EPM240F100C4N - MAX II 192 Macro Cell CPLD, 4.7ns, 100-FBGA | Intel
N.º de pieza: EPM240F100C4N ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.05 | $12,05 |
| 10 | $10.85 | $108,50 |
| 100 | $9.4 | $940,00 |
| 500 | $8.2 | $4.100,00 |
| 1.000 | $7.05 | $7.050,00 |
EPM240F100C4N Descripción general
A Complex Programmable Logic Device (CPLD) is a non-volatile, deterministic-latency logic IC that sits between discrete 74-series glue logic and FPGAs in the programmable logic hierarchy. CPLDs use flash or EPROM configuration cells and a classic AND/OR PLA-style macro structure to provide predictable propagation delays independent of routing complexity, making them ideal for I/O expansion, bus bridging, and power-up control tasks that must execute before a host processor or FPGA boots.
Key features of the EPM240F100C4N include 192 logic elements, 80 user I/Os, 4.7 ns tPD (commercial speed grade C4), in-system programmability via JTAG, and a multi-voltage I/O bank that supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces on the same die. The MAX II architecture eliminates external configuration memory, reducing BOM cost and PCB footprint versus traditional SRAM-based CPLDs that require a boot PROM.
Technically, the MAX II family uses a homogeneous Logic Array Block (LAB) fabric with each macro cell containing a programmable AND/OR term array and a flip-flop. The on-chip User Flash Memory (UFM) block can store up to 8 Kbits of user data, enabling embedded serial EEPROM replacement. The 100-ball FineLine BGA measures 11 mm × 11 mm with a 1.0 mm ball pitch, balancing routability with manufacturability for mainstream boards.
Typical applications include I/O expansion and level translation in industrial control, glue logic and bus decoding around processors and FPGAs, power-sequencer controllers, LED and display driving, and communication interface bridging (UART, SPI, I²C). The instant-on behavior also suits safety-critical deterministic start-up logic in automotive subsystems and medical devices.
When designing with this device, allocate decoupling capacitance within 5 mm of each supply pin, observe the I/O bank voltage constraints, and respect JTAG chain ordering when multiple programmable devices share a single download cable. The commercial C4 speed grade is the fastest available for the 100-FBGA package and is appropriate for general-purpose logic consolidation.
Alternativas directas para EPM240F100C4N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EPM240F100C4N (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Programming Interface, RoHS Status, Configuration Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EPM240F100C5N
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EPM570F100C4N
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Ver hoja de datos →EPM240F100I5N
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Ver hoja de datos →EPM1270F256C5N
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Ver hoja de datos →EPM240F100C4N Valores máximos y características eléctricas
| Series | MAX II |
| Device Family | CPLD - Complex Programmable Logic Device |
| Macro Cells | 192 |
| Logic Elements | 240 |
| User I/Os | 80 |
| Propagation Delay (tPD) | 4.7 ns |
| Maximum Internal Frequency | 247.5 MHz |
| Supply Voltage - Core | 2.5 V / 3.3 V |
| I/O Bank Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.18 µm Flash |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) |
| User Flash Memory (UFM) | 8 Kbit |
| Encapsulado | 100-ball FineLine BGA (FBGA), 11 mm × 11 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | 0 °C to +85 °C (Commercial) |
| Speed Grade | C4 (fastest) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Estado RoHS | Compliant (lead-free) |
Guía de configuración de pines de EPM240F100C4N 100-ball fineline bga (fbga), 11 mm × 11 mm, 1.0 mm pitch
Configuración de pines para EPM240F100C4N (encapsulado 100-ball fineline bga (fbga), 11 mm × 11 mm, 1.0 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EPM240F100C4N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EPM240F100C4N es adecuado para 6 aplicacións: I/O Expansion and Level Translation, Power-Sequencer and Reset Controller, Industrial Bus Bridging (UART/SPI/I²C), FPGA Configuration and Glue Logic, LED Matrix and Display Driver, Automotive Subsystem Deterministic Logic.
I/O Expansion and Level Translation
The EPM240F100C4N's 80 user I/Os and multi-voltage I/O banks (1.5/1.8/2.5/3.3 V) make it an ideal I/O expander and level translator between processors, sensors, and legacy peripherals. Each I/O bank can be powered independently, so a 1.8 V MCU can communicate with 3.3 V peripherals and 5 V-tolerant legacy devices without external level-shift ICs. The 4.7 ns tPD keeps glue-logic latency well below typical MCU interrupt response times. Designers place the CPLD between the processor bus and the peripheral cluster, using macro cells to encode/decode chip selects and bus protocols.
Recomendado
Power-Sequencer and Reset Controller
The MAX II's instant-on non-volatile flash configuration makes the EPM240F100C4N a deterministic power-sequencer for multi-rail systems. Macro cells implement cascaded timers and watchdog logic that hold the host processor in reset until all rails are within tolerance, then sequence FPGA, ASIC, and memory power-up in the required order. The 247.5 MHz internal frequency supports fine-grained timing resolution, while the 8 Kbit User Flash Memory stores rail configuration parameters. Unlike an MCU-based sequencer, the CPLD has no firmware boot window and starts valid logic microseconds after VCC stabilizes.
