LPC1833JET100E - 180MHz Cortex-M3 MCU with USB | NXP
N.º de pieza: LPC1833JET100E ✓ ActivoLPC1833JET100E Descripción general
A microcontroller is a programmable semiconductor that integrates a processor core, nonvolatile program memory, volatile data memory, and peripherals into one compact device. The LPC1833JET100E belongs to the MCU, embedded processor, and semiconductor hierarchy. Its Cortex-M3 core combines a 32-bit architecture with an efficient instruction set suited to embedded control, while its Ethernet and high-speed USB connectivity allows the same device to manage communications as well as real-time control functions.
The device provides 512 kB of flash for firmware and 136 kB of SRAM for working data. Two high-speed USB interfaces reduce the need for additional USB controllers in designs requiring multiple USB connections. Integrated Ethernet similarly supports network-connected equipment without requiring a separate Ethernet interface IC. These capabilities make the LPC1833JET100E suitable for industrial gateways, USB-to-Ethernet equipment, data acquisition systems, and connected embedded controllers.
The LPC18xx family is based on the Arm Cortex-M3 architecture and is positioned for embedded applications requiring high performance, substantial memory, Ethernet, USB, and LCD-related connectivity. Two high-speed USB interfaces and Ethernet provide the most distinctive connectivity combination in the verified product information, while the 180 MHz operating speed gives the processor more compute headroom than many lower-frequency embedded controllers.
Typical implementations include industrial Ethernet bridges, USB hubs and peripheral controllers, connected test equipment, network interface modules, and multifunction embedded platforms. A design can place the MCU directly at the center of an Ethernet-enabled control system and use its two USB interfaces for either two peripheral roles or a host/device combination, depending on the required system topology.
PCB implementation requires careful BGA layout, power and ground distribution, and signal-integrity management. Although the 9 mm by 9 mm TFBGA-100 package supports compact designs, its 100 terminals require adequate escape routing and via density. Firmware and peripheral assignments must also be reviewed against the manufacturer datasheet before production release.
This page consolidates verified manufacturer and distributor information, package details, pricing references, same-family replacement considerations, and practical design guidance. It also distinguishes confirmed drop-in candidates from devices that may share a package without providing a complete functional replacement.
Alternativas directas para LPC1833JET100E — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
LPC1825JET100E
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
LPC4370FET100E
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC4310FET100,551
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
LPC1833JET100E Valores máximos y características eléctricas
| Processor Core | Arm Cortex-M3, 1 core |
| Architecture | 32-bit, 1 unit |
| Frecuencia de reloj máxima | 180 MHz |
| Flash Memory | 512 kB |
| SRAM | 136 kB |
| High-Speed USB Interfaces | 2 interfaces |
| Ethernet Interface | 1 integrated interface |
| Encapsulado | TFBGA-100, 9 mm x 9 mm |
| Terminal Count | 100 balls |
| Tipo de montaje | Surface mount, 1 unit |
| Temperature Grade | Industrial grade, 1 grade |
| Manufacturer Family | LPC18xx, 1 series |
| Ancho del bus de datos | 32-bit, 1 unit |
| Program Memory Word Size | 8-bit, 1 byte |
| RoHS Compliance | unknown, 1 status |
| REACH Compliance | unknown, 1 status |
| AEC-Q100 Qualification | unknown, 1 status |
Guía de configuración de pines de LPC1833JET100E tfbga-100, 9 mm x 9 mm
Configuración de pines para LPC1833JET100E (encapsulado tfbga-100, 9 mm x 9 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para LPC1833JET100E.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
LPC1833JET100E es adecuado para 6 aplicacións: Industrial Ethernet Gateway, USB-to-Ethernet Network Bridge, High-Speed USB Test and Measurement Hub, Connected Data Acquisition Controller, USB-C Powered Embedded Control Module, Multifunction Network Control Platform.
Industrial Ethernet Gateway
The LPC1833JET100E fits an industrial Ethernet gateway because it combines a 180 MHz Arm Cortex-M3 core with an integrated Ethernet interface, 512 kB of flash, and 136 kB of SRAM. The microcontroller can manage protocol processing, local configuration, status reporting, and control logic without requiring a separate Ethernet interface IC. Its two high-speed USB interfaces can also support local service connections or peripheral expansion. The design must still include suitable Ethernet magnetics, protection, isolation where required, and a controlled-impedance layout. Before release, engineers should confirm the required PHY integration, Ethernet clock path, and exact peripheral assignments in the manufacturer datasheet.
Recomendado
USB-to-Ethernet Network Bridge
A USB-to-Ethernet bridge benefits from the LPC1833JET100E because the same 100-ball device provides Ethernet, two high-speed USB interfaces, and a 180 MHz processor core. Firmware can support USB host, USB device, or dual-role behavior while the Ethernet controller handles network traffic and the 136 kB SRAM provides space for packet buffering and working state. The 512 kB flash capacity accommodates bridge firmware and configuration data. In a production design, developers must confirm the exact USB host or device electrical requirements, PHY configuration, clock sources, and board-level magnetics from the datasheet and reference designs.
