EP4CE75F23I7 - Cyclone IV E FPGA, 75K LE, 484-BGA | Intel
N.º de pieza: EP4CE75F23I7 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $316.48 | $316,48 |
| 10 | $295.5 | $2.955,00 |
| 50 | $270 | $13.500,00 |
| 100 | $248.75 | $24.875,00 |
| 500 | $220.4 | $110.200,00 |
EP4CE75F23I7 Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect. Unlike an ASIC, an FPGA can be reconfigured after manufacturing, enabling rapid prototyping, in-field updates, and design pivots. Within the broader programmable logic hierarchy, Cyclone IV E belongs to the low-power, cost-optimized family, sitting below the high-end Stratix and above the legacy Cyclone II/III families. Cyclone IV E devices balance logic density, embedded memory, DSP blocks, and transceiver-free I/O, ideal when high-speed serial links are not required.
Key features include up to 426 user I/O pins, support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, four general-purpose PLLs with fractional-N synthesis, and 4 on-chip temperature-sensing diodes. The device supports single-supply operation from an external 1.2V core and 2.5V-3.3V I/O banks, with hot-socketing capability and on-chip pull-up/pull-down resistors. Configuration options include JTAG, AS, PS, and FPP modes, with built-in decompression and AES-128 bitstream encryption.
The Cyclone IV E architecture pairs a fine-grained fabric of 4-input LUTs with M9K memory blocks and 18x18 multipliers, giving efficient implementation of DSP pipelines, video processing, and state-heavy control logic. Peripherals like PCI Express hard IP (PIPE) and external memory interfaces (DDR2/DDR3 up to 200 MHz) are supported via soft IP cores, accelerating common SoC functions.
Typical applications include industrial motor control, video surveillance and image processing, software-defined radio front-ends, low-cost PCIe endpoints, and educational/hobbyist development. The wide operating temperature range (industrial -40C to +85C) and robust PLL portfolio make it a long-life choice for harsh-environment embedded systems.
When designing, ensure proper decoupling on all VCCINT/VCCA/VCCIO rails and follow Intel's Pin Connection Guidelines for unused pins. Bitstream compression reduces configuration flash size, and AES-128 encryption protects IP when using the EPCQ configuration device.
This page synthesizes distributor stock and pricing, drop-in same-package alternatives, and practical design notes that go beyond the manufacturer datasheet.
Alternativas directas para EP4CE75F23I7 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP4CE75F23I7 (mismo factor de forma y huella) — difiere en Package, Process Technology, Embedded 18x18 Multipliers, Operating Temperature, Core Voltage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP4CE115F23I7N
✅ Sustitución directa✓ En stock
$87.95 / unidad
Ver hoja de datos →EP4CE55F23I7N
✅ Sustitución directa✓ En stock
$130.4 / unidad
Ver hoja de datos →EP4CE40F23I7N
✅ Sustitución directa✓ En stock
$52.75 / unidad
Ver hoja de datos →EP4CE55F23I7
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →EP4CE115F23C8N
✅ Sustitución directa✓ En stock
$145 / unidad
Ver hoja de datos →EP4CE75F23I7 Valores máximos y características eléctricas
| Family | Cyclone IV E |
| Logic Elements (LE) | 75,408 |
| Embedded Memory (bits) | 2,810,880 |
| Embedded 18x18 Multipliers | 274 |
| Maximum User I/O | 426 |
| General Purpose PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm low-power |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V |
| Encapsulado | 484-ball FineLine BGA (F23) |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Configuration Modes | AS, PS, FPP, JTAG |
| Bitstream Encryption | AES-128 |
| Estado RoHS | Compliant |
| Speed Grade | I7 |
| Nivel MSL | 3 |
Guía de configuración de pines de EP4CE75F23I7 484-ball fineline bga (f23)
Configuración de pines para EP4CE75F23I7 (encapsulado 484-ball fineline bga (f23)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP4CE75F23I7.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP4CE75F23I7 es adecuado para 6 aplicacións: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio Front-End, Low-Cost PCIe Endpoint Cards, Educational and Hobbyist Development, Automotive Infotainment Auxiliary Processors.
Industrial Motor Control
The EP4CE75F23I7 fits industrial motor control because its 75,408 logic elements and 274 embedded 18x18 multipliers implement multiple PWM generation channels, encoder quadrature decoding, and field-oriented control (FOC) math loops on a single chip. The four general-purpose PLLs synthesize precise switching frequencies from a single crystal reference, while 426 user I/Os handle simultaneous drive of three-phase bridges plus resolver/sine-cos encoder feedback. Industrial -40C to +85C operation tolerates factory-floor thermal stress, and the low-power 60nm process keeps dissipation manageable in sealed IP65 enclosures without active cooling.
Recomendado
Video Surveillance and Image Processing
The EP4CE75F23I7 suits video surveillance systems with multiple 1080p camera inputs thanks to its 2,810,880 bits of M9K memory acting as line/frame buffers and 274 hardware multipliers accelerating Sobel, Laplacian, and motion-detection kernels in real time. The 426 user I/Os accept parallel BT.656/BT.1120 sensor streams plus DDR2/DDR3 external memory interfaces at up to 200 MHz for histogram aggregation. AES-128 bitstream encryption protects IP for OEM manufacturers shipping branded surveillance products to enterprise customers concerned with firmware tampering and clone competition.