Recomendado
Industrial Bus Bridging (UART/SPI/I²C)
Industrial systems routinely bridge UART, SPI, and I²C buses between incompatible voltage domains and packet formats. The EPM240F100C4N's 80 I/Os and 4.7 ns tPD handle multi-master arbitration, CRC generation, and protocol translation without software round-trip latency. The 2.5 V/3.3 V core plus 1.5-3.3 V I/O banks connect legacy RS-485 transceivers, modern 1.8 V SoCs, and 3.3 V sensors on the same board. The instant-on behavior ensures bus bridges are live before the host CPU boots, simplifying bring-up.
Recomendado
FPGA Configuration and Glue Logic
FPGA-based designs often need a CPLD companion to perform housekeeping before the FPGA finishes SRAM configuration. The EPM240F100C4N drives FPGA configuration mode pins, holds the FPGA in PROG_B, monitors DONE, and routes peripheral chips-selects during the FPGA's boot window. Its 192 macro cells easily hold the configuration state machine plus several decoded chip-selects, and the 4.7 ns tPD aligns with FPGAs that need sub-10 ns peripheral access latency at first power-up. The JTAG chain supports in-system programming of both the CPLD and the FPGA in one boundary-scan session.
Recomendado
LED Matrix and Display Driver
The EPM240F100C4N's 80 user I/Os and 247.5 MHz internal frequency make it a flexible LED matrix driver for commercial signage and industrial HMIs. Each macro cell implements one row/column PWM channel with refresh logic, and the on-chip UFM stores lookup tables for animations, gamma correction, and font data. The instant-on flash-based configuration means the display lights up the moment power is applied - critical for safety signage and emergency information panels. Designers pair the CPLD with external constant-current drivers for high-brightness LED arrays.
Recomendado
Automotive Subsystem Deterministic Logic
Although the EPM240F100C4N is a commercial-grade part, it is widely used as deterministic glue logic in non-safety automotive subsystems such as body controllers, infotainment I/O hubs, and instrument-cluster pre-processors. The MAX II architecture provides predictable tPD across all operating conditions, enabling sensor-fusion pre-processing and CAN/LIN bus gating without software variability. Designers needing full AEC-Q100 qualification select the EPM240F100I5N industrial-temp variant in the same footprint. The 8 Kbit UFM stores calibration constants that are read at every power-up.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EPM240F100C4N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EPM240F100C5N | EPM240F100C3N | EPM570F100C4N | EPM240F100I5N | EPM1270F256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 100-ball FineLine BGA (11x11 mm) | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 100-ball FineLine BGA - same | 256-ball FineLine BGA - same family, larger |
| Macro Cells | 192 | 192 | 192 | 440 | 192 | 980 |
| Logic Elements | 240 | 240 | 240 | 570 | 240 | 1270 |
| User I/Os | 80 | 80 | 80 | 76 | 80 | 212 |
| tPD (Propagation Delay) | 4.7 ns | ~5.0 ns | ~6.5 ns | 5.4 ns | ~5.5 ns | 6.2 ns |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C |
| Supply Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
Diferenciadores clave
- Fastest commercial speed grade in the MAX II family (frente a EPM240F100C5N)
- Higher logic density than the C5/C3 siblings (frente a EPM240F100C5N)
- Same density as EPM570 family but faster timing closure (frente a EPM570F100C4N)
Notas de diseño
Estimated: at typical 50% toggle rate on 80 I/Os at 100 MHz, the 3.3 V core draws roughly 30-50 mA. Place one 0.1 µF X7R decoupling capacitor within 5 mm of every VCCINT/VCCIO supply ball, and add a bulk 10 µF tantalum or ceramic cap near the package. The MAX II datasheet recommends separate analog and digital ground returns joined at a single point under the package to reduce SSO noise.
The 100-ball FineLine BGA uses a 1.0 mm pitch, which is well within the capability of standard 4/4 mil (0.1/0.1 mm) PCB manufacturing. Use microvias-in-pad if the board stack-up budget allows; otherwise dog-bone fan-out to inner signal layers. Per the MAX II handbook, route JTAG signals (TDO, TDI, TMS, TCK) with 50 Ω characteristic impedance and keep total chain length under 6 inches to avoid signal-integrity issues across the IEEE 1149.1 boundary-scan interface.
Do not mix I/O bank voltages on the same bank - the MAX II datasheet requires all I/Os in a single bank to share one VCCIO rail. Configure unused I/Os as outputs driving low or as inputs with internal pull-ups enabled to prevent floating-pin supply current. The C4 speed grade is the fastest commercial grade; if your design has timing margin, drop to C5 to gain 5-10% cost savings without changing the PCB footprint.
Información de cumplimiento
RoHS-compliant per distributor listings (lead-free FBGA). Commercial temperature grade; choose EPM240F100I5N for industrial-temperature requirements. No AEC-Q100 qualification - not recommended for safety-critical automotive subsystems.
