LPC1768UKJ - 32-Bit 100MHz Cortex-M3 MCU | NXP
N.º de pieza: LPC1768UKJ ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
LPC1768UKJ Descripción general
A microcontroller is a programmable system-on-chip that combines a processor core, nonvolatile program memory, volatile data memory, and peripherals such as serial interfaces and communications controllers. The ARM Cortex-M3 architecture provides a compact instruction set suited to real-time control, while the LPC1768 platform integrates connectivity-oriented peripherals into one component. In the electronics hierarchy, this part is a microcontroller, or MCU, within the broader semiconductor and embedded-processing categories.
The principal verified specifications are a 100 MHz maximum operating frequency, 512 KB of flash organized as 512K x 8, a 32-bit ARM Cortex-M3 core, and a 100-TFBGA package measuring 9 x 9 mm. These characteristics make the LPC1768UKJ suitable for control-intensive equipment requiring substantial local program storage and a compact, high-pin-count surface-mount footprint. The availability of Ethernet, USB, and CAN is identified in the family-level datasheet result, although detailed interface operating limits are not provided in the supplied target-page data.
The LPC1768 family integrates extensive on-chip peripherals to reduce external component count and board area. The family description emphasizes high integration and peripheral support for embedded applications, while the LPC1768UK product-page result identifies migration compatibility within the LPC1700 family. Designers should nevertheless verify the exact peripheral pin assignments, electrical limits, and package ball map for LPC1768UKJ against the manufacturer documentation before releasing a PCB.
Typical applications include industrial control, networked embedded equipment, USB-connected peripherals, automotive or transportation electronics, communications infrastructure, and compact consumer products. The 512 KB flash capacity provides room for networking stacks, protocol handlers, control firmware, and application logic, while the 100 MHz Cortex-M3 core supports deterministic multitasking and peripheral servicing.
A critical design consideration is the fine-pitch 100-TFBGA footprint. PCB layout must provide adequate escape routing, power and ground distribution, and manufacturing capability for the package. Firmware developers must also configure clocks, pins, memory, and peripherals for the exact LPC1768UKJ variant rather than relying only on generic LPC1768 documentation.
This page combines the verified distributor description, family-level technical context, package information, sourcing details, and engineering-oriented selection guidance. It is intended to help engineers identify the correct MCU, plan a compatible board, and distinguish verified facts from details that still require confirmation in the official documentation.
Alternativas directas para LPC1768UKJ — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con LPC1768UKJ (mismo factor de forma y huella) — difiere en Mounting Type, Ethernet MAC, I2C Interfaces, Maximum CPU Frequency, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
LPC1768UKZ
✅ Sustitución directa✓ En stock
$4.8357 / unidad
Ver hoja de datos →LPC1817JET100E
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC1837JET100E
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC1857FET256
✅ Sustitución directa✓ En stock
$12.3 / unidad
Ver hoja de datos →LPC1768UKJ Valores máximos y características eléctricas
| Product Type | 32-bit ARM Cortex-M3 microcontroller |
| Product Series | LPC17xx |
| Maximum CPU Frequency | 100 MHz |
| Processor Core | ARM Cortex-M3 |
| Bit Width | 32 bit |
| Flash Memory | 512 KB |
| Flash Organization | 512K x 8 |
| Maximum SRAM | 64 kB |
| Ethernet Support | Yes |
| USB Support | USB 2.0 Host, Device, and OTG |
| CAN Support | Yes |
| Encapsulado | 100-TFBGA (9x9 mm) |
| Tipo de montaje | Surface Mount |
| Operating Supply | 3.3 V |
Guía de configuración de pines de LPC1768UKJ 100-tfbga (9x9 mm)
Configuración de pines para LPC1768UKJ (encapsulado 100-tfbga (9x9 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para LPC1768UKJ.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
LPC1768UKJ es adecuado para 6 aplicacións: Industrial Automation Controller, USB-Connected Embedded Peripheral, Networked Communications Equipment, Automotive and Transportation Control, Instrumentation and Data Acquisition, Human-Machine Interface and Embedded Console.
Industrial Automation Controller
The LPC1768UKJ fits real-time industrial control when a design requires a 100 MHz Cortex-M3 core, 512 KB of flash, and extensive local peripherals. Its 64 kB SRAM can support control tasks, communication stacks, and diagnostic buffers, while Ethernet, USB 2.0, and CAN provide multiple paths to supervisory equipment. The part is placed beside sensors, motor-control circuitry, and field-bus transceivers. The principal design consideration is the 100-TFBGA footprint: PCB designers must plan fine-pitch escape routing, uninterrupted ground planes, and adequate power distribution. Because the supplied data does not confirm the operating-temperature range or EMC qualification, industrial suitability must be validated against the exact environmental and safety requirements.
Recomendado
USB-Connected Embedded Peripheral
The LPC1768UKJ is appropriate for a compact USB peripheral because it integrates USB 2.0 Host, Device, and OTG support with a 100 MHz ARM Cortex-M3 processor. A typical implementation places the MCU near a USB connector, transceiver circuitry, configuration memory, and application-specific sensors. Its 512 KB of flash can hold a USB stack, device firmware, and protocol logic without requiring an external program-memory device. The MCU's 100-TFBGA package supports dense integration but demands assembly processes capable of handling 100 fine-pitch balls. Firmware must also validate device speed, power states, enumeration behavior, and USB signal-routing requirements against the manufacturer documentation.