Recomendado
Software-Defined Radio Front-End
The EP4CE75F23I7 implements SDR baseband and digital-down-conversion stages at sampling rates up to 200 MHz, with 274 18x18 multipliers computing CIC, FIR, and FFT butterflies directly in fabric. The four general-purpose PLLs generate sample clocks from a low-jitter external reference, and LVDS I/O pairs connect directly to high-speed ADC/DAC front-ends. Industrial temperature rating supports outdoor small-cell and tactical-radio deployments, while Quartus Prime DSP Builder accelerates filter design with Simulink integration for rapid RF algorithm prototyping.
Recomendado
Low-Cost PCIe Endpoint Cards
The EP4CE75F23I7 implements PCIe Gen1 x4 endpoints via soft IP cores using the dedicated PIPE interface, supporting data acquisition, protocol bridging, and FPGA accelerator cards at consumer price points. With 75,408 logic elements it can host a soft processor (Nios II) plus custom DMA engines while maintaining lane throughput. The 484-BGA package offers enough I/O to break out 4 PCIe lanes plus auxiliary GPIO, and Quartus Prime PCIe Compiler generates compliant TLPs and configuration space logic without external PHY.
Recomendado
Educational and Hobbyist Development
The EP4CE75F23I7 pairs with low-cost Cyclone IV GX/E development boards (e.g. DE2-115-style kits) used in universities and maker communities. Its 75K logic element budget supports full RISC-V soft cores (VexRiscv, PicoRV32), custom instruction sets, and student projects spanning from VGA graphics to audio synthesis. Quartus Prime Lite offers a free toolchain with no license fees, lowering the barrier for first-time FPGA learners. Hot-socketing and on-chip pull-ups make student lab-board wiring mistakes forgiving compared to ASIC-class alternatives.
Recomendado
Automotive Infotainment Auxiliary Processors
The EP4CE75F23I7 handles auxiliary display rendering, CAN/LIN gateway bridging, and audio DSP in cost-sensitive automotive infotainment systems where a main SoC handles primary HMI. Its 426 user I/Os connect to multiple displays (LVDS), touch controllers, and automotive bus networks simultaneously, while 274 hardware 18x18 multipliers accelerate audio effects and ANC processing. Although not AEC-Q100 qualified at the -40C to +85C industrial grade it remains suitable for non-safety-critical cabin electronics where temperature and EMI margins are well understood.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP4CE75F23I7 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP4CE115F23I7N | EP4CE55F23I7N | EP4CE40F23I7N | EP4CE55F23I7 | EP4CE115F23C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA (F23) | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same | 484-BGA (F23) - same |
| Logic Elements | 75,408 | 114,480 (+52%) | 55,560 (-26%) | 39,600 (-47%) | 55,560 (-26%) | 114,480 (+52%) |
| Embedded Memory (bits) | 2,810,880 | 3,981,312 | 2,396,160 | 1,161,216 | 2,396,160 | 3,981,312 |
| Embedded 18x18 Multipliers | 274 | 266 | 154 | 116 | 154 | 266 |
| Maximum User I/O | 426 | 426 | 324 | 223 | 324 | 426 |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) |
| Speed Grade | I7 (industrial) | I7 (industrial) | I7 (industrial) | I7 (industrial) | I7 (industrial) | C8 (commercial) |
Diferenciadores clave
- Highest LE density in 484-BGA footprint below EP4CE115 (frente a EP4CE115F23I7N)
- Higher multiplier count than smaller Cyclone IV E F23 parts (frente a EP4CE55F23I7N)
- Industrial temperature range across the family (frente a EP4CE115F23C8N)
Notas de diseño
Decouple all VCCINT (1.2V), VCCA (2.5V), and VCCIO (per bank, 1.2V-3.3V) rails with 0.1uF ceramic capacitors placed within 5mm of each BGA pin, plus 10uF bulk capacitors at each regulator output. Estimated: typical core current at 75% utilization is ~500 mA, I/O current up to 1A depending on switching frequency. Use a 4-layer PCB with dedicated power and ground planes to minimize SSN.
The F23 484-BGA package has theta_JA of approximately 17 C/W with 1 m/s airflow. Estimated: at typical 1.5W total dissipation, junction temperature rises 25C above ambient with adequate PCB thermal vias. For sealed enclosures, derate Fmax or use thermal vias under the central BGA balls to maintain junction temperature below 100C for industrial-grade reliability.
Follow Intel Cyclone IV Hardware Design Guidelines for PCB stackup. Use 0.8mm ball pitch BGA escape routing with microvia-in-pad or dog-bone fan-out on a high-Tg FR-4 substrate (Tg >= 150C). Match trace lengths on differential pairs within 150 mil for LVDS at 840 Mbps. Maintain 50 ohm single-ended and 100 ohm differential impedance on top and bottom signal layers.
Use AS configuration mode with an EPCQ serial flash for production designs; the EP4CE75F23I7 supports bitstream compression (typically 30-50% size reduction) and AES-128 encryption to protect IP. JTAG mode is for development only. Place MSEL[3:0] pins to select configuration mode - AS (10100), PS (00000), JTAG (10101). Do not leave MSEL floating.
Common pitfalls include: (1) failing to connect unused VCCIO bank supplies which causes indeterminate I/O behavior; (2) confusing nCONFIG with nSTATUS (the former is an input to begin configuration, the latter is an output indicating error); (3) leaving JTAG TCK floating which causes random configuration failures; (4) over-deriving LVDS outputs beyond 1.5 mA source-sink capability. Always consult the Pin Connection Guidelines before layout.
Información de cumplimiento
RoHS and lead-free compliance confirmed via Intel product page. AEC-Q100 not applicable for FPGAs; industrial -40C to +85C temperature grade supports many non-safety-critical automotive cabin applications.