GTL2014PW,112 - 4-Bit LVTTL to GTL Transceiver | NXP
N.º de pieza: GTL2014PW,112 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1.15 | $1,15 |
| 10 | $1.04 | $10,40 |
| 100 | $0.86 | $86,00 |
| 500 | $0.71 | $355,00 |
| 1.000 | $0.58 | $580,00 |
GTL2014PW,112 Descripción general
A voltage level translator is a mixed-signal interface IC that allows logic blocks operating at different supply domains to exchange signals safely. Within the signal-chain hierarchy, translators sit between bus transceivers and buffers, forming part of the broader family of interface and logic ICs. GTL (Gunning Transceiver Logic) is a low-swing open-drain bus standard historically used for processor front-side buses and memory interfaces, where the bus voltage is defined relative to a reference voltage (Vref) such as 1.0 V or lower, while the system side typically runs at 3.3 V LVTTL.
Key features of the GTL2014 include its 4-bit bidirectional architecture with a single direction (DIR) control pin, allowing the device to act either as a GTL-to-LVTTL sampling receiver or as an LVTTL-to-GTL interface. The GTL-side threshold tracks the Vref pin, which supports GTL-, GTL, and GTL+ bus variants; according to the NXP datasheet, Vref tracks linearly down to 0.5 V for low-voltage CPU applications, a wider usable tracking range than the related GTL2005.
Technically, the device is fabricated in a BiCMOS process, combining bipolar drive capability for the low-impedance GTL bus with CMOS low static power on the LVTTL side. The GTL side uses open-drain outputs pulled up to VTT through bus termination resistors, so the translator dissipates termination power in the resistors rather than in the IC. Input/output capacitance on the B port is on the order of 3.4 pF to 4.3 pF per the datasheet, keeping bus loading low.
Typical applications include processor-to-memory bus translation in legacy server and networking platforms, backplane control lines bridging a 3.3 V microcontroller or FPGA to a GTL signaling bus, and mixed-voltage board-level upgrades of GTL-based systems. The four-bit width matches byte-strobe or chip-select groupings.
A key design consideration is that the GTL2014 is pin-to-pin backward compatible with the GTL2005, but the A-port and B-port labels are interchanged; propagation delays are slightly longer in exchange for better Vref linearity below 0.8 V, so drop-in migration from GTL2005 requires re-checking timing margin.
This page synthesizes verified distributor listings, the NXP product page, drop-in compatibility analysis, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para GTL2014PW,112 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con GTL2014PW,112 (mismo factor de forma y huella) — difiere en Direction Control, Function, Number of Channels, Package, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
GTL2005PW,112
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
GTL2014PW,112 Valores máximos y características eléctricas
| Función | 4-bit bidirectional LVTTL to GTL translating transceiver |
| Logic Family | GTL (BiCMOS technology) |
| Logic Type | BiCMOS |
| Number of Channels | 4 |
| Circuits per Channel | 1 |
| Input Level (A-side) | 3.3 V LVTTL |
| Output Level (B-side) | GTL-/GTL/GTL+ (Vref-referenced, tracks to 0.5 V) |
| Vref Tracking Range | Down to 0.5 V (linear tracking) |
| Direction Control | Yes (DIR pin) |
| B-port Input/Output Capacitance | 3.4 pF to 4.3 pF |
| Rango de temperatura de funcionamiento | -40C to +85C |
| Encapsulado | TSSOP-14 (SOT402-1), 4.4 mm body width |
| Tipo de montaje | Surface Mount |
| Topside Mark | GTL2014 |
| Compatibility | Pin-to-pin backward compatible to GTL2005 (A/B port labels interchanged) |
| Estado RoHS | Compliant (,112 suffix = RoHS-compliant ordering code) |
Guía de configuración de pines de GTL2014PW,112 tssop-14 (sot402-1), 4.4 mm body width
Configuración de pines para GTL2014PW,112 (encapsulado tssop-14 (sot402-1), 4.4 mm body width). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para GTL2014PW,112.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
GTL2014PW,112 es adecuado para 6 aplicacións: CPU Front-Side Bus Translation, Legacy Server and Networking Backplanes, Mixed-Voltage Board Upgrades, Test and Measurement Fixtures, Industrial Control Signal Bridging, Memory Subsystem Interface Translation.
CPU Front-Side Bus Translation
The GTL2014 was designed specifically for translating between a 3.3 V LVTTL system domain and GTL-/GTL/GTL+ processor buses. Its Vref-referenced GTL thresholds track linearly down to 0.5 V, which the NXP datasheet explicitly targets at low-voltage CPU applications where other translators lose threshold accuracy. In a typical platform, the four channels carry address strobes or control lines between a processor's low-swing GTL bus and 3.3 V support logic. The direction pin lets one device serve both read (GTL-to-LVTTL sampling receiver) and write (LVTTL-to-GTL) phases. With only 3.4 pF to 4.3 pF of B-port capacitance, added bus loading is minimal, preserving signal integrity on terminated GTL nets.
Recomendado
Legacy Server and Networking Backplanes
Server memory interfaces and networking backplanes from the GTL era use low-swing open-drain signaling referenced to VTT/Vref, while their management and control logic runs at 3.3 V LVTTL. The GTL2014 bridges these domains bidirectionally in a compact TSSOP-14 footprint, one device per four lines. Because the GTL side is open-drain, backplane termination resistors set the high level and the translator sinks current low - termination power is dissipated in resistors, not in the IC, simplifying board thermal design in dense chassis. The -40C to +85C operating range covers telecom rack environments. Designers sustaining these platforms should verify Vref value and timing margin, since the GTL2014's propagation delay is slightly longer than the GTL2005's.
