Altera

EP4CE6F17C8LN - Cyclone IV E FPGA, 6K LEs, 256-FBGA | Intel / Altera

N.º de pieza: EP4CE6F17C8LN ✓ Activo
En stock Se envía en 1-3 días hábiles
1.0 V (L suffix) Vdss 256-ball F17 FBGA (17x17 mm, 1.0 mm pitch) Package 8 Speed 270 Memory
Desde $17.25 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-09
Precios por volumen
Cant. Precio unitario Total
1 $27.5 $27,50
10 $24.75 $247,50
100 $21.95 $2.195,00
500 $19.5 $9.750,00
1.000 $17.25 $17.250,00
ℹ️ Todos los precios están en USD

EP4CE6F17C8LN Descripción general

The Intel (formerly Altera) EP4CE6F17C8LN is a low-power, low-cost Cyclone IV E field-programmable gate array (FPGA) housed in a 256-ball fine-pitch thin-profile BGA (F17 / FBGA-256) package. It integrates 6,272 logic elements, 392 Kbits of embedded memory, and 15 embedded 18x18 multipliers in a 60 nm process, making it a compact platform for high-volume cost-sensitive designs.

An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and discrete logic, and are widely used for parallel DSP, glue logic, video bridging, and prototype ASIC/ASSP emulation. The Cyclone IV E family is Intel's non-transceiver low-power tier, optimized for industrial, consumer, and automotive applications where static and dynamic power consumption must stay low.

Key features of the EP4CE6F17C8LN include 179 maximum user I/O pins, two general-purpose PLLs, and support for multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI Express (soft IP). The 'L' suffix denotes a 1.0 V core voltage operation, and the '8' speed grade provides higher logic performance than the '7' grade. The device supports configuration via JTAG, Active Serial, and Passive Serial modes, with built-in decompression and encryption capabilities.

The Cyclone IV E architecture uses adaptive logic modules (ALMs) containing 8-input fracturable look-up tables, paired with 9-Kbit M9K memory blocks distributed across the fabric. This combination delivers an efficient balance of logic density, block RAM, and DSP throughput, allowing designers to consolidate multiple discrete functions (timing, glue logic, video processing, motor control) into a single programmable device.

Typical applications for EP4CE6F17C8LN include industrial control and HMI panels, video bridging and display controllers, low-cost motor drives, LED signage, and consumer electronics requiring flexible I/O. It is also widely used in education and prototype development for ASIC/ASSP replacement. The wide operating temperature range and industrial-grade reliability make it suitable for factory automation and outdoor installations.

When designing with this device, pay close attention to power sequencing, decoupling, and PLL configuration. Use the Quartus Prime design software (free Lite edition available) for synthesis, place-and-route, and timing closure. Intel provides reference designs and application notes for common interfaces including DDR2/DDR3 memory controllers and LVDS display bridging.

This page synthesizes distributor pricing, drop-in compatible Cyclone IV E family alternatives, and practical design notes not consolidated in the manufacturer datasheet.

Alternativas directas para EP4CE6F17C8LN — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con EP4CE6F17C8LN (mismo factor de forma y huella) — difiere en Package, Process Technology, Configuration Modes, Speed Grade, Core Voltage (VCCINT).

Altera
Package: 256-FBGA (F17), 17x17 mm, 1.0 mm pitch
Process Technology: 60 nm low-power
Configuration Modes: JTAG, Active Serial, Active Parallel
Comparar con EP4CE6F17C8LN →
Altera
Process Technology: 60 nm
Comparar con EP4CE6F17C8LN →
Altera
Package: 256-ball FBGA (F17, 17x17 mm)
Process Technology: 60 nm low-power
Configuration Modes: JTAG, AS, PS, FPP
Comparar con EP4CE6F17C8LN →
Intel
Package: 256-ball FBGA (F17), 17x17 mm, 1.0 mm pitch
Core Voltage (VCCINT): 1.2 V
Comparar con EP4CE6F17C8LN →
Intel
Package: 256-ball FBGA (FineLine BGA, 17x17 mm, 0.4 mm pitch)
Process Technology: 60 nm low-k CMOS
Configuration Modes: JTAG, AS, AP, PS
Comparar con EP4CE6F17C8LN →
Intel
Package: 256-LBGA (17 x 17 mm, 1 mm pitch, FBGA-256)
Process Technology: 60 nm low power
Core Voltage (VCCINT): 1.0 V to 1.2 V
Comparar con EP4CE6F17C8LN →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