Recomendado
Networked Communications Equipment
The LPC1768UKJ supports network-facing embedded products that need deterministic processing alongside Ethernet and USB connectivity. Its 100 MHz Cortex-M3 core can service protocol handling and supervisory logic, while the verified family data identifies Ethernet, USB 2.0, and CAN interfaces. A typical design uses the MCU with an Ethernet PHY, magnetic network isolation, configuration storage, and status indicators. The 512 KB flash provides room for a network stack and application firmware, and 64 kB of SRAM supports packet buffering and task scheduling. Layout should isolate Ethernet and USB paths from sensitive analog sections, maintain continuous ground references, and verify magnetics and PHY requirements independently because those external details are not specified in the supplied data.
Recomendado
Automotive and Transportation Control
The LPC1768UKJ can serve as the central controller in transportation equipment when the system requires substantial flash, real-time responsiveness, and multiple communication interfaces. The 100 MHz Cortex-M3 core supports state-machine execution and control-loop servicing, while Ethernet, CAN, and USB provide options for diagnostics and external equipment integration. It would typically sit beside sensor conditioning, actuator drivers, CAN transceivers, and protection circuitry. The verified sources do not identify AEC-Q100 qualification, automotive temperature limits, or automotive-grade status, so the standard LPC1768UKJ must not be assumed qualified for safety-critical or vehicle-production use without documentary confirmation. Functional-safety and environmental validation remain separate engineering gates.
Recomendado
Instrumentation and Data Acquisition
The LPC1768UKJ is suitable for compact instrumentation when high-frequency control, local data handling, and multiple external interfaces are needed in one device. Its 100 MHz Cortex-M3 core can coordinate ADC sampling, filtering, parameter updates, and host communication, while 512 KB of flash supports firmware, calibration tables, and communication protocols. The part may be paired with precision converters, display drivers, and isolated serial interfaces. Although the supplied snippets do not expose the LPC1768UKJ ADC resolution, sample rate, or timing specifications, those parameters must be checked directly before selecting it for precision measurement. Care should also be taken to separate analog and digital grounding appropriately and to validate signal integrity at the fine-pitch MCU pins.
Recomendado
Human-Machine Interface and Embedded Console
The LPC1768UKJ can support compact human-machine interfaces where a controller must update a display, read controls, and maintain USB or serial connectivity. Its 512 KB of flash accommodates graphics state, interface logic, and application firmware, while the 100 MHz Cortex-M3 core provides enough responsiveness for menu handling and peripheral coordination. In a typical implementation, the MCU drives a display interface, scans controls, and uses USB for configuration or service access. The 100-TFBGA package helps reduce board area, but it also requires careful escape routing for display and touch-controller signals. The supplied evidence does not include supported display peripherals or timing details, so compatibility must be established from the exact data sheets before schematic capture.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LPC1768UKJ — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LPC1768UKZ | LPC1817JET100E | LPC1837JET100E | LPC1857FET256 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) |
| Processor Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
Diferenciadores clave
- Connectivity integration in one 100 MHz Cortex-M3 device (frente a LPC1817JET100E)
- Verified target identification and family positioning (frente a LPC1768UKZ)
- Program-memory capacity for connected embedded firmware (frente a LPC1837JET100E)
- Compact 100-ball integration (frente a LPC1857FET256)
Notas de diseño
Treat the 100-TFBGA footprint as the dominant layout constraint. Route every supply and ground ball directly into a continuous plane structure, preserve short return paths beneath high-speed interfaces, and validate the escape fanout with the manufacturer's package drawing and stackup. The verified package is 9 x 9 mm, but the supplied data does not provide ball pitch, so the physical package drawing must be used before placement or footprint generation.
Build the power tree from the exact LPC1768UKJ datasheet rather than applying a generic 3.3 V assumption. Separate core, I/O, and any analog or communication supply requirements into appropriately filtered rails, then confirm startup sequencing and maximum current for each domain. The supplied evidence confirms a 3.3 V nominal operating condition but does not provide voltage tolerances, current limits, decoupling values, or power-down constraints.
Do not migrate between LPC1768UKJ, LPC1768UKZ, LPC1817JET100E, LPC1837JET100E, or LPC1857FET256 using only the core and flash-memory fields. Compare all 100 balls, alternate functions, power pins, ground grouping, clock pins, startup configuration, and peripheral instance mapping. The verified cross-reference data identifies related devices but does not establish exact pin compatibility, so each migration requires schematic, PCB, and firmware review.
Keep Ethernet, USB, and CAN routing isolated from clocks and sensitive analog inputs. Follow the exact reference-impedance and via guidance in the manufacturer documentation for each interface, use short point-to-point connections where specified, and avoid routing high-speed signals beneath split or heavily loaded power planes. For Ethernet, verify magnetics and PHY placement against the interface reference design rather than relying solely on the MCU family datasheet.
Estimate junction temperature from the actual switching loss and PCB copper area rather than assuming that a small BGA automatically means low dissipation. For each operating mode, sum internal and I/O power, multiply by the applicable thermal resistance, and compare the resulting junction-temperature estimate with the device limit. The verified data does not supply thermal resistance, maximum junction temperature, or package-dependent dissipation data, so those values must be obtained from the official documentation.
Información de cumplimiento
The supplied verified pages do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. These fields therefore remain unknown rather than being inferred from general NXP practices.
