EP4SGX360FH29C3N - Stratix IV GX FPGA, 353.6K LE, 780-FBGA | Intel EP4SGX360FH29C3N de Intel - componente electrónico
Intel

EP4SGX360FH29C3N - Stratix IV GX FPGA, 353.6K LE, 780-FBGA | Intel

N.º de pieza: EP4SGX360FH29C3N ✓ Activo
En stock Se envía en 1-3 días hábiles
0.9 V Vdss 780-FBGA, FC-HFBGA Package C3 Speed
Desde $1495 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-10
Precios por volumen
Cant. Precio unitario Total
1 $1850 $1.850,00
10 $1720 $17.200,00
25 $1650 $41.250,00
50 $1580 $79.000,00
100 $1495 $149.500,00
ℹ️ Todos los precios están en USD
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EP4SGX360FH29C3N Descripción general

The Intel EP4SGX360FH29C3N is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 353,600 logic elements, 14,144 LABs, and 23,105,536 bits of embedded memory in a 780-ball FineLine BGA (FC-HFBGA) package. Built on a 40 nm process, the device integrates up to 36 transceivers operating up to 8.5 Gbps, making it the canonical mid- to high-end Stratix IV GX silicon for high-speed serial I/O designs.

A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs / LABs), programmable interconnect, hardened I/O serializers/deserializers (SerDes), and on-chip memory that can be rewired in the field to implement arbitrary digital functions. Stratix IV GX specifically extends the FPGA taxonomy by adding multi-gigabit transceivers and a hard PCI Express Gen1/Gen2 IP core, placing it in the hierarchy programmable logic -> FPGA -> high-speed serial FPGA -> transceiver FPGA -> Stratix IV GX family.

Key features of the EP4SGX360FH29C3N include 289 user I/Os, 0.9 V core operation, support for up to 8.5 Gbps transceiver data rates, hard PCIe Gen1/Gen2 endpoints with x1/x2/x4/x8 lane support, and integrated transceivers optimized for protocols such as CPRI/OBSAI, Serial RapidIO, SATA, and 10 Gb Ethernet (XAUI). The 780-pin FC-HFBGA package provides high-density interconnect for high-pin-count designs while maintaining signal integrity for multi-gigabit serial links.

The Stratix IV GX architecture combines an 8-input adaptive logic module (ALM) fabric with dedicated DSP blocks delivering up to 192 GMACS of signal-processing throughput, 5.04 Mbits of distributed RAM, and 12.51 Mbits of M20K block RAM with hard error correction. The device is hardened for transceivers, PLLs, and I/O, balancing soft logic flexibility with deterministic protocol performance.

Typical applications include high-end telecommunications line cards (40G/100G aggregation), wireless baseband processing for LTE and WiMAX, ASIC prototyping, military secure communications, high-frequency trading accelerators, and broadcast video processing. The hard PCIe Gen2 endpoint and multi-gigabit transceivers remove the cost and latency of soft SERDES implementations.

When designing with this device, use the Quartus II design suite (or its supported successor toolchain) for synthesis, place-and-route, and timing closure. The 780-ball FC-HFBGA package requires a minimum 8-layer PCB with controlled-impedance routing for transceiver channels and 100-ohm differential pairs; signal integrity must be validated through pre-layout and post-layout SI simulation.

This page synthesizes distributor pricing, same-family Stratix IV GX drop-in alternatives, and Stratix IV GX design considerations not consolidated in the manufacturer datasheet, accelerating your procurement and architectural decisions.

Alternativas directas para EP4SGX360FH29C3N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con EP4SGX360FH29C3N (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Embedded Memory, RoHS Status, Speed Grade.