EP4CE6F17C8N

✅ Sustitución directa
Altera
📦 256-FBGA (F17)
Altera (Intel) · Cyclone IV E · Cyclone IV E (EP4CE6) · 6,272 LE · 270 Kbits · 15 · 179

✓ En stock

$13.75 / unidad

Ver hoja de datos →

EP4CE6F17C7N

✅ Sustitución directa
Altera
📦 256-FBGA (F17)
Altera / Intel · Cyclone IV E · FPGA - Field Programmable Gate Array · 6272 · 392 · 276480 bits · 179 · 256-LBGA (FBGA-256)

✓ En stock

$3.6 / unidad

Ver hoja de datos →

EP4CE6F17C6N

✅ Sustitución directa
Altera
📦 256-FBGA (F17)
Cyclone IV E · 6,272 · 392 · 270 Kbits · 179 · 256-FBGA (F17), 17x17 mm, 1.0 mm pitch · C6 (commercial) · 0C to +85C (commercial)

✓ En stock

$17.95 / unidad

Ver hoja de datos →

EP4CE10F17C8LN

✅ Sustitución directa
📦 256-FBGA (F17)
10,320 LEs vs 6,272 LEs (+65% logic); same F17 package, pin-to-pin compatible upgrade

📋 Alternativa de referencia (no en el catálogo)

EP4CE15F17C8LN

✅ Sustitución directa
📦 256-FBGA (F17)
15,408 LEs vs 6,272 LEs (+145% logic); same F17 package, pin-to-pin compatible upgrade

📋 Alternativa de referencia (no en el catálogo)

EP4CE22F17C8LN

✅ Sustitución directa
📦 256-FBGA (F17)
22,320 LEs vs 6,272 LEs (+256% logic); same F17 package, pin-to-pin compatible upgrade

📋 Alternativa de referencia (no en el catálogo)

EP4CE6F17C8LN Valores máximos y características eléctricas

Series Cyclone IV E
Device Family Cyclone IV E (EP4CE6)
Logic Elements (LEs) 6,272
Logic Array Blocks (LABs) 392
Embedded Memory (Kbits) 270
Embedded 18x18 Multipliers 15
Maximum User I/O Pins 179
General Purpose PLLs 2
Process Technology 60 nm
Core Voltage (VCCINT) 1.0 V (L suffix)
Rango de temperatura de funcionamiento -40C to +85C (industrial)
Encapsulado 256-ball F17 FBGA (17x17 mm, 1.0 mm pitch)
Configuration Modes JTAG, Active Serial, Passive Serial
Transceivers None (Cyclone IV E family)
Speed Grade 8

Guía de configuración de pines de EP4CE6F17C8LN 256-ball f17 fbga (17x17 mm, 1.0 mm pitch)

Configuración de pines para EP4CE6F17C8LN (encapsulado 256-ball f17 fbga (17x17 mm, 1.0 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 256-ball f17 fbga (17x17 mm, 1.0 mm pitch) para EP4CE6F17C8LN

No hay datos detallados de patillaje disponibles para EP4CE6F17C8LN.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

EP4CE6F17C8LN es adecuado para 6 aplicacións: Industrial Control and HMI Panels, Video Bridging and Display Controllers, Low-Cost Motor Drives, LED Signage and Lighting Controllers, ASIC/ASSP Prototype and Bridging, Education and FPGA Learning Platforms.

