EPF10K100EQC240-1N - 100K-Gate FLEX 10KE FPGA, 240-PQFP | Intel
N.º de pieza: EPF10K100EQC240-1N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $74.2 | $742,00 |
| 100 | $67.8 | $6.780,00 |
| 500 | $61.4 | $30.700,00 |
| 1.000 | $55.95 | $55.950,00 |
EPF10K100EQC240-1N Descripción general
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines configurable logic blocks (LABs), programmable interconnect, and I/O cells into a single SRAM-based fabric. The FLEX 10KE family introduced an embedded array block (EAB) architecture that mixes distributed logic with embedded memory blocks, enabling System-on-a-Programmable-Chip (SOPC) integration. In the broader taxonomy, FPGAs sit above CPLDs in logic capacity but below ASICs in fixed-function performance; the FLEX 10KE is positioned as a low-cost, mid-density bridge between discrete glue logic and high-end FPGA families such as APEX and Stratix.
Key features of the EPF10K100EQC240-1N include 624 logic array blocks (LABs), an internal toggle frequency up to 333.33 MHz, JTAG-compliant IEEE 1149.1 boundary-scan test support, multi-volt I/O for interfacing with 2.5 V, 3.3 V, and 5 V buses, and in-system programmability via the passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), and JTAG configuration modes. The 240-pin PQFP package has a generous thermal pad for socket or socketed SMT assembly and is the highest-I/O-count package option for the FLEX 10KE 100K-gate density grade.
Typical applications include telecommunication line cards, industrial control bridges, legacy PCI/ISA bus interfaces, prototyping platforms for ASIC emulation, and embedded control systems where deterministic SRAM-based logic is required. Because the design is SRAM-volatile, configuration must be reloaded at power-up from a serial EPROM or microcontroller, which is the standard pattern for FLEX 10KE designs. The wide MultiVolt I/O makes it a strong choice for boards that mix 3.3 V ASIC/ASSP logic with 5 V peripheral buses. Designers should review Altera Application Note 33 (Configuring FLEX 10K Devices) and Application Note 38 (IEEE 1149.1 Boundary-Scan Testing) for in-system programming and JTAG recommendations.
This page consolidates distributor inventory, drop-in and same-footprint alternatives, and design notes from real manufacturer documentation to give engineers a more actionable view than the bare datasheet.
Alternativas directas para EPF10K100EQC240-1N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPF10K100EQC240-1N (mismo factor de forma y huella) — difiere en Family, Total RAM Bits, Speed Grade, Package / Case, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPF10K100EQC240-1
✅ Sustitución directa✓ En stock
$18.5 / unidad
Ver hoja de datos →EPF10K100EQC240-2
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$198 / unidad
Ver hoja de datos →EPF10K100EQC240-3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$55.5 / unidad
Ver hoja de datos →EPF10K100BQC240-1
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$119 / unidad
Ver hoja de datos →EPF10K100BQC240-2
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$115 / unidad
Ver hoja de datos →EPF10K100BQC240-3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$16.95 / unidad
Ver hoja de datos →EPF10K100EQC240-1N Valores máximos y características eléctricas
| Series | FLEX 10KE |
| Logic Cells | 4,992 |
| Typical Gates | 100,000 |
| Logic Array Blocks (LABs) | 624 |
| Embedded RAM Bits | 49,152 |
| User I/Os | 189 |
| Max Internal Frequency | 333.33 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.375 V to 2.625 V (2.5 V nominal) |
| I/O Standards Supported | MultiVolt (2.5 V, 3.3 V, 5 V) |
| Encapsulado / Carcasa | 240-BFQFP (PQFP 32 x 32 mm) |
| Supplier Device Package | 240-PQFP |
| Temperatura de funcionamiento | 0 °C to 70 °C (commercial) |
| Configuration Modes | PS, PPS, PPA, JTAG (IEEE 1149.1) |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de EPF10K100EQC240-1N 240-pqfp
Configuración de pines para EPF10K100EQC240-1N (encapsulado 240-pqfp). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPF10K100EQC240-1N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPF10K100EQC240-1N es adecuado para 6 aplicacións: Telecommunication Line-Card Glue Logic, Industrial Control Bus Bridges (PCI/ISA/VME), ASIC Prototyping and Emulation, Legacy Display and Video Interface Bridging, Embedded Motor and Servo Control, Legacy Data Acquisition Systems.