Recomendado
Mixed-Voltage Board Upgrades
When retrofitting a modern 3.3 V FPGA or microcontroller into an existing GTL-signaled system, the GTL2014 provides a low-risk glue interface: four bidirectional channels in one TSSOP-14 that requires no firmware changes and no bus redesign. The Vref pin simply connects to the existing bus reference, and the thresholds follow it across GTL-, GTL, and GTL+ variants, so a single part number covers multiple bus generations. Because it is active production and RoHS compliant (,112 suffix), it fits lead-free rework processes used in board upgrades. Engineers should map A/B port direction labels carefully against the legacy schematic - particularly if the board was originally designed around the GTL2005, whose A and B labels are interchanged relative to the GTL2014.
Recomendado
Test and Measurement Fixtures
Bench and production test fixtures that exercise GTL-based boards need a safe translation layer between 3.3 V test electronics and the DUT's low-swing GTL nets. The GTL2014 fits this role: its sampling-receiver mode presents a clean LVTTL representation of GTL bus activity to a logic analyzer or MCU, while its driver mode injects LVTTL-originated patterns onto the terminated GTL bus. The four-channel width matches common chip-select/byte-enable groupings, and the direction pin can be driven per test phase. Since B-port capacitance is only 3.4 pF to 4.3 pF, fixture loading stays predictable. Keep fixture Vref routing quiet and locally decoupled so threshold tracking remains accurate across all channels.
Recomendado
Industrial Control Signal Bridging
Industrial controllers built around 3.3 V MCUs or FPGAs occasionally must talk to GTL-level signals inherited from processor-module designs. The GTL2014 offers a simple, robust bridge: BiCMOS construction gives solid current sink on the open-drain GTL side for reliable switching through backplane termination, while the LVTTL side connects directly to standard logic. The -40C to +85C temperature range suits factory-floor enclosures. Designers should budget for the resistor-termination dissipation on the GTL side and keep trace stubs short, since GTL's low swing (~1 V referenced to Vref) leaves little noise margin on long lines. For new industrial designs, consider modern dual-supply translators unless GTL compatibility is mandatory.
Recomendado
Memory Subsystem Interface Translation
GTL signaling historically appeared on memory control and data paths in workstation and server platforms. The GTL2014's four-bit width and bidirectional capability make it suitable for translating memory control groups (chip selects, output enables, masks) between a 3.3 V memory controller and GTL-referenced memory modules. The Vref input accepts the memory bus reference directly and tracks down to 0.5 V, accommodating reduced-swing memory variants. The sampling-receiver mode latches GTL bus state cleanly into the LVTTL domain without external level comparators. When migrating a design from GTL2005 to GTL2014 for better low-Vref accuracy, remember the A/B port label interchange and re-verify setup/hold timing against the slightly longer propagation delay.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para GTL2014PW,112 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | GTL2005PW,112 |
|---|---|---|
| Package | TSSOP-14 (SOT402-1) | TSSOP-14 (SOT402-1) - same |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Bit Width | 4-bit bidirectional | 4-bit bidirectional |
| Vref Tracking | Linear down to 0.5 V | Linearity degrades below 0.8 V |
| Propagation Delay | Slightly longer (per datasheet) | Shorter |
| Port Labeling | A = LVTTL, B = GTL | A/B labels interchanged vs GTL2014 |
| Supported Bus Levels | GTL-/GTL/GTL+ | GTL-/GTL/GTL+ |
| Lifecycle Status | Active | Active |
Diferenciadores clave
- Vref tracks linearly down to 0.5 V (frente a GTL2005PW,112)
- Pin-compatible migration path exists (frente a GTL2005PW,112)
- Trade-off: slower than GTL2005 (frente a GTL2005PW,112)
Notas de diseño
The GTL side of the GTL2014 uses open-drain outputs with a low logic swing referenced to Vref (supporting GTL-, GTL, and GTL+ threshold families). Keep GTL-side traces short and impedance-controlled, and verify that every net has its termination pull-up to VTT sized for the bus load. With only 3.4 pF to 4.3 pF of B-port capacitance per the datasheet, the translator itself adds little loading, but stub length and connector discontinuities dominate at GTL edge rates. Simulate setup/hold margin, especially if migrating from the faster GTL2005.
Route the Vref pin as a quiet reference: connect it to the GTL bus reference at a single low-impedance point and decouple it locally (e.g., 100 nF) to ground. Vref accuracy directly sets the GTL input threshold, and the GTL2014 is chosen precisely for linear tracking down to 0.5 V, so noise on this pin erodes the noise margin of all four channels simultaneously. Place the device close to the bus connector, keep A-side (3.3 V LVTTL) traces on a clean digital layer, and provide standard 100 nF decoupling on VCC.
The most common migration error is the A/B port label interchange between the GTL2014 and the pin-compatible GTL2005 documented in the NXP datasheet: a schematic ported from a GTL2005 design must have its direction logic and port naming re-checked, or the transceiver will drive the wrong domain. Also remember the trade-off - the GTL2014's slightly longer propagation delays buy better Vref linearity below 0.8 V; re-verify timing if Vref is above 0.8 V where the GTL2005 is faster.
Estimated: GTL translator ICs such as the GTL2014 dissipate very little power internally because GTL termination power is dropped in the external pull-up resistors, not the IC. For example, four channels sinking through 50-ohm terminations from a 1.2-1.5 V VTT put roughly 30-45 mW per channel into the resistors. The TSSOP-14 package handles this without heatsinking; verify the resistor power rating, not the IC's thermal budget.
Información de cumplimiento
The ,112 ordering suffix denotes the RoHS-compliant, lead-free version per NXP ordering conventions and distributor listings (Mastercomponent, Jotrin).