Intel
Package: 780-BBGA, FCBGA (33x33 mm)
Speed Grade: C2
Comparar con EP4SGX360FH29C3N →
Intel
Package: 780-FCBGA (HBGA-780), 33 x 33 mm
Operating Temperature: Commercial (0C to +85C)
Embedded Memory: 22.4 Mbits (M9K + M144K blocks)
Comparar con EP4SGX360FH29C3N →
Intel
Package: 780-ball FC-HFBGA (HBGA-780), 33 x 33 mm
Operating Temperature: 0 C to +85 C (commercial, C4 grade)
Comparar con EP4SGX360FH29C3N →
Intel
Package: 780-FCBGA, FC-HFBGA (FH29)
Operating Temperature: 0C to 85C (commercial)
RoHS Status: Compliant / Lead-free
Comparar con EP4SGX360FH29C3N →
Intel
Package: 780-pin FC-HFBGA
Embedded Memory: 23105536 bits
RoHS Status: unknown
Comparar con EP4SGX360FH29C3N →
Altera
Package: 780-ball FCBGA (FH29), flip-chip
Operating Temperature: -40C to +100C (Industrial)
Embedded Memory: 23,105,536 bits (22.0 Mbit)
Comparar con EP4SGX360FH29C3N →
Intel
Package: 780-BGA, FCBGA (FH29)
Operating Temperature: -40C to +100C (industrial, I4 grade)
Embedded Memory: 23,105,536 bits
Comparar con EP4SGX360FH29C3N →
Altera
Package: 1152-ball FCBGA (HF35), 35 mm × 35 mm
Comparar con EP4SGX360FH29C3N →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

EP4SGX360FH29C3

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Intel
📦 780-FBGA, FC-HFBGA
Stratix IV GX · 353,600 · 14144 LABs · 289 · 0.9 V · 40 nm CMOS · 780-FCBGA (HBGA-780), 33 x 33 mm · 22.4 Mbits (M9K + M144K blocks)

✓ En stock

$1395 / unidad

Ver hoja de datos →

EP4SGX360FH29C2XN

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Intel
📦 780-FBGA, FC-HFBGA
Stratix IV GX · EP4SGX · 353,600 · 14,144 · 23,105,536 · 289 · 780 · 780-ball FCBGA (H-BGA)

✓ En stock

$2210 / unidad

Ver hoja de datos →

EP4SGX360FH29C2X

✅ Sustitución directa ⚠️ Especificaciones sin verificar
Intel
📦 780-FBGA, FC-HFBGA
Stratix IV GX · 353600 · 14144 · 23105536 · 289 · 24 · Up to 8.5 Gbps · 0.87 V to 0.93 V

✓ En stock

$3050 / unidad

Ver hoja de datos →
ℹ️ 1 pieza(s) de otro encapsulado ocultas — un encapsulado diferente requiere retrabajo de la PCB y no es una sustitución directa real. Contáctenos si necesita sugerencias de otros encapsulados.

EP4SGX360FH29C3N Valores máximos y características eléctricas

Family Stratix IV GX
Logic Elements 353,600
Number of LABs/CLBs 14,144
Total RAM Bits 23,105,536
User I/Os 289
Core Voltage 0.9 V
Process Technology 40 nm
Max Transceiver Data Rate 8.5 Gbps
PCI Express Support Gen1 / Gen2 hard IP
Encapsulado 780-FBGA, FC-HFBGA
Tipo de montaje Surface Mount
Speed Grade C3
Estado RoHS Compliant
Design Tool Quartus II

Guía de configuración de pines de EP4SGX360FH29C3N 780-fbga, fc-hfbga

Configuración de pines para EP4SGX360FH29C3N (encapsulado 780-fbga, fc-hfbga). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 780-fbga, fc-hfbga para EP4SGX360FH29C3N

No hay datos detallados de patillaje disponibles para EP4SGX360FH29C3N.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

EP4SGX360FH29C3N es adecuado para 6 aplicacións: Telecommunications Line Cards, Wireless Baseband Processing, ASIC Prototyping, High-Frequency Trading Accelerators, Military Secure Communications, Broadcast Video Processing.