Telecommunication Line-Card Glue Logic
The EPF10K100EQC240-1N's 100K gates and 189 user I/Os make it a natural fit for telecom line-card glue logic, where it bridges between a network processor ASIC, TDM framer, and backplane SERDES. The 2.5 V core supply with MultiVolt I/O (2.5 V/3.3 V/5 V) allows direct interface to legacy 5 V framer logic and modern 3.3 V ASICs without external level shifters. The 49,152 bits of embedded array block (EAB) RAM provide on-chip buffering for small packet queues, lookup tables, or HDLC FIFO descriptors. Designers typically use the passive-serial configuration mode to load the bitstream from a small EPC1/EPC2 configuration EPROM at power-up, since the SRAM-volatile fabric requires reconfiguration every power cycle. The 240-pin PQFP package simplifies rework in production environments where JTAG-equipped ATE stations can re-flash the configuration EPROM without removing the FPGA.
Recomendado
Industrial Control Bus Bridges (PCI/ISA/VME)
The EPF10K100EQC240-1N is widely used as a bridge between legacy industrial buses (PCI, ISA, VME) and modern processors, where the 189 user I/Os can absorb the wide parallel buses typical of these interfaces. The MultiVolt I/O allows direct 5 V bus signalling on legacy rails and 3.3 V signalling to embedded CPUs without external transceivers. The 624 LABs and 4,992 logic cells provide enough capacity to implement state machines for DMA, interrupt controllers, and bus-arbitration logic in a single device, replacing multiple discrete 74-series TTL parts. The commercial 0 °C to 70 °C temperature range fits indoor cabinet environments, and the PQFP-240 package is well suited to socketed designs that allow easy field replacement. Designers should follow Altera Application Note 117 for PCI-compliant I/O implementation if a true PCI bridge is required.
Recomendado
ASIC Prototyping and Emulation
The EPF10K100EQC240-1N is a popular ASIC-emulation platform for designs in the 80K to 100K-gate range, where its SRAM-based fabric can be re-flashed in seconds to test multiple RTL revisions. The 49,152 bits of EAB RAM allow mapping of register files and small caches directly into the FPGA without external SRAM, simplifying the emulation board. The 240-pin PQFP package is widely supported by inexpensive PQFP-to-DIP adapters, enabling prototyping on through-hole breadboards before committing to BGA-based FPGAs. Engineers typically use the JTAG configuration mode (IEEE 1149.1) for fast bitstream download during iteration cycles and the passive-serial mode for the final production emulation. This application is one of the most common use cases documented in Altera's FLEX 10KE reference designs.
Recomendado
Legacy Display and Video Interface Bridging
The EPF10K100EQC240-1N can bridge between TTL/LVDS video sources and modern LVDS display panels, providing colour-space conversion, frame-rate adaptation, and timing generation in a single chip. The 189 I/Os accommodate the wide parallel video bus typical of XGA/SXGA panels (24-bit RGB plus clock, sync, and control signals), while the 333 MHz internal frequency supports pixel clocks up to the LVDS threshold of typical SXGA panels. The 49,152 bits of EAB RAM can be configured as line buffers for video scaling or as lookup tables for gamma correction. The MultiVolt I/O interface enables direct connection to 5 V video DACs and 3.3 V LCD timing controllers on the same board. This application was widely deployed in pre-Cyclone industrial panel PCs and remains in long-lifecycle medical and instrumentation displays.
Recomendado
Embedded Motor and Servo Control
The EPF10K100EQC240-1N's 624 LABs are well suited to multi-axis motor and servo controllers, where each axis requires quadrature decoder, PID loop, and PWM generator logic. The EAB blocks can store motion profiles and trajectory tables directly in the FPGA, eliminating an external EEPROM. The 189 I/Os comfortably absorb multiple encoder inputs (typically 4 channels per axis for A/B/index), Hall-sensor feedback, and PWM outputs across 3 to 6 axes. Designers implement deterministic closed-loop control at 20 to 40 kHz per axis with the FLEX 10KE's distributed register fabric, avoiding CPU jitter. The 2.5 V core and MultiVolt I/O allow direct interface to 24 V industrial gate drivers with opto-isolated feedback, a common pattern in CNC and robotics control cabinets.
