LCMXO3L-1300E-5U - 1280 LUTs MachXO3L FPGA, 1.2V | Lattice
N.º de pieza: LCMXO3L-1300E-5U ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.45 | $64,50 |
| 100 | $5.5 | $550,00 |
| 500 | $4.85 | $2.425,00 |
| 1.000 | $4.35 | $4.350,00 |
LCMXO3L-1300E-5U Descripción general
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines an array of configurable logic blocks (LUTs), programmable interconnect, and embedded memory and I/O resources. Within the broader hierarchy, an FPGA sits above a CPLD (which typically has fewer logic resources and non-volatile configuration) and below an ASIC (which is fixed at fabrication). The MachXO3L series from Lattice targets low-power, high-I/O-density glue functions such as bus bridging, I/O expansion, power sequencing, and instant-on control logic in industrial, consumer, and communications systems.
Key features of the LCMXO3L-1300E include a low 1.2 V core supply with wide 1.14 V to 1.26 V tolerance, 28 available user I/O pins supporting multiple I/O standards, 65,536 bits of user SRAM, built-in configuration memory, and support for both volatile and non-volatile configuration modes. The '5' speed grade and 'E' enhanced suffix denote the device's operating characteristics. The 36-ball WLCSP package offers an extremely small footprint of approximately 2.54 mm x 2.59 mm, making it ideal for space-constrained handheld and embedded designs.
The MachXO3L architecture embeds features such as on-chip oscillators, PLLs, and hardened I/O logic that simplify typical board-management tasks. Compared with general-purpose FPGAs, the MachXO3L family is optimized for low static power and instant-on operation from a small amount of embedded Flash, which is critical for power-sequencing applications in platforms with strict standby and wake-up budgets.
Typical applications include I/O expansion and level shifting, glue logic for SoCs and microcontrollers, power-supply sequencing and reset distribution, LED control and human-machine interface (HMI) bridging, and low-cost prototyping of control-plane logic. The 1.2 V core supply also makes the part compatible with low-voltage SoC companion rails in modern embedded designs.
When designing with this part, ensure that the supporting toolchain (Lattice Diamond or Radiant) is selected for the MachXO3L device and that the WLCSP-36 footprint is properly laid out with appropriate NSMD pads and proper ball-reliable assembly. Designers should also verify signal-integrity margins at the supported I/O standards and provide decoupling capacitors close to each supply pin.
This page synthesizes distributor pricing, drop-in MachXO3L family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para LCMXO3L-1300E-5U — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con LCMXO3L-1300E-5U (mismo factor de forma y huella) — difiere en Configuration Memory, Mounting Type, Package, Process Technology, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
LCMXO3L-1300E-5UWG36ITR1K
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LCMXO3L-1300E-5UWG36CTR50
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LCMXO3L-1300E-5UWG36ITR50
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LCMXO3L-1300E-5UWG36CTR
✅ Sustitución directa✓ En stock
$3.55 / unidad
Ver hoja de datos →LCMXO3L-1300E-5UWG36ITR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LCMXO3L-1300E-5U Valores máximos y características eléctricas
| Family | MachXO3L |
| Logic Elements / LUTs | 1280 |
| Number of LABs / CLBs | 160 |
| Total RAM Bits | 65536 |
| Number of User I/O | 28 |
| Core Supply Voltage | 1.2 V (1.14 V to 1.26 V) |
| Process Technology | 65 nm |
| Encapsulado | 36-WLCSP / UFBGA (36-WLCSP, 2.54 x 2.59 mm) |
| Tipo de montaje | Surface Mount (SMD/SMT) |
| Operating Temperature (Commercial C) | 0C to +85C |
| Speed Grade | 5 |
| Configuration Memory | Internal Flash + SRAM |
| Packaging | Tape & Reel |
| Standard Package Quantity | 1000 (TR1K) or 5000 (TR50) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Configuración de pines de LCMXO3L-1300E-5U
| Pin A1 | IO/VREF — User I/O / reference voltage ball |
| Pin A2 | IO — User I/O |
| Pin A3 | IO — User I/O |
| Pin A4 | VCC — Core supply 1.2 V |
| Pin A5 | GND — Ground |
| Pin A6 | IO — User I/O |
| Pin B1 | IO — User I/O |
| Pin B2 | IO — User I/O |
| Pin B3 | IO — User I/O |
| Pin B4 | VCCAUX — Auxiliary supply |
| Pin B5 | GND — Ground |
| Pin B6 | IO — User I/O |
| Pin C1 | IO — User I/O |
| Pin C2 | IO — User I/O |
| Pin C3 | IO — User I/O |
| Pin C4 | IO — User I/O |
| Pin C5 | IO — User I/O |
| Pin C6 | IO — User I/O |
| Pin D1 | IO — User I/O |
| Pin D2 | TCK — JTAG test clock |
| Pin D3 | TDI — JTAG test data in |
| Pin D4 | TDO — JTAG test data out |
| Pin D5 | TMS — JTAG test mode select |
| Pin D6 | IO — User I/O |
| Pin E1 | CFN — Configuration |
| Pin E2 | IO — User I/O |
| Pin E3 | VCCIO — I/O bank supply |
| Pin E4 | GND — Ground |
| Pin E5 | INITN — Initialization / done |
| Pin E6 | PROGRAMN — Program / reset |
| Pin F1 | IO — User I/O |
| Pin F2 | IO — User I/O |
| Pin F3 | IO — User I/O |
| Pin F4 | IO — User I/O |
| Pin F5 | IO — User I/O |
| Pin F6 | IO — User I/O |
Aplicaciones típicas
LCMXO3L-1300E-5U es adecuado para 6 aplicacións: I/O Expansion and Level Shifting, Power Sequencing and Reset Distribution, Glue Logic for SoC Platforms, LED Control and HMI Bridging, Low-Cost Prototyping for Control-Plane Logic, Communications Peripherals and Sensor Aggregation.
