MAX1009C/D-C7H - 12-Bit ASIC ADC | Analog Devices | Industrial
N.º de pieza: MAX1009C/D-C7H ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.4 | $5.700,00 |
| 1.000 | $9.95 | $9.950,00 |
MAX1009C/D-C7H Descripción general
An analog-to-digital converter (ADC) is a mixed-signal integrated circuit that samples a continuous-time analog voltage and converts it to a discrete digital code proportional to the input amplitude. Within the broader component taxonomy, the MAX1009C/D-C7H sits in the hierarchy: ADC -> data converter -> mixed-signal IC -> semiconductor. The "C/D" package suffix denotes a die-level (unpackaged) form factor rather than a molded plastic package, which is typical for OEM module integration, hybrid assemblies, and space-constrained medical or industrial sensor modules. The "-C7H" suffix is a Maxim tape-and-reel and lot tracking code; the underlying silicon is identical across variant suffixes.
Key features include a 12-bit resolution, a high-impedance analog input for direct sensor interfacing, low input-referred offset for accurate low-level signal measurement, and a serial/digital interface that simplifies connection to a host microcontroller. The die form factor eliminates the lead-frame inductance of a packaged part, enabling improved high-frequency noise performance and reduced parasitic coupling. The device is designed for low power consumption to support battery-powered portable instruments and remote sensor nodes where thermal and energy budgets are tight.
Architecturally, the MAX1009C/D-C7H integrates the input buffer, sample-and-hold, conversion core, and digital interface on a single die. By combining the front-end conditioning and conversion into one ASIC, the design reduces board area, lowers BOM count, and improves system-level reliability compared to discrete ADC + op-amp solutions. The ASIC integration also allows Maxim to tune the input stage specifically for low-level industrial sensors, which reduces calibration overhead at production.
Typical applications include industrial process control and sensor monitoring, portable medical instruments (blood-pressure, glucose, and pulse-oximeter front-ends), remote data-acquisition modules, weigh-scale and strain-gauge digitizers, and battery-powered handheld test equipment. The combination of 12-bit resolution, low power, and a small die footprint makes it well-suited for high-volume OEM products.
When designing with the die form, observe proper ESD handling, die attach, and wire-bonding procedures per Maxim's packaging guidelines. The -C7H variant is intended for OEM module integration; consult Maxim Application Note 3183 for the recommended die-pad layout and bond-out diagram before committing the host PCB.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer page.
Alternativas directas para MAX1009C/D-C7H — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MAX1009C/D-C7H (mismo factor de forma y huella) — difiere en Converter Type, Input Type, Manufacturer, Mounting Type, Resolution.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MAX1009C/D-C10301
✅ Sustitución directa✓ En stock
$14.95 / unidad
Ver hoja de datos →MAX1009C/D-C7H Valores máximos y características eléctricas
| Resolución | 12 bit |
| Converter Type | ASIC ADC (Data Acquisition) |
| Input Stage | High-impedance, low-level input |
| Package / Form Factor | Bare die / wafer (C/D suffix) |
| Suffix Code | C/D-C7H (die / lot designator) |
| Primary Application | Industrial measurement, medical, data acquisition |
| Input Type | Single-ended analog |
| Digital Interface | Serial (per datasheet) |
| Tipo de montaje | Die attach / wire bond |
| Estado RoHS | Compliant |
| Manufacturer | Analog Devices Inc./Maxim Integrated |
Guía de configuración de pines de MAX1009C/D-C7H bare die / wafer (c/d suffix)
Configuración de pines para MAX1009C/D-C7H (encapsulado bare die / wafer (c/d suffix)). Este componente analógico presenta pines de entrada, salida y alimentación. Consulte la hoja de datos del fabricante para conocer las configuraciones de los pines de ajuste de offset, compensación y habilitación. Ideal para circuitos de acondicionamiento de señal y amplificadores.
No hay datos detallados de patillaje disponibles para MAX1009C/D-C7H.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MAX1009C/D-C7H es adecuado para 6 aplicacións: Industrial Weigh-Scale Digitizer, Portable Blood-Pressure Monitor, Strain-Gauge Sensor Readout, Remote Data-Acquisition Module, Handheld Test & Measurement Instrument, Glucose / Blood-Chemistry Meter.
Industrial Weigh-Scale Digitizer
The MAX1009C/D-C7H is well-matched to weigh-scale and force-measurement front-ends where a load-cell outputs a low-level (typically 1-3 mV/V) differential signal. The part's high-impedance input stage accepts the load-cell output directly, eliminating the external instrumentation amplifier that a discrete ADC design would require. At 12-bit resolution the LSB step is roughly 0.024% of full-scale, which gives adequate granularity for commercial scales in the 0.1% accuracy class. The bare-die form factor allows the ADC to sit inside the load-cell housing for a fully integrated smart sensor.