Recomendado
Legacy Data Acquisition Systems
The EPF10K100EQC240-1N serves as the timing and control hub in multi-channel data-acquisition systems, where it generates per-channel ADC sample clocks, sequences multiplexer addresses, and formats parallel data for DMA transfer to a host CPU. The 49,152-bit EAB RAM can be configured as dual-port FIFOs between the ADC bus and the host interface, eliminating external FIFO chips in many cases. The MultiVolt I/O is particularly valuable in mixed-signal DAQ boards where the analog front end runs at ±5 V or ±12 V and the host interface is 3.3 V PCI or 5 V ISA. The PQFP-240 package has a generous thermal envelope and is well suited to socketed boards that need to support both 5 V and 3.3 V analog sub-systems.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPF10K100EQC240-1N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPF10K100EQC240-1 | EPF10K100EQC240-2 | EPF10K100EQC240-3 | EPF10K100BQC240-1 | EPF10K100BQC240-2 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 240-PQFP (32x32 mm) | 240-PQFP (32x32 mm) | 240-PQFP (32x32 mm) | 240-PQFP (32x32 mm) | 240-PQFP (32x32 mm) | 240-PQFP (32x32 mm) |
| Logic Cells | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Embedded RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 0 (no EAB) | 0 (no EAB) |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
| Speed Grade | -1 (fastest commercial) | -1 | -2 | -3 | -1 | -2 |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KB | FLEX 10KB |
| Termination Finish | Pb-free (lead-free) | Leaded (SnPb) | Pb-free | Pb-free | Pb-free | Pb-free |
Diferenciadores clave
- Highest-I/O count in FLEX 10KE 100K-gate density grade (frente a EPF10K100EQC208-1N (208-PQFP))
- Pb-free termination finish on a fully compatible footprint (frente a EPF10K100EQC240-1 (leaded))
- Embedded array blocks (EAB) for distributed RAM and ROM (frente a EPF10K100BQC240-1 (FLEX 10KB))
Notas de diseño
The EPF10K100EQC240-1N requires a stable 2.5 V core supply with ±5% tolerance (2.375 V to 2.625 V). Use a low-noise LDO or DC-DC regulator followed by LC filtering to suppress the high-frequency current transients typical of SRAM-based FPGA fabrics during configuration. Decouple VCCINT pins with 0.1 µF ceramic capacitors placed as close as possible to each supply pin, plus a single 10 µF bulk capacitor per device. The MultiVolt I/O banks (VCCIO) can be powered independently at 2.5 V, 3.3 V, or 5 V to match the bus being driven.
The FLEX 10KE is SRAM-volatile and loses its configuration when power is removed. Always pair it with a configuration EPROM such as EPC1 or EPC2 in passive-serial mode for power-up boot. Leaving MSEL pins floating will cause undefined configuration behavior; tie MSEL0 and MSEL1 to the documented logic levels for the chosen mode. Be cautious of the VCCINT ramp time — the nCONFIG pin must be held low until VCCINT reaches the minimum 2.375 V threshold to prevent partial configuration.
Estimated: the PQFP-240 package's thermal resistance (θJA) is approximately 20 C/W on a standard 4-layer JEDEC test board with no airflow. Under a worst-case design toggling 75% of logic at 100 MHz, the EPF10K100EQC240-1N dissipates around 2 W, yielding a junction temperature rise of ~40 C above ambient — well within the 0 °C to 70 °C commercial range. For designs near the upper current limit, add copper pours under the exposed die paddle and provide 100 LFM of airflow to maintain margin.
Route the JTAG chain (TDO/TMS/TCK/TDI) as a single daisy-chain with no stubs and place a 33 Ω series-termination resistor close to each driver. Keep configuration clock (DCLK) traces short and length-matched within the FLEX 10KE device group to avoid setup/hold violations at the configuration EPROM. Reserve a clear keep-out area beneath the PQFP for socket installation if your production plan uses through-hole sockets for field replacement.
Información de cumplimiento
The '-1N' suffix indicates Pb-free termination finish. RoHS/REACH compliance certificates are not present in the Verified Web Data; designers should request the latest Intel PCN or Rochester Electronics manufacturer statement of compliance (MSL, RoHS, REACH) before shipping into RoHS-regulated regions. Not AEC-Q100 qualified (commercial temperature grade only).
