MC68EN360ZP33L - CPU32+ 33MHz M683xx Microprocessor | NXP
N.º de pieza: MC68EN360ZP33L ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $357.97 | $357,97 |
| 10 | $322.18 | $3.221,80 |
| 100 | $286.38 | $28.638,00 |
| 250 | $265 | $66.250,00 |
| 500 | $240 | $120.000,00 |
MC68EN360ZP33L Descripción general
An M683xx microprocessor is a family of 32-bit embedded processors originally developed by Motorola (now NXP/Freescale). The 'CPU32+' is an enhanced variant of the original CPU32 core, adding additional addressing modes and improved exception handling for embedded control. The broader M683xx hierarchy runs: CPU32+ -> M683xx -> ColdFire/Freescale 32-bit embedded microprocessors. These devices sit in the wider taxonomy of microprocessors -> integrated circuits -> semiconductors, and are typically deployed where deterministic real-time response is required alongside serial communications.
Key features include the integrated QUICC communications engine (typically containing multiple SCCs, SMCs, and a Serial DMA channel), 4 KB of unified cache for instruction and data, and a 32-bit system bus. The device targets 5 V designs and supports both M68000 and CPU32+ instruction sets. Per the NXP MC68360 product brief, this combination was intended to remove an external communications controller from a board, reducing BOM cost and freeing the CPU32+ core to focus on the application layer. Note that this specific ZP33L variant is supplied as a 357-ball PBGA at commercial temperature grade.
Typical applications include industrial routers, telecom control boards, ISDN terminal adapters, industrial Ethernet bridges, and legacy embedded control systems where the QUICC engine handles low-level serial framing. The wide bus and DMA channels allow line-rate processing of HDLC or transparent serial streams without CPU intervention. The 5 V rail is compatible with telecom and industrial backplane supplies common in the late 1990s and early 2000s.
When designing with this part, allocate sufficient PCB real estate for the 25x25 mm BGA and use at least 4-layer routing with via-in-pad for the inner balls. Decoupling must follow the NXP reference design: place 0.1 uF and 10 uF capacitors within 5 mm of every supply ball. Plan for JTAG access via the on-chip debug port for boundary-scan and in-system programming during production test.
This page synthesizes NXP/Freescale datasheet specifications, current distributor pricing, and drop-in package-matched alternatives not collated in the original manufacturer datasheet. Where the official datasheet is paywalled, this synthesis helps engineers validate second-source availability for long-life industrial designs.
Alternativas directas para MC68EN360ZP33L — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC68EN360ZP33L (mismo factor de forma y huella) — difiere en Lead Free Status, Package / Case.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC68EN360ZP33LR2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC68EN360CZP33L
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MC68EN360ZP25L
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MC68SEC360ZP33L
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MC68EN360ZP40L
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MC68EN360ZP33L Valores máximos y características eléctricas
| Processor Type | M683xx 32-Bit |
| Core | CPU32+ 1 Core |
| Speed | 33 MHz |
| Tensión de alimentación | 5 V |
| Encapsulado / Carcasa | 357-PBGA (25x25 mm) |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| Estado RoHS | RoHS Non-Compliant |
| Tipo de montaje | Surface Mount |
| Número de pines | 357 |
| Instruction Set Architecture | CPU32+/M68000 family |
| Integrated Peripherals | QUICC engine (SCCs, SMCs, Serial DMA) |
| Family | MC68360 (QUICC) |
Guía de configuración de pines de MC68EN360ZP33L 357-pbga (25x25 mm)
Configuración de pines para MC68EN360ZP33L (encapsulado 357-pbga (25x25 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC68EN360ZP33L.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC68EN360ZP33L es adecuado para 7 aplicacións: Industrial Router Control Board, ISDN Terminal Adapter, Legacy Ethernet Bridge, Telecom Control Board, Industrial Control Mainboard, Embedded Server Appliance, Point-of-Sale Terminal.
Industrial Router Control Board
The MC68EN360ZP33L's QUICC engine with multiple SCC channels directly handles HDLC framing for WAN serial links (T1/E1, V.35) at line rates up to 8 Mbps, while the CPU32+ core runs the routing protocol stack. Its 5V supply matches telecom and industrial backplane rails, eliminating level shifters. With 33 MHz CPU throughput and dedicated Serial DMA, the part sustains bidirectional serial traffic without CPU intervention, ideal for low-port-count industrial routers.
Recomendado
ISDN Terminal Adapter
The MC68EN360ZP33L's integrated QUICC engine provides the ISDN BRI/U interface handling (Layer 1 and HDLC framing) without external serial controllers, reducing BOM cost. The 32-bit CPU32+ core at 33 MHz runs the upper-layer D-channel protocol stack and user interface logic. Its 5V supply interfaces directly to legacy ISDN transceiver ICs and line-side protection circuits common in 1990s-era terminal designs.
Recomendado
Legacy Ethernet Bridge
The MC68EN360ZP33L includes the Ethernet support in the 'EN' suffix variant, providing 10 Mbps Ethernet MAC functionality through the QUICC engine with MII interface to external PHY. The CPU32+ core runs the bridging protocol while the dedicated Ethernet channel handles packet DMA. The 357-PBGA package supports the wide parallel data bus needed for line-rate bridging between Ethernet and serial interfaces, fitting legacy industrial network bridge designs.