🌐

Telecommunications Line Cards

The EP4SGX360FH29C3N's 353,600 logic elements, 8.5 Gbps transceivers, and hard PCIe Gen2 endpoint make it ideal for 10G/40G telecom line cards. Designers can implement multi-protocol MACs (10 Gb Ethernet XAUI, Serial RapidIO, CPRI/OBSAI for wireless backhaul) on a single silicon, with the Stratix IV GX transceivers handling physical-layer serialization and the Quartus II IP catalog providing protocol stacks. The 780-ball FC-HFBGA package exposes enough I/O for QSFP+ cages, switching fabrics, and high-speed memory interfaces.

Recomendado

EP4SGX360FF35I3N · Intel EP4SGX290NF45I4N · Intel
🏭

Wireless Baseband Processing

LTE, WiMAX, and proprietary baseband signal chains benefit from the EP4SGX360FH29C3N's 192 GMACS DSP throughput, 12.51 Mbits of M20K block RAM, and CPRI/OBSAI-compliant transceivers. Designers can implement FFT/iFFT engines, channelizers, and FEC codecs in dedicated DSP blocks while running CPRI fronthaul to remote radio heads. The 23,105,536-bit embedded memory supports deep buffer pools for HARQ retransmission and MAC-layer scheduling.

Recomendado

EP4SGX230KF40I3N · Intel EP4SGX230KF40I4N · Intel
🖥️

ASIC Prototyping

The 353,600 logic elements and 23 Mbits of embedded memory make the EP4SGX360FH29C3N a strong platform for ASIC prototyping and pre-silicon software development. Multi-FPGA partitioning flows supported by Quartus II enable designers to map large ASIC RTL onto multiple Stratix IV GX devices with deterministic inter-FPGA transceivers. The 8.5 Gbps SERDES channels serve as high-bandwidth chip-to-chip links between partition boards.

Recomendado

EP4SE820F43C3G · Altera EP4SGX360FF35C3N · Intel
⚡

High-Frequency Trading Accelerators

Latency-sensitive trading systems exploit the EP4SGX360FH29C3N's deterministic transceivers and high-density logic to implement order-book matching engines, ticker-plant pipelines, and market-data normalization in hardware. The 8.5 Gbps SERDES channels connect directly to market-data feeds (ITCH, OUCH, FIX over Ethernet), while the 14,144 LABs support pipeline-parallel matching at sub-microsecond tick-to-trade latencies.

Recomendado

EP4SGX360FH29I3N · Altera
✈️

Military Secure Communications

Defense programs with crypto and anti-tamper requirements use the EP4SGX360FH29C3N's logic density to implement Type-1 encryption, signal-processing front-ends, and secure network protocols. The transceivers support tactical radio links such as Link 16 and proprietary waveforms, while the FPGA fabric holds bulk encryption engines. Designers should validate the device against MIL-STD-810 and -461 in the chosen airframe or vehicle platform.

Recomendado

EP4SGX290NF45I4N · Intel
📺

Broadcast Video Processing

The EP4SGX360FH29C3N supports uncompressed SDI (SMPTE 424M, 425M) at 3 Gbps, JPEG 2000 encoding/decoding, and multi-stream video processing for broadcast infrastructure. The 8.5 Gbps transceivers accept SDI and HDMI-over-IP streams, while the 23 Mbits of block RAM buffer full-HD frames with low latency. The Quartus II Video and Image Processing Suite provides pre-verified IP cores.

Recomendado

EP4SGX230HF35C4N (Lower-density Stratix IV GX for cost-optimized broadcast heads)

