MC860ENCVR50D4R2 - MPC860 50MHz PowerQUICC MPU 357-BGA | NXP
N.º de pieza: MC860ENCVR50D4R2 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $215 | $215,00 |
| 10 | $198 | $1.980,00 |
| 100 | $175 | $17.500,00 |
| 500 | $152 | $76.000,00 |
| 1.000 | $138 | $138.000,00 |
MC860ENCVR50D4R2 Descripción general
A PowerQUICC microprocessor is a communication-centric integrated CPU plus peripheral device that combines a PowerPC processor core with dedicated communication engines (CPM) for protocol handling, UART, SCC, SMC, and memory controllers. Within the broader taxonomy, the MPC860 sits in the hierarchy of microprocessor -> embedded MPU -> communications processor -> PowerQUICC -> semiconductor. It enables designers to consolidate networking, serial, and basic control-plane tasks onto a single die, reducing system complexity compared with separate CPU plus ASIC approaches.
Key features include a 32-bit PowerPC core running at 50 MHz, 3.3 V supply operation, a 357-ball Plastic BGA footprint (25 x 25 mm) with 1.27 mm pitch, integrated communications peripheral module (CPM) supporting multiple serial channels, and JTAG/BDM support for boundary scan and on-chip debug. The device is offered in a Tape and Reel packaging format. Per the DigiKey product listing, the device ships in Digi-Reel cut-tape formats directly from manufacturer reels.
The MPC860 family uses a power-on reset and PLL subsystem with separate clock domains that allow the CPU and CPM to operate at different rates while sharing peripherals. Internal memory controllers support DRAM, SRAM, and Flash without external glue logic, and a separate PCMCIA/PC Card controller interface is included for legacy I/O expansion. These characteristics matter most in sustained-throughput industrial designs where deterministic serial behavior is required.
Typical applications include legacy telecom line-card controllers, industrial serial concentrators and protocol bridges, factory automation gateways, and networking routers and bridges. The wide 3.3 V tolerance and integrated CPM make the part especially attractive when multiple serial channels are required in a small BOM.
When designing with this part, plan decoupling carefully: place bulk and high-frequency ceramics as close as possible to each supply ball and ensure a solid ground reference on inner PCB layers. Consider thermal management of the large 25 x 25 mm BGA because the entire device is often board-area-constrained and cannot benefit from airflow.
This page synthesizes distributor stock and pricing, drop-in replacement candidates from the MPC860 family, PCB layout guidance, and BGA handling notes that go beyond the manufacturer datasheet alone.
Alternativas directas para MC860ENCVR50D4R2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC860ENCVR50D4R2 (mismo factor de forma y huella) — difiere en Core Architecture, Mounting Type, Packaging, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC860DEZQ50D4
✅ Sustitución directa✓ En stock
$24.95 / unidad
Ver hoja de datos →MPC860SRZQ50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC855TVR50D4R2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860ENCZQ50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC860CPVR50D4
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC860ENCVR50D4R2 Valores máximos y características eléctricas
| Processor Family | MPC8xx PowerQUICC |
| Core Architecture | PowerPC 32-bit |
| Core Count | 1 |
| Frecuencia de reloj máxima | 50 MHz |
| Tensión de alimentación de funcionamiento | 3.3 V |
| Encapsulado / Carcasa | 357-BBGA (PBGA, 25 x 25 mm) |
| Pitch | 1.27 mm |
| Tipo de montaje | Surface Mount, BGA |
| Packaging | Digi-Reel / Tape and Reel |
| Lead Free Status | Lead Free |
| Estado RoHS | RoHS compliant |
| Communications Module | CPM (SCC/SMC/UART/SPI) |
| JTAG / Debug Interface | Yes (BDM/JTAG) |
| Memory Controller | Integrated DRAM/SRAM/Flash + PCMCIA |
| Process Technology | 0.32 um CMOS |
Guía de configuración de pines de MC860ENCVR50D4R2 357-bbga (pbga, 25 x 25 mm)
Configuración de pines para MC860ENCVR50D4R2 (encapsulado 357-bbga (pbga, 25 x 25 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC860ENCVR50D4R2.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC860ENCVR50D4R2 es adecuado para 6 aplicacións: Legacy Telecom Line-Card Controllers, Industrial Serial Concentrators / Protocol Bridges, Factory Automation Gateways and Protocol Converters, Networking Routers / Bridges, Military / Aerospace Ruggedized Communications, Embedded Test & Measurement Equipment.
Legacy Telecom Line-Card Controllers
The MC860ENCVR50D4R2 fits legacy telecom line-card controllers because its integrated PowerPC core at 50 MHz and on-chip Communications Processor Module deliver deterministic multi-channel serial handling (SCC/SMC) without external protocol ASICs. At 3.3 V supply with a 357-BBGA footprint (25 x 25 mm), it supports legacy 3.3 V line-card rails and PCI/cardbus-style glue-less board areas. Designers use it between the line-interface units and the host switch fabric, where multiple SCC channels aggregate voice/data traffic. Trade-off vs. an FPGA: lower BOM cost and proven firmware IP, but obsolescence risk if the design must ship beyond 2030. The 50 MHz clock is more than adequate for TDM and basic IP routing at typical line-card line rates.
Recomendado
Industrial Serial Concentrators / Protocol Bridges
In industrial serial concentrators, the MC860ENCVR50D4R2 bridges multiple RS-232/RS-485 UARTs and SPI peripherals to a host system through its integrated CPM. The 32-bit PowerPC core at 50 MHz can run a small RTOS for protocol conversion (Modbus, DF1, etc.) while the CPM off-loads DMA-style serial I/O, freeing CPU cycles for application logic. With a 357-ball BGA footprint and 3.3 V tolerance, it sits comfortably on a backplane or DIN-rail board with moderate thermal budgets. Performance advantage over a microcontroller: at least one order of magnitude in serial channel count and DMA throughput, with proven long-lifecycle firmware support from the MPC860 ecosystem.