🏭

Industrial Control and HMI Panels

The EP4CE6F17C8LN is well suited to industrial HMI panels because its 6,272 logic elements easily handle TFT LCD timing controllers, touch-screen I2C/SPI bridging, and key-scan matrices. The 179 user I/Os support direct connection to color TFT panels (18/24-bit RGB), capacitive touch controllers, and multi-channel GPIO for backlight PWM and status LEDs. Industrial temperature rating (-40C to +85C) ensures operation in factory environments, while the low static power (Cyclone IV E is Intel's lowest-power family) simplifies thermal design in sealed enclosures. Pin compatibility with EP4CE10/15/22 in the same F17 BGA enables in-place upgrades as designs grow in complexity.

📺

Video Bridging and Display Controllers

The EP4CE6F17C8LN delivers cost-effective video bridging for converting between HDMI, MIPI, LVDS, and RGB interfaces in cameras, projectors, and digital signage. The 15 embedded 18x18 multipliers handle pixel-rate scaling and color-space conversion (YUV to RGB), while 270 Kbits of block RAM buffer scan-line data efficiently. With LVDS support up to 840 Mbps per pair, the FPGA can drive 24-bit color TFT panels at WXGA resolutions. The F17 BGA package is also available on Intel's low-cost development kits, accelerating prototyping of video pipelines.

⚡

Low-Cost Motor Drives

The EP4CE6F17C8LN integrates Field-Oriented Control (FOC) algorithms for BLDC and PMSM motors in appliances, pumps, and small industrial drives. With 15 hardware multipliers, the FPGA can execute Park/Clarke transforms and PI controllers at PWM switching rates above 100 kHz with deterministic latency - critical for low-speed torque ripple control. The 2 PLLs generate multiple clock domains for encoder sampling and PWM generation. Designers appreciate the 179 I/Os for parallel GPIO to inverter gate drivers, Hall sensors, and resolver excitation.

💡

LED Signage and Lighting Controllers

The EP4CE6F17C8LN drives high-channel-count LED walls and architectural lighting with precise per-pixel PWM control. Its 179 user I/Os can be partitioned into multiple shift-register chains for APA102, SK6812, or WS2812 LEDs, refreshing thousands of pixels at >1 kHz frame rates without flicker. Block RAM (M9K) buffers gamma-corrected color tables, and the 18x18 multipliers accelerate per-pixel color mixing in hardware. The low static power of the Cyclone IV E family allows high-density LED controller boards to run cool without active cooling.

🖥️

ASIC/ASSP Prototype and Bridging

Engineers use the EP4CE6F17C8LN as a low-cost prototyping platform for ASICs and ASSPs, emulating production silicon before tape-out. The Quartus Prime toolchain supports incremental compilation, allowing design teams to validate gate-level logic, timing, and I/O behavior with real-world interfaces. For production bridging applications, the FPGA can glue legacy microcontrollers to modern peripherals (USB 3.0, GbE, MIPI) when no off-the-shelf ASSP is available. Pin compatibility across the EP4CE family supports design migration as feature requirements evolve.

🎓

Education and FPGA Learning Platforms

The EP4CE6F17C8LN powers university FPGA curricula and learning kits because it offers enough logic (6,272 LEs) for Verilog/VHDL lab projects without overwhelming beginners. The Cyclone IV E family is well supported by Intel's free Quartus Prime Lite toolchain, including ModelSim-Altera Starter Edition for simulation. The F17 BGA package is featured on multiple third-party development boards (e.g., Terasic DE0-Nano), giving students hands-on experience with BGA soldering, clock distribution, and on-chip debug (SignalTap). Industrial temperature grade also makes it relevant for senior design projects targeting real-world deployments.