Recomendado
Portable Blood-Pressure Monitor
The MAX1009C/D-C7H is suitable for portable medical blood-pressure cuffs where the pressure transducer outputs a low-level bridge signal that must be digitized for display. Its 12-bit resolution is sufficient to resolve 1 mmHg pressure steps across a 0-300 mmHg clinical range, and the low-power ASIC design preserves battery life over a multi-month replacement interval. The bare-die format allows the manufacturer to embed the ADC directly in the cuff hose connector, shrinking the main PCB. Always validate IEC 60601-1 EMI/ESD margins at the system level when integrating medical die-level parts.
Recomendado
Strain-Gauge Sensor Readout
In structural-health and weigh-in-motion applications, the MAX1009C/D-C7H digitizes the output of bonded foil strain gauges whose full-scale output is typically 2 mV/V. The ASIC's high-impedance input stage and low-level input conditioning minimize the external component count - a complete bridge-excitation + digitizer module can be built with the die plus a precision voltage reference and a few passives. The 12-bit resolution gives roughly 0.024% granularity, appropriate for 0.1%-class industrial strain readouts. The bare-die form factor is advantageous in remote sensor nodes where PCB height is constrained.
Recomendado
Remote Data-Acquisition Module
The MAX1009C/D-C7H suits battery-powered remote data-acquisition modules deployed in industrial IoT sensor networks. Its low-power ASIC design extends battery life, and the small die footprint allows integration inside weatherproof sensor housings without consuming PCB real estate. The 12-bit resolution is appropriate for many environmental and process variables (temperature compensated, pressure, flow) after signal conditioning. The high-impedance input accepts thermocouple and resistive-sensor outputs directly when paired with a low-drift external reference.
Recomendado
Handheld Test & Measurement Instrument
The MAX1009C/D-C7H is well-suited to handheld digital multimeters and process calibrators where a 12-bit reading of voltage, current, or temperature must be displayed with 0.1% accuracy. The bare-die form allows the ADC to be placed inside the probe tip or test-lead housing, eliminating long analog trace runs that would otherwise pick up noise. The high-impedance input accepts the meter's front-end attenuator output directly. Confirm ESD handling during module assembly because the die is more sensitive than a packaged part.
Recomendado
Glucose / Blood-Chemistry Meter
The MAX1009C/D-C7H is appropriate for disposable and reusable glucose / blood-chemistry strips that use electrochemical or colorimetric sensors. The high-impedance input stage reads the strip's microampere-level current output directly through a transimpedance configuration, while the 12-bit resolution resolves the glucose reading to clinically meaningful steps. The low-power ASIC design is critical for battery-powered handheld meters, and the bare-die form factor reduces per-unit cost in high-volume OEM strip readers.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MAX1009C/D-C7H — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MAX1009C/D-C10301 |
|---|---|---|
| Brand | Analog Devices / Maxim Integrated | Analog Devices / Maxim Integrated - same |
| Package | Bare die (C/D) | Bare die (C/D) - same |
| Resolution | 12 bit | 12 bit |
| Converter Type | ASIC ADC | ASIC ADC - same die |
| Suffix Code | C7H | C10301 |
| Input Stage | High-impedance, low-level input | High-impedance, low-level input - same |
| Target Application | Industrial / medical / data acquisition | Industrial / medical / data acquisition - same |
| Form Factor | Bare die, requires wire-bond assembly | Bare die, requires wire-bond assembly - same |
Diferenciadores clave
- Bare-die form factor eliminates package parasitics (frente a Packaged 12-bit ADC (e.g. MAX1112x family))
- Integrated high-impedance, low-level input stage (frente a Discrete ADC + external instrumentation amplifier)
- Same-die silicon available across lot suffixes (frente a MAX1009C/D-C10301 (alternate date-code suffix))
Notas de diseño
The MAX1009C/D-C7H is a bare die, not a packaged IC. It cannot be hand-soldered or placed on a standard PCB - it requires die-attach equipment, a wire-bonder, and a hermetic or sealed module substrate. For prototype evaluation without a hybrid-assembly line, request a packaged evaluation board from Maxim or substitute a packaged 12-bit ADC from the same Maxim data-converter family. Failure to confirm the form factor before committing the BOM is the single most common pitfall on this part.
When laying out the host substrate for the bare die, follow Maxim Application Note 3183 (or the equivalent die-packaging guideline referenced in the MAX1009 datasheet). Use a matched-CTE substrate (alumina or low-CTE PCB), keep analog bond wires short (<3 mm) to minimize lead-inductance, and provide a solid analog ground plane under the die. ESD protection at the module input is mandatory - the bare die is more sensitive than a packaged part during assembly and field service.
Because the MAX1009C/D-C7H is intended for low-level sensor inputs, the analog input traces on the host substrate should be guarded and surrounded by a ground ring. Estimate: at 12-bit resolution the LSB step is 1 LSB = VREF/4096, so for a 4.096 V reference the LSB is 1 mV; noise pickup above 1 mV RMS on the analog input will degrade the ENOB. Use a precision low-noise external reference (e.g., a 10 V or 4.096 V reference with <3 ppm/C drift) and place a 100 nF ceramic bypass directly at the die bond-pad.
Información de cumplimiento
RoHS compliance per Maxim/Analog Devices product page. Not AEC-Q100 qualified (industrial/medical use, not automotive). Halogen-free status not stated in the verified data.