Recomendado
High-Speed USB Test and Measurement Hub
The LPC1833JET100E is appropriate for a USB test and measurement hub because its two high-speed USB interfaces can support multiple instrument or peripheral connections while the Cortex-M3 core runs up to 180 MHz. With 512 kB of flash and 136 kB of SRAM, the device has verified capacity for embedded control firmware, configuration handling, and data-transfer buffering. The two USB ports reduce external controller overhead when the required host and device roles are known. Production implementation still requires compliance-focused USB layout, verified connector protection, accurate clock routing, and validation of the relevant USB electrical and firmware requirements.
Recomendado
Connected Data Acquisition Controller
The LPC1833JET100E can serve as the central controller in a connected data-acquisition system where acquisition timing, local storage, and network delivery are combined in one package. Its 180 MHz Cortex-M3 core handles supervisory logic, the 512 kB flash stores firmware and calibration data, and the 136 kB SRAM supports buffers for samples and protocol processing. Ethernet provides a direct path for transferring collected data, while two high-speed USB interfaces support local storage or configuration. Engineers should confirm ADC interface requirements, interrupt latency, data-buffer sizing, and deterministic clock behavior against the manufacturer datasheet.
Recomendado
USB-C Powered Embedded Control Module
The LPC1833JET100E is suitable for a USB-connected embedded control module because it combines two high-speed USB interfaces with substantial memory and a 180 MHz control core. A single device can implement local control logic, USB communications, and Ethernet-assisted configuration or diagnostics. The 100-ball TFBGA-100 package keeps the component within a 9 mm by 9 mm footprint, although its fine pitch requires careful PCB layout and inspection. Designers should verify the USB power-supply arrangement, connector data toggling requirements, thermal performance, and whether an external transceiver or power-management device is required.
Recomendado
Multifunction Network Control Platform
The LPC1833JET100E fits a multifunction network control platform that needs Ethernet, USB, and substantial embedded processing without several discrete controllers. The 180 MHz Cortex-M3 core can coordinate protocol tasks and device control, while 512 kB of flash and 136 kB of SRAM hold firmware, configuration, and runtime buffers. Two high-speed USB interfaces allow the platform to offer more than one USB service while Ethernet provides backbone connectivity. Before schematic release, engineers should verify every multiplexed ball, clock domain, peripheral instance, and package-level escape route against the current NXP datasheet and pin-muxing configuration.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para LPC1833JET100E — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | LPC1825JET100E | LPC4370FET100E | LPC4310FET100,551 |
|---|---|---|---|---|
| Package | TFBGA-100 (9 mm x 9 mm) | TFBGA-100 (9 mm x 9 mm) | TFBGA-100 (9 mm x 9 mm) | TFBGA-100 (9 mm x 9 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Processor Core | Arm Cortex-M3 | Arm Cortex-M3 | Cortex-M4 class | Cortex-M4 class |
Diferenciadores clave
- Double the flash capacity of the lower-memory LPC18xx candidate (frente a LPC1825JET100E)
- Larger SRAM for network and USB working buffers (frente a LPC1825JET100E)
- Verified dual high-speed USB connectivity (frente a LPC1825JET100E)
Notas de diseño
Treat the TFBGA-100 layout as a constrained-routing design rather than a generic fine-pitch BGA. Keep the 100-ball escape pattern within the manufacturer's recommended footprint, preserve continuous return paths beneath high-speed signals, and place decoupling capacitors close to the applicable power balls. The verified 9 mm by 9 mm package leaves limited escape-routing space, so via-in-pad, microvia, or multilayer-routing choices should be evaluated against assembly capability and USB or Ethernet signal-integrity requirements.
Route Ethernet and high-speed USB interfaces on controlled-impedance layers with short connections, uninterrupted reference planes, and minimal via transitions. High-speed USB requires attention to differential pair symmetry, while Ethernet implementation must follow the required magnetics and PHY topology from the manufacturer reference design. Do not assume that equal ball spacing alone guarantees compliance; perform signal-integrity simulation or measurement with the final stack-up, connectors, protection components, firmware configuration, and enclosure in place.
Separate analog, digital, and I/O supply distribution as recommended by the datasheet, and verify startup sequencing before releasing the PCB. The verified specifications establish 180 MHz operation, 512 kB flash, and 136 kB SRAM but do not provide regulator values, capacitor recommendations, or thermal limits; those values must be taken from the manufacturer datasheet. Do not assign supply components or power ratings from parametric assumptions. Confirm the operating voltage range, external clock requirements, reset configuration, and brownout behavior in the exact device documentation.
Do not substitute LPC1825JET100E merely because it appears in an LPC18xx comparison. Its verified family position indicates less flash and SRAM than the 512 kB and 136 kB available in the target, and the presence of Ethernet or two high-speed USB ports must be reconfirmed. Likewise, LPC4370FET100E and LPC4310FET100,551 may use related package naming while differing in processor architecture, clocking, and peripherals. A legitimate drop-in approval requires ball-by-ball, peripheral, memory, startup, and firmware review.
Información de cumplimiento
The verified excerpts confirm an industrial-grade device but do not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Compliance values remain unknown rather than being inferred.