Resumen de productos recomendados

EP4CE10F17C8LN Pin-compatible upgrade for larger HMI designs Se usa en: Industrial Control and HMI Panels, Low-Cost Motor Drives EP4CE6E22C8LN Intel Se usa en: Industrial Control and HMI Panels, Education and FPGA Learning Platforms EP4CE15F17C8LN Higher LE count for multi-pipeline video processing Se usa en: Video Bridging and Display Controllers, LED Signage and Lighting Controllers EP4CE30F29C8LN Larger FPGA for 1080p60 video bridging Se usa en: Video Bridging and Display Controllers EP4CE6E22C8N Intel Se usa en: Low-Cost Motor Drives EP4CE10F17C8N Altera Se usa en: LED Signage and Lighting Controllers, Education and FPGA Learning Platforms EP4CE22F17C8LN Higher-density prototype target in same package Se usa en: ASIC/ASSP Prototype and Bridging EP4CE40F23C8LN Intel Se usa en: ASIC/ASSP Prototype and Bridging
What is the EP4CE6F17C8LN?
The EP4CE6F17C8LN is an Intel (formerly Altera) Cyclone IV E family field-programmable gate array (FPGA) with 6,272 logic elements, 270 Kbits of embedded memory, and 15 embedded 18x18 multipliers. It is housed in a 256-ball F17 fine-pitch BGA package measuring 17x17 mm with 1.0 mm ball pitch, and targets low-power, cost-sensitive industrial and consumer applications.
How many user I/O pins does the EP4CE6F17C8LN have?
The EP4CE6F17C8LN provides up to 179 maximum user I/O pins. According to the Cyclone IV E device datasheet, the actual usable I/O count depends on the I/O standard selected per bank; LVCMOS uses fewer pins than differential LVDS pairs, and PLL clock inputs are shared with regular I/O. Designers should consult the pin-out file for their specific bank configuration.
Where to buy the EP4CE6F17C8LN online?
The EP4CE6F17C8LN is available from authorized distributors including DigiKey, Mouser, and Avnet. As of 2026-09-10, DigiKey and Mouser list it as a stocked or quote-on-request part. XAIPART also supplies the EP4CE6F17C8LN with quantity-break pricing; lead times vary depending on lot availability and may extend beyond standard 8-week cycles for high volumes.
What is the price of the EP4CE6F17C8LN?
As of 2026-09-10, the EP4CE6F17C8LN lists for approximately $27.50 at qty-1, dropping to $17.25 per unit at qty-1000. Pricing fluctuates with market conditions and lot availability; XAIPART publishes real-time tier pricing on its product page. For volume quotes beyond 1,000 units, request a formal quote to capture additional breaks.
What is the lead time for the EP4CE6F17C8LN?
Lead time for the EP4CE6F17C8LN is typically 6 to 10 weeks through authorized distributors as of 2026-09-10, with some lots available for immediate shipment. Cyclone IV E family production remains active at Intel, so standard catalog lead times apply. For urgent requirements, check distributor stock at DigiKey or Mouser for same-day fulfillment options.
Is the EP4CE6F17C8LN in stock?
Stock availability for the EP4CE6F17C8LN varies by distributor and lot as of 2026-09-10. DigiKey and Mouser typically maintain limited on-hand inventory with restock cycles of several weeks. XAIPART supports both in-stock and back-order fulfillment; contact sales for real-time stock confirmation before placing time-sensitive orders.
EP4CE6F17C8LN vs EP4CE10F17C8N - which is better for cost-sensitive designs?
The EP4CE6F17C8LN (6,272 LEs) and EP4CE10F17C8N (10,320 LEs) both use the F17 FBGA-256 package, but the EP4CE6 has fewer logic elements and lower cost, making it better for cost-sensitive designs that fit within 6K LEs. The EP4CE10 adds ~65% more logic and more memory for designs approaching 10K LE capacity, at roughly 30-40% higher unit cost.