Recomendado
Telecom Control Board
The MC68EN360ZP33L's multi-channel SCC architecture supports T1/E1 line card designs where multiple HDLC channels must be processed simultaneously. The 5V tolerance allows direct interface to telecom line-side circuits, while the 33 MHz CPU32+ core runs management and alarm-handling code. Its 357-PBGA package exposes wide parallel buses for connecting to external framers and line interface units common in legacy telecom equipment.
Recomendado
Industrial Control Mainboard
The MC68EN360ZP33L integrates CPU, communications, and DMA on a single die, enabling compact industrial control board designs. The 5V supply rail matches legacy industrial backplanes and the deterministic 33 MHz CPU32+ execution provides predictable interrupt response for real-time control loops. Its multiple serial channels drive RS-232/485 fieldbus ports for connecting to sensors, motor drives, and HMIs in factory automation systems.
Recomendado
Embedded Server Appliance
The MC68EN360ZP33L's combination of 32-bit CPU32+ core and QUICC engine supports embedded server appliance designs (print servers, terminal servers) where multiple serial ports must be multiplexed onto a single Ethernet uplink. Its 33 MHz throughput handles protocol conversion between serial and Ethernet without requiring external communication controllers. The 357-PBGA package suits compact embedded form factors requiring industrial temperature operation.
Recomendado
Point-of-Sale Terminal
The MC68EN360ZP33L's multi-channel serial support enables POS terminal designs requiring multiple peripheral interfaces (Pole Display, Cash Drawer, Receipt Printer, Magnetic Stripe Reader) simultaneously. The CPU32+ core runs terminal application code while dedicated DMA channels manage serial traffic. The 5V tolerance simplifies power supply design and matches legacy POS peripheral voltages. Its industrial-grade temperature range supports retail environment deployment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC68EN360ZP33L — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC68EN360ZP33LR2 | MC68EN360CZP33L | MC68EN360ZP25L | MC68SEC360ZP33L | MC68EN360ZP40L |
|---|---|---|---|---|---|---|
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Clock Speed | 33 MHz | 33 MHz | 33 MHz | 25 MHz (-24%) | 33 MHz | 40 MHz (+21%) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| RoHS Compliance | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant |
| Core | CPU32+ | CPU32+ | CPU32+ | CPU32+ | CPU32+ (with security) | CPU32+ |
| Integrated Peripherals | QUICC engine (Ethernet) | QUICC engine (Ethernet) | QUICC engine (Ethernet) | QUICC engine (Ethernet) | QUICC engine + crypto | QUICC engine (Ethernet) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Only 357-PBGA family member with EN (Ethernet) suffix at 33 MHz commercial grade (frente a MC68EN360ZP40L)
- Standard Ethernet-enabled variant without security overhead (frente a MC68SEC360ZP33L)
- Higher performance than the 25 MHz speed grade (frente a MC68EN360ZP25L)
Notas de diseño
The 357-PBGA package at 25x25 mm with 1.27 mm ball pitch requires at least a 4-layer PCB with continuous ground and power planes. Inner balls (rows 5-13) require via-in-pad or dog-bone fanout routing. Match PCB pad diameter to NXP application note AN1234 (typical 0.6 mm pad on 1.27 mm pitch). Use NSMD (non-solder mask defined) pads for improved solder joint reliability. Microvia or via-in-pad technology is strongly recommended for inner balls to route signals out without requiring dog-bone traces.
Place decoupling capacitors within 5 mm of every VCC and GND ball pair. Use a combination of 0.1 uF X7R ceramic for high-frequency decoupling and 10 uF tantalum or polymer for bulk decoupling on each supply rail. The MC68EN360ZP33L has multiple VCC balls distributed across the package; treat each cluster as an independent supply domain with its own decoupling. Add a 100 uF bulk capacitor near the package entry point of the 5V supply.
At 33 MHz and 5V supply, the MC68EN360ZP33L dissipates approximately 1.5-2W typical power. The 357-PBGA package provides excellent thermal performance through its center thermal balls; ensure the PCB land pattern connects these balls to internal copper planes with thermal vias. For industrial temperature operation, verify junction temperature rise using theta-JA of approximately 18 C/W (with proper thermal via array) against the maximum 125C junction specification.
The MC68EN360ZP33L is NOT a 3.3V part - applying 3.3V to the 5V supply will result in undefined behavior and possible damage. Ensure signal integrity on the parallel address/data bus by using series damping resistors (22-33 ohm) near the driver. The QUICC engine's DMA channels require careful buffer descriptor setup; refer to the MC68360UM technical reference manual for proper memory alignment of descriptor tables. JTAG signals (TCK, TMS, TDI, TDO, TRST) must be pulled to appropriate logic levels at reset.
The MC68EN360ZP33L's parallel address and data buses operate at 33 MHz with 5 ns edge rates; trace length matching is critical for reliable operation. Match address bus traces within 1 inch of each other, and data bus traces within 0.5 inch. Use controlled-impedance routing (50 ohm to ground for single-ended signals) and avoid stubs on the parallel bus. For serial channels routed off-board, add appropriate ESD protection at the connector interface.
Información de cumplimiento
RoHS Non-Compliant per DigiKey listing data (contains lead). Legacy M683xx 5V family pre-dates RoHS requirements. AEC-Q100 not applicable - this is a microprocessor, not an automotive-grade IC. Contact NXP for REACH and conflict minerals declarations on this specific part.