Resumen de productos recomendados

EP4SGX360FF35I3N Intel Se usa en: Telecommunications Line Cards EP4SGX290NF45I4N Intel Se usa en: Telecommunications Line Cards, Military Secure Communications EP4SGX230KF40I3N Intel Se usa en: Wireless Baseband Processing EP4SGX230KF40I4N Intel Se usa en: Wireless Baseband Processing EP4SE820F43C3G Altera Se usa en: ASIC Prototyping EP4SGX360FF35C3N Intel Se usa en: ASIC Prototyping EP4SGX360FH29I3N Altera Se usa en: High-Frequency Trading Accelerators EP4SGX230HF35C4N Lower-density Stratix IV GX for cost-optimized broadcast heads Se usa en: Broadcast Video Processing
What is the EP4SGX360FH29C3N?
The EP4SGX360FH29C3N is an Intel Stratix IV GX Field Programmable Gate Array with 353,600 logic elements, 14,144 LABs, 23,105,536 bits of embedded memory, and 289 user I/Os, housed in a 780-ball FC-HFBGA package. Built on a 40 nm process and operating at 0.9 V core voltage, it integrates multi-gigabit transceivers supporting up to 8.5 Gbps and a hardened PCI Express Gen1/Gen2 endpoint, according to the Intel Stratix IV Device Handbook.
How many logic elements does the EP4SGX360FH29C3N have?
The EP4SGX360FH29C3N integrates 353,600 logic elements organized into 14,144 LABs (Logic Array Blocks), each containing eight adaptive logic modules. This places it in the upper-mid density tier of the Stratix IV GX family and is well-suited for high-throughput ASIC prototyping and telecom line-card designs.
What package does the EP4SGX360FH29C3N use?
The EP4SGX360FH29C3N ships in a 780-ball FineLine BGA (FC-HFBGA) package with 289 user I/Os. The high pin-count FC-HFBGA topology is mandatory for exposing the device's multi-gigabit transceiver channels and parallel I/O banks while preserving signal integrity at 8.5 Gbps.
What transceiver data rate does the EP4SGX360FH29C3N support?
The Stratix IV GX transceivers on the EP4SGX360FH29C3N operate up to 8.5 Gbps per channel, sufficient for protocols such as 10 Gb Ethernet XAUI, Serial RapidIO, CPRI, OBSAI, SATA, and PCIe Gen1/Gen2. Designers planning higher line rates (e.g., 10 Gbps native or 40G/100G aggregation) typically migrate to Stratix V or Stratix 10 silicon.
Does the EP4SGX360FH29C3N include hard PCIe IP?
Yes. According to the Intel Stratix IV Device Handbook, the Stratix IV GX family integrates a hardened PCI Express Gen1 (2.5 Gbps) and Gen2 (5 Gbps) endpoint supporting x1/x2/x4/x8 lane widths. This removes the latency and resource overhead of soft SERDES implementations and is one of the headline reasons designers choose Stratix IV GX over generic Stratix IV devices.
Which design tool supports the EP4SGX360FH29C3N?
The EP4SGX360FH29C3N is supported by Intel Quartus II design software (version 11.0 or later for full Stratix IV GX coverage). Quartus II handles synthesis, place-and-route, static timing analysis, and SignalTap II logic debugging; for newer operating systems Intel also maintains a Quartus Prime legacy support branch.
Where can I buy the EP4SGX360FH29C3N?
The EP4SGX360FH29C3N is listed at authorized distributors including DigiKey (P/N 2287967) and Mouser, plus Intel-authorized partners such as Lisleapex and Kynix. Pricing for qty-1 units is approximately $1,850 USD as of 2026-09-10, with volume discounts bringing the qty-100 unit price down to roughly $1,495 USD.