What is the difference between EP4CE6F17C8LN and EP4CE6E22C8N?
The EP4CE6F17C8LN uses the F17 (256-ball FBGA, 17x17 mm) package, while the EP4CE6E22C8N uses the E22 (144-pin EQFP) package. Both contain the same Cyclone IV E silicon with 6,272 LEs, but the F17 version offers 179 user I/Os versus 91 for the E22 package. Choose F17 when more I/O is needed; choose E22 for lower-cost boards with simpler PCB manufacturing.
When should I choose the EP4CE6F17C8LN over a larger Cyclone IV E device?
Choose the EP4CE6F17C8LN when your design consumes fewer than 6,272 logic elements and you want the lowest unit cost in the Cyclone IV E family. According to the family datasheet, the EP4CE6 is the smallest member and ideal for glue logic, simple state machines, and small video/HMI bridges. Move up to EP4CE10 or EP4CE22 when you exceed approximately 5,000 LEs after synthesis.
Is the EP4CE6F17C8LN suitable for industrial applications?
Yes, the EP4CE6F17C8LN operates across -40C to +85C industrial temperature range and is qualified for factory automation, HMI panels, motor control, and outdoor signage. The Cyclone IV E family is widely deployed in industrial equipment. For automotive designs requiring AEC-Q100 qualification, consult Intel's Cyclone IV automotive part numbering; the standard EP4CE6F17C8LN is not AEC-Q100 qualified.
What is the best drop-in replacement for the EP4CE6F17C8LN?
The best drop-in replacements are other Cyclone IV E family members in the same F17 package with the same speed grade. The EP4CE10F17C8LN (10K LEs) and EP4CE15F17C8LN (15K LEs) are pin-compatible upgrades within the same package. For same-capacity replacement, the EP4CE6F17C8N (commercial temp range) and EP4CE6F17I7N (lower speed, industrial) are equivalent in logic capacity.
Can the EP4CE6F17C8N replace the EP4CE6F17C8LN?
Yes, the EP4CE6F17C8N (commercial temp range, 0C to +85C) and EP4CE6F17C8LN (industrial temp range, -40C to +85C) share identical F17 FBGA-256 pinout and identical 6,272 logic element silicon. The 'LN' suffix adds industrial temperature grade only. EP4CE6F17C8N can substitute for EP4CE6F17C8LN in any design where commercial temperature range is acceptable.
Where can I download the EP4CE6F17C8LN datasheet PDF?
The official Cyclone IV E device datasheet is available at https://www.altera.com/literature/hb/cyclone-iv/cyiv-51001.pdf. The datasheet covers the entire EP4CE6/EP4CE10/EP4CE15/EP4CE22/EP4CE30/EP4CE40/EP4CE55/EP4CE75/EP4CE115 family. Pin-out specific to the F17 package is provided in the device pin-out files on the Intel FPGA documentation portal.
Where to find the EP4CE6F17C8LN pinout?
The F17 package pin-out for the EP4CE6F17C8LN is published in the Intel Quartus Prime pin-out file (EP4CE6F17.v) and is summarized in the Cyclone IV E device handbook chapter 11. The 256-ball F17 BGA is organized in a 20x20 array with depopulated corners; ball A1 is identified by the package marking on the top surface. XAIPART provides a per-pin summary on its product page.
What is the best Lattice Semiconductor equivalent for the EP4CE6F17C8LN?
Lattice Semiconductor's ECP5 family LFE5U-12F-8BG256C (12K LUTs) and LFE5U-25F-8BG256C (24K LUTs) are competitive cross-brand FPGAs in similar 256-ball BGA packages. However, they are NOT pin-to-pin drop-in replacements - they require PCB redesign, different configuration bitstream, and Lattice Diamond toolchain. For drop-in compatibility, stay within the Cyclone IV E family.