I/O Expansion and Level Shifting
The LCMXO3L-1300E-5U is well suited to bus-bridging and I/O-expansion roles because it provides 28 user I/O supporting multiple I/O standards and 1280 LUTs of programmable logic that can be configured as custom parallel or serial interfaces. With its 1.2 V core and I/O bank flexibility, it bridges a low-voltage SoC running at 1.8 V or 3.3 V to legacy peripherals at 5 V, while the 65,536 bits of embedded SRAM allow small protocol FIFOs and timing-skew adjustments. Placed adjacent to the SoC on the board, the FPGA absorbs pin-count mismatches without an expensive ASIC redesign. Trade-off: the WLCSP package limits I/O count versus larger BGA variants, so this is the right part when you need fewer than ~30 extra I/O.
Recomendado
Power Sequencing and Reset Distribution
The MachXO3L-1300E-5U is widely deployed in power-tree management because it can be programmed to monitor and sequence multiple supply rails with deterministic timing. With 1280 LUTs, the device can implement dozens of monitor-and-control blocks; with 65,536 bits of SRAM it can store per-rail configuration state; and with 28 user I/O it can drive PG (power-good) and EN lines for an entire platform. Instant-on from internal Flash means the part is live within milliseconds of VCC applied - critical for platforms with strict standby-to-active wake budgets. Trade-off: very fast sequencing (<1 ms) requires careful pin assignment to meet setup/hold on the monitored rails.
Recomendado
Glue Logic for SoC Platforms
Modern SoCs often need small amounts of glue logic - signal inversions, bus muxing, interrupt aggregation, address decoding, or protocol bridging - that exceed CPLD capacity but do not justify a large FPGA. The LCMXO3L-1300E-5U fits this gap exactly, providing 1280 LUTs in a 36-WLCSP package measuring only 2.54 mm x 2.59 mm. With 65,536 bits of SRAM, the part can implement small dual-port buffers or scratch FIFOs; with 28 user I/O it can fan-in and fan-out the SoC's GPIO. Placed beside the SoC, the FPGA offloads timing-sensitive logic that is awkward to implement in software. Trade-off: routing many signals between SoC and FPGA on a high-density PCB demands careful signal-integrity planning.
Recomendado
LED Control and HMI Bridging
The LCMXO3L-1300E-5U drives addressable LED strings and bridges between a host MCU and HMI peripherals (keypad scan, rotary encoders, small graphic displays) using its 1280 LUTs and 28 user I/O. The 65,536 bits of embedded SRAM store color lookup or scan tables, and the 1.2 V core allows the part to share the SoC's main supply rail. With deterministic timing and parallel outputs, the FPGA updates many LEDs or key-matrix rows simultaneously without burdening the host MCU. Trade-off: WLCSP-36 limits the number of directly driven LED channels, so external LED drivers are required for large arrays.
Recomendado
Low-Cost Prototyping for Control-Plane Logic
Engineers prototyping custom control logic for industrial, automotive, or communications platforms can use the LCMXO3L-1300E-5U as a stepping stone before ASIC tape-out. With 1280 LUTs, 65,536 bits of SRAM, and 28 user I/O plus Lattice's Diamond/Radiant toolchain, designers can iterate RTL quickly and verify behavior on real hardware. The 36-WLCSP package is small enough to drop into prototype boards without major mechanical changes, while the part's commercial temperature grade (0C to +85C) covers most lab and bench environments. Trade-off: for designs needing more than 1280 LUTs, the LCMXO3LF-4300 or MachXO3D families are the next step up.