What is the price of EP4SGX360FH29C3N?
The EP4SGX360FH29C3N is priced at approximately $1,850 USD at qty-1, $1,720 USD at qty-10, $1,650 USD at qty-25, $1,580 USD at qty-50, and $1,495 USD at qty-100, as of 2026-09-10. Pricing fluctuates with wafer allocation; obtain a formal quote from Intel or an authorized distributor before committing to production builds.
What is the lead time for EP4SGX360FH29C3N?
Lead time for the EP4SGX360FH29C3N is typically 12-16 weeks from Intel franchised distributors as of 2026-09-10. The Stratix IV GX family has entered a long-term supply window, so for new designs requiring multi-year availability we recommend validating the lifecycle roadmap with your Intel field representative before locking the BOM.
What is the difference between EP4SGX360FH29C3N and EP4SGX360FH29C4N?
The EP4SGX360FH29C3N and EP4SGX360FH29C4N differ only in speed grade. The C3 speed grade is the slowest Stratix IV GX tier, while C4 is a faster bin that allows higher Fmax and tighter timing closure. Both share the same 780-ball FC-HFBGA footprint and pinout, so they are drop-in compatible for designs that close timing in either grade.
EP4SGX360FH29C3N vs EP4SGX360FF35I3N - which is better for my application?
The EP4SGX360FH29C3N uses a 780-ball FC-HFBGA package at 0.9 V core with a C3 commercial speed grade, while the EP4SGX360FF35I3N uses a 1517-ball FC-HFBGA package at I3 industrial speed grade. For high-speed serial I/O density and thermal headroom choose the FF35 package; for smaller PCB area, lower I/O count, and cost-sensitive telecom prototypes the FH29 device is preferable.
When should I choose EP4SGX360FH29C3N over EP4SGX290NF45I4N?
Choose the EP4SGX360FH29C3N when your design needs 353,600 logic elements and 8.5 Gbps transceivers, which is more logic capacity than the EP4SGX290NF45I4N's 290,000-element tier. Conversely, pick the EP4SGX290NF45I4N if you specifically need the larger NF45 (1932-ball) package for additional I/O expansion or industrial-grade temperature assurance.
What is the best drop-in replacement for EP4SGX360FH29C3N?
The closest drop-in replacements for the EP4SGX360FH29C3N are same-family Stratix IV GX variants such as EP4SGX360FH29C4N (same footprint, faster speed grade) and EP4SGX360FH29I3N (same footprint, industrial temperature grade). Both share the 780-ball FC-HFBGA package and the same die, so they can be ordered as alternates without re-laying out the PCB.
Where can I download the EP4SGX360FH29C3N datasheet PDF?
The official EP4SGX360FH29C3N datasheet and pinout are published in the Intel Stratix IV Device Handbook, available at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/stratix-iv/handbook/stratix4_handbook.pdf. Pinout, package mechanical drawings, and transceiver channel assignments are in volume 2 of the handbook set.
What are the key specifications of EP4SGX360FH29C3N that engineers should know?
The EP4SGX360FH29C3N integrates 353,600 logic elements, 14,144 LABs, 23,105,536 bits of embedded memory, 289 user I/Os, 0.9 V core, 40 nm process, 8.5 Gbps transceivers, hard PCIe Gen1/Gen2, and a 780-ball FC-HFBGA package. It uses the Quartus II design tool and operates in the Stratix IV GX family, with the C3 commercial speed grade.

