallel digital signal-processing functions that benefit from programmable logic architecture. Fixed-point filters, correlation, waveform transformation, digital conversion control, and adaptive processing can be mapped across the 10,320 logic elements, while 414 kbit of embedded memory supports sample, coefficient, and state storage. The 179 I/O permits connection to external converters, memory, and digital interfaces, allowing the FPGA to consolidate several fixed-function blocks. The 1.2 V core operation can simplify low-voltage digital power planning, although external I/O supplies remain design-specific. Validate arithmetic throughput, memory bandwidth, clock frequency, and package-routing effects before selecting the device for a throughput-critical algorithm.
Recomendado
Medical and Diagnostic Control
The EP4CE10F17C7N can support control and monitoring subsystems in diagnostic equipment when its exact ordering, environmental, and compliance requirements are verified for the intended product. The programmable logic resources can implement acquisition sequencing, sensor control, data validation, and interface protocols, while 179 I/O provides connectivity to analog front ends, displays, memories, and communications. Using programmable logic also allows controlled revisions after hardware validation. Because the package is a 256-LBGA, assembly yield, cleaning, inspection, and thermal performance require planning, particularly in compact instruments. Engineers should apply the manufacturer's safety, reliability, and patient-application requirements rather than treating general FPGA suitability as medical certification.
Recomendado
Video and Display Processing
The EP4CE10F17C7N can implement video timing, pixel and line processing, test-pattern generation, and control functions for embedded display systems. Its 10,320 logic elements support parallel pipelines and synchronization logic, while 423,936 embedded-memory bits can be used for line buffers, frame-related data, or lookup functions. With 179 I/O, the device can connect to parallel display interfaces, memory, and timing sources in a compact 256-LBGA implementation. Video designs must carefully balance external memory bandwidth, clocking, output timing, and I/O voltage standards. Confirm the required pixel clock, memory interface expectations, and C7 timing margin using the manufacturer device documentation before finalizing the controller architecture.
Recomendado
Datos de referencia de ingeniería para EP4CE10F17C7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP4CE10F17C6N | EP4CE10F17C8N | EP4CE10F17C7 |
|---|---|---|---|---|
| Package | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA |
| Brand | Altera | Altera | Altera | Altera |
| FPGA Family | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E |
| Logic Elements | 10,320 LE | 10,320 LE | 10,320 LE | 10,320 LE |
| Embedded Memory | 414 kbit | 414 kbit | 414 kbit | 414 kbit |
| I/O Count | 179 I/O | 179 I/O | 179 I/O | 179 I/O |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 60 nm | 60 nm | 60 nm | 60 nm |
| Speed-Grade Suffix | C7N | C6N | C8N | C7 |
Diferenciadores clave
- Exact C7 speed-grade positioning within the EP4CE10 F17 family (frente a EP4CE10F17C6N)
- Lower timing risk for C7-targeted designs than a C6N substitution (frente a EP4CE10F17C6N)
- Same package and resource base with a higher speed option (frente a EP4CE10F17C8N)
Notas de diseño
Treat the 256-LBGA as a high-density escape-routing problem. Follow the manufacturer layout guidelines for ball assignment, power and ground planes, via structures, and signal transitions. Keep configuration, clock, and high-speed interface nets away from noisy switching nodes, and use a controlled-impedance stackup. Validate escape lengths and crosstalk with field solvers before fabrication because small routing errors can affect timing and assembly yield.
Plan the 1.2 V core rail and all I/O supplies as separate power domains, then verify sequencing, current limits, and tolerance against the official electrical tables. Place local decoupling directly at the relevant power and ground balls, and provide sufficient distribution capacity for the configured design. The 60 nm device family can present different static and dynamic demand depending on logic activity, so use project-specific power estimation rather than a single assumed current value.
Evaluate the junction-temperature rise using the actual board copper, adjacent heat sources, enclosure airflow, and the device's operating activity. The 256-LBGA offers substantial solder-ball connectivity but does not eliminate the need for thermal design. Avoid placing the FPGA next to unregulated power stages or processors without a heat-transfer path, and verify the production assembly's solder-joint quality because degraded thermal coupling can change operating temperature.
Do not substitute only the EP4CE10 base designation: the F17 package configuration, C7 speed grade, temperature suffix, and the trailing N ordering code affect procurement and qualification. When moving to the C8N option, rerun timing closure even though the package and logic resources match. When moving to C6N, confirm that the slower grade still satisfies every clock-domain timing requirement before approving the substitution.
Información de cumplimiento
RoHS-compliant status is stated in the product comparison information. Other compliance fields were not specified and remain unknown.