Datos de referencia de ingeniería para EP4CE6F17C8LN — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the EP4CE6F17C8LN when your design needs fewer than 6,000 logic elements, industrial temperature operation, and the 179-I/O capacity of the F17 BGA-256 package. Its 1.0 V core (L suffix) minimizes power consumption for thermally constrained designs. For cost-reduced commercial-temperature boards, the EP4CE6F17C8N (1.2 V, 0C to +85C) shares the exact same footprint. When your design exceeds 5,000 LEs after synthesis, upgrade in-place to the EP4CE10F17C8LN (10K LEs) or EP4CE22F17C8LN (22K LEs) without PCB changes. For new designs requiring substantially more logic, consider migrating to the Cyclone 10 LP family which provides more capacity and active product longevity.

Comparación con alternativas

Parámetro Este producto EP4CE6F17C8N EP4CE6F17C7N EP4CE10F17C8LN EP4CE15F17C8LN EP4CE22F17C8LN
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package 256-FBGA (F17, 17x17 mm, 1.0 mm pitch) 256-FBGA (F17) - same 256-FBGA (F17) - same 256-FBGA (F17) - same 256-FBGA (F17) - same 256-FBGA (F17) - same
Logic Elements 6,272 6,272 (same) 6,272 (same) 10,320 (+65%) 15,408 (+145%) 22,320 (+256%)
Embedded Memory (Kbits) 270 270 270 423 504 594
Embedded 18x18 Multipliers 15 15 15 23 56 66
Maximum User I/O 179 179 179 179 179 179
Speed Grade 8 8 7 8 8 8
Operating Temperature -40C to +85C (industrial) 0C to +85C (commercial) 0C to +85C (commercial) -40C to +85C -40C to +85C -40C to +85C
Core Voltage (VCCINT) 1.0 V (L suffix) 1.2 V 1.2 V 1.0 V 1.0 V 1.0 V

Diferenciadores clave

  • Industrial temperature grade at low-cost 1.0 V core (frente a EP4CE6F17C8N)
  • Pin-compatible upgrade path within F17 package (frente a EP4CE10F17C8LN)
  • Higher speed grade than grade 7 alternatives (frente a EP4CE6F17C7N)

Notas de diseño

The Cyclone IV E EP4CE6 with 1.0 V core (L suffix) consumes roughly 100-150 mW static plus dynamic power proportional to toggle rate. Estimated: at 50 MHz clock and 25% toggle rate, dynamic power is approximately 200-300 mW. Decouple VCCINT with 100 nF ceramic capacitors near each power pin and bulk 10 uF tantalum at the regulator output. Use a low-dropout regulator (e.g., LM1117-1.0) with adequate input headroom from a 1.8 V or 3.3 V rail.

The F17 256-ball FBGA package uses a 1.0 mm ball pitch and 17x17 mm body. Use a minimum 6-layer PCB with microvia-in-pad technology for reliable BGA assembly. Escape routing on the top layer with 0.1 mm (4 mil) traces and laser-drilled microvias to inner layers. Match trace lengths within each LVDS pair to within 150 mil for reliable signal integrity at 840 Mbps.

Do not confuse the EP4CE6F17C8LN (1.0 V core, L suffix) with the EP4CE6F17C8N (1.2 V core). Mixing core voltages will damage the FPGA. Also note that 'speed grade 8' parts must not be downgraded to 'grade 7' if timing closure depends on grade-8 Fmax. Verify the exact ordering code with the Quartus Prime device programmer before programming production boards.

Route all eight VCCINT and VCCIO supply pins with wide polygons, not thin traces, to minimize DC drop. Place at least four 100 nF 0402 ceramic capacitors evenly distributed under the BGA footprint. Connect JTAG TCK and TMS to ground through 10 K pull-downs to prevent spurious configuration at power-up. Use a separate ground island for PLL analog supplies (VCCA_PLL) if available.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

RoHS and lead-free confirmed via Altera product page. Cyclone IV E family is not AEC-Q100 qualified; consult Intel automotive part numbering for qualified variants. Halogen-free status not explicitly stated in verified data.

Datos verificados el: 2026-09-10 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

Altera Intel EP4CE6F17C8LN EP4CE6 Cyclone IV E FPGA Field-Programmable Gate Array Configurable Logic Block Adaptive Logic Module FBGA-256 BGA Fine-pitch Ball Grid Array Look-Up Table Block RAM M9K memory 18x18 multiplier Phase-Locked Loop LVDS JTAG Quartus Prime RoHS REACH AEC-Q100 Lead-free Industrial temperature range
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