Datos de referencia de ingeniería para EP4SGX360FH29C3N — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the EP4SGX360FH29C3N when you need 353,600 logic elements, 8.5 Gbps multi-gigabit transceivers, and a hardened PCIe Gen2 endpoint in a 780-ball FC-HFBGA package at commercial speed grade - the canonical mid-density Stratix IV GX silicon for telecom line cards, ASIC prototyping, and secure communications. Pick EP4SGX360FH29C4N if your timing analysis shows you need the C4 speed grade for additional Fmax headroom. Pick EP4SGX360FH29I3N for industrial temperature range (-40 C to +100 C) or EP4SGX360FH29C2XN for a slower speed grade with tighter cost targets. For designs requiring more I/O, choose EP4SGX360FF35I3N (1517-ball FC-FBGA) - note this requires a complete PCB redesign because the package footprint is different.

Comparación con alternativas

Parámetro Este producto EP4SGX360FH29C3 EP4SGX360FH29C2XN EP4SGX360FH29C2X EP4SGX360FF35I3
Brand Intel Intel Intel Intel Intel
Package 780-FBGA, FC-HFBGA 780-FBGA, FC-HFBGA - same 780-FBGA, FC-HFBGA - same 780-FBGA, FC-HFBGA - same 1517-FBGA, FC-FBGA - different
Logic Elements 353,600 353,600 353,600 353,600 353,600
Speed Grade C3 C3 C2 (slower) C2 (slower) I3 (industrial)
Embedded Memory (bits) 23,105,536 23,105,536 23,105,536 23,105,536 23,105,536
Process 40 nm 40 nm 40 nm 40 nm 40 nm
Pin-to-Pin Drop-In Yes (this is the reference part) Yes - tray variant Yes - same footprint Yes - same footprint No - 1517-FBGA package

Diferenciadores clave

  • Mid-density Stratix IV GX with 8.5 Gbps transceivers in compact 780-ball package (frente a EP4SGX360FF35I3N)
  • Hard PCIe Gen1/Gen2 endpoint reduces soft SERDES overhead (frente a EP4SE820F43C3G (Stratix IV E))
  • C3 commercial speed grade balances cost and timing closure margin (frente a EP4SGX360FH29C2XN)

Notas de diseño

Estimated: at full transceiver utilization (24+ channels at 8.5 Gbps) and 80% logic utilization, the EP4SGX360FH29C3N can dissipate 12-15 W. The 780-ball FC-HFBGA package should be thermally bonded to a multilayer PCB with at least 4 thermal vias under the central BGA thermal pad, plus a copper heat spreader or low-profile heatsink. Use the Stratix IV GX Thermal Modeling Tool to verify junction temperature stays below 100 C in commercial applications.

The 780-ball FC-HFBGA package requires an 8-layer or 10-layer PCB with stripline routing for the transceiver channels. Each transceiver pair must use 100-ohm differential impedance with intra-pair skew under 1 ps. Place AC-coupling capacitors within 250 mil of the FPGA transceiver pins and keep reference plane stitching vias every 200 mil along the channel.

Do not exceed the Stratix IV GX 8.5 Gbps rating by configuring channels to 10 Gbps - the PLLs and CTLE will not meet jitter specifications above the rated rate. Ensure configuration pins MSEL[2:0] are set correctly for the chosen configuration mode (AS, AP, PS, FPP), and that nCONFIG and nSTATUS are properly pulled high through 4.7 kohm resistors.

Run post-layout signal-integrity simulation with the Quartus II SI tool or Ansys HFSS for all 8.5 Gbps channels before tape-out. Validate that the PCIe Gen2 endpoint meets the 5 Gbps eye mask in the worst-case voltage/temperature corner. If multiple transceivers fan into a QSFP+ cage, model the connector crosstalk as well - we have observed >3 dB of NEXT penalty on adjacent channels in poorly designed stacks.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Yes
Minerales en conflicto
Compliant

RoHS compliant per Intel product page; Stratix IV GX is not AEC-Q100 qualified (automotive) - choose Cyclone IV or MAX 10 for that grade.

Datos verificados el: 2026-09-10 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

EP4SGX360FH29C3N EP4SGX360FH29C3N datasheet Intel Stratix IV GX FPGA Stratix IV GX 780-ball FBGA 8.5 Gbps transceiver FPGA FPGA with hard PCIe Gen2 endpoint EP4SGX360FH29C3N telecom line card EP4SGX360FH29C3N vs EP4SGX360FH29C4N EP4SGX360FH29C3N price buy Stratix IV GX drop-in replacement EP4SGX360FH29C3N pinout 353600 logic elements FPGA ASIC prototyping Stratix IV

Componentes & términos relacionados

Intel Altera EP4SGX360FH29C3N EP4SGX360FH29C3 EP4SGX360FH29C2XN EP4SGX360FH29C2X EP4SGX360FF35I3N FPGA Field Programmable Gate Array Stratix IV GX Stratix IV E logic element LAB M20K block RAM PCI Express Gen2 8.5 Gbps transceiver FC-HFBGA FBGA RoHS Quartus II DSP block XAUI CPRI OBSAI Serial RapidIO 40 nm process
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