Recomendado
Communications Peripherals and Sensor Aggregation
The LCMXO3L-1300E-5U aggregates sensor data in industrial and IoT edge nodes, interfacing I2C, SPI, and UART buses on its 28 user I/O. With 1280 LUTs and 65,536 bits of SRAM, the part can implement sensor-hub state machines, time-stamping, and protocol translation. The 1.2 V core allows direct tie-in to modern SoC or MCU power domains, and the small WLCSP package drops into space-constrained sensor boards. Trade-off: high-speed PHY interfaces (>100 MHz) require careful PCB layout because of the WLCSP's fine ball pitch.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LCMXO3L-1300E-5U — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LCMXO3L-1300E-5UWG36ITR1K | LCMXO3L-1300E-5UWG36CTR50 | LCMXO3L-1300E-5UWG36ITR50 | LCMXO3L-1300E-5UWG36CTR | LCMXO3L-1300E-5UWG36ITR |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 36-WLCSP (UFBGA) | 36-WLCSP (UFBGA) - same | 36-WLCSP (UFBGA) - same | 36-WLCSP (UFBGA) - same | 36-WLCSP (UFBGA) - same | 36-WLCSP (UFBGA) - same |
| Logic Elements / LUTs | 1280 | 1280 | 1280 | 1280 | 1280 | 1280 |
| Total RAM Bits | 65536 | 65536 | 65536 | 65536 | 65536 | 65536 |
| User I/O | 28 | 28 | 28 | 28 | 28 | 28 |
| Core Voltage | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) | 1.2 V (1.14-1.26 V) |
| Temperature Grade | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C |
| Reel Quantity | 1000 (TR1K) | 1000 (TR1K) | 5000 (TR50) | 5000 (TR50) | Generic reel | Generic reel |
Diferenciadores clave
- Smallest-footprint MachXO3L variant with full 1280 LUTs (frente a LCMXO3L-1300E-5MG121I)
- Commercial temperature grade at lower cost vs I-grade sibling (frente a LCMXO3L-1300E-5UWG36ITR1K)
- Drop-in replacement for the TR50 production reel variant (frente a LCMXO3L-1300E-5UWG36CTR50)
Notas de diseño
Estimated: the LCMXO3L-1300E-5U draws core current from a 1.2 V rail in the 1.14 V to 1.26 V tolerance window. Decouple VCC and VCCAUX with a 0.1 uF ceramic cap placed within 2 mm of each supply ball, and add a 4.7 uF bulk capacitor on the main VCC rail. According to Lattice MachXO3L hardware-design guidance, multiple GND balls must be stitched to a continuous ground plane with multiple vias for thermal and electrical performance. Insufficient decoupling on VCCIO can cause I/O-bank logic errors.
The 36-WLCSP package uses a fine ball pitch (~0.4 mm). PCB layout requires NSMD pads with a defined solder-paste aperture, and the board surface finish should be ENIG or AuSn to ensure reliable ball attachment. Per JEDEC J-STD-020, the package has an MSL rating that must be respected during assembly. Use a controlled-atmosphere reflow profile and avoid placing large heat sources adjacent to the package, as WLCSP devices have limited thermal mass.
Route JTAG signals (TCK, TDI, TDO, TMS) with a short, ground-served path to the programming header. According to Lattice's hardware-management guidelines, keep JTAG traces away from switching signals and add a 4.7 kohm pull-up on TMS and TDI. For high-speed user I/O, place series-termination resistors close to the FPGA balls to control edge rates and reduce reflections. Avoid routing user I/O across plane splits to maintain signal integrity.
Do not confuse the LCMXO3L-1300E-5UWG36CTR1K (commercial) and the LCMXO3L-1300E-5UWG36ITR1K (industrial) variants in your BOM - they share the same pinout but the I-grade is verified for wider temperature. Per the Lattice datasheet, configuration mode (SRAM vs Flash) must be selected correctly via the CFN/INITN/PROGRAMN balls; otherwise the part may not boot. Always check the BSDL file for the exact device when generating boundary-scan tests.
Información de cumplimiento
RoHS and lead-free per Lattice product page. Not AEC-Q100 qualified - choose automotive-grade FPGAs from Lattice (e.g., automotive MachXO3) if required. Halogen-free status not stated in available data.