Recomendado
Factory Automation Gateways and Protocol Converters
The MC860ENCVR50D4R2 is well suited to factory automation gateways that translate between legacy fieldbus protocols (e.g., Profibus on SCC channels) and Ethernet-based control networks. The integrated PCMCIA interface enables adding wireless or wired expansion modules for connecting legacy tools to modern plant networks. Drawing 3.3 V and delivering 50 MHz of PowerPC processing, it provides deterministic real-time behaviour without RTOS jitter on dedicated communication tasks. Compared to a discrete microcontroller plus UART expander, the MPC860 reduces PCB area by roughly 30-40% and BOM by approximately 20-25% in 8-channel gateway designs.
Recomendado
Networking Routers / Bridges
Small-office networking routers and bridges historically used the MC860ENCVR50D4R2 for WAN-edge aggregation, where its CPM provides fast-packet handling and SCC channels support T1/E1 WAN uplinks. The 50 MHz core runs routing tables and basic firewall logic while the CPM handles DMA buffering for serial WAN and 10/100 Ethernet MACs. The 357-PBGA 25 x 25 mm package allows 4-6 layer boards to host the MPU plus Ethernet PHYs without compromising signal integrity. Performance trade-off vs. modern NXP QorIQ: significantly higher power consumption per Mpps, but ideal for legacy installations where the existing firmware already targets PowerQUICC register definitions.
Recomendado
Military / Aerospace Ruggedized Communications
Ruggedized communications systems have adopted the MC860ENCVR50D4R2 because of its extended temperature screening options, hermetic-capable 357-BBGA package, and mature firmware ecosystem. The 3.3 V supply aligns with military avionic and ground-vehicle power buses, while the 50 MHz PowerPC core is sufficient for tactical radio bridging, sensor pre-processing, and MIL-STD-1553 / ARINC-429 protocol mapping. Engineers retrofit older designs by reusing the existing PCB footprint - no rework required when a part becomes obsolete, simply use the 357-BBGA same-package siblings such as MPC860DEZQ50D4. Avionics integrators value that the part has decades of in-service heritage on legacy platforms, simplifying qualification paperwork.
Recomendado
Embedded Test & Measurement Equipment
Embedded test and measurement instruments use the MC860ENCVR50D4R2 as the system controller, where the integrated CPM and SCC channels handle instrument peripherals (GPIB, USB, high-speed UART) while the PowerPC core runs measurement sequences and displays results. The 50 MHz performance is more than adequate for triggering logic, A/D data marshalling, and human-interface tasks. The 357-BBGA package preserves adequate routing space on a 6-layer board with controlled-impedance analog and digital sections. Trade-off vs. a Cortex-M class MCU: considerably higher processing headroom and more peripherals, but 5-10x higher power budget and a much larger PCB area footprint.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC860ENCVR50D4R2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC860DEZQ50D4 | MPC860SRZQ50D4 | MPC855TVR50D4R2 | MPC860ENCZQ50D4 | MPC860CPVR50D4 |
|---|---|---|---|---|---|---|
| Brand | NXP USA Inc. (Freescale legacy) | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
| Package | 357-BBGA (PBGA, 25x25, 1.27 mm pitch) | 357-BBGA (PBGA, 25x25) | 357-BBGA (PBGA, 25x25) | 357-BBGA (PBGA, 25x25) | 357-BBGA (PBGA, 25x25) | 357-BBGA (PBGA, 25x25) |
| Maximum Clock Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| CPM Feature Set | Full CPM (SCC/SMC/UART/SPI) | Full CPM | Full CPM + security | Reduced CPM | Full CPM | Alternate CPM config |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit | PowerPC 32-bit |
| Process Technology | 0.32 um CMOS | 0.32 um CMOS | 0.32 um CMOS | 0.32 um CMOS | 0.32 um CMOS | 0.32 um CMOS |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
Diferenciadores clave
- Full Communications Processor Module (CPM) feature set (frente a MPC855TVR50D4R2)
- Pin-compatible across MPC860 family ball map (frente a MPC860DEZQ50D4)
- Tape & Reel / Digi-Reel for production line compatibility (frente a Tray-packaged MPC860ENCZQ50D4)
Notas de diseño
The 357-BGA package at 25 x 25 mm with 1.27 mm pitch demands a 4-6 layer PCB with a solid ground plane directly under the device. Decoupling capacitors should be placed as close as possible to every supply ball - typically 100 nF ceramic per Vdd/Vss ball pair plus a 10 uF bulk cap per power domain. Use X-ray inspection to verify solder joint integrity after reflow and consider using a thicker board (1.6 mm minimum) to reduce BGA flex-cracking risk during thermal cycle.
Estimate: with all CPU/CPM subsystems running and the BGA on a standard 6-layer board, junction-to-ambient thermal resistance is approximately 18-22 C/W with adequate copper. At full load (around 1.0-1.2 W internal dissipation) the junction rises about 20-25 C above ambient. In enclosed chassis designs without airflow, derate clock frequency or add a heat spreader to keep Tj below 100 C for industrial temperature grades. Always validate with a thermal probe on a populated board during worst-case testing.
Do not assume the part is still in production - verify lifecycle status with NXP before committing to new designs. The MPC860 family is in obsolescence cycle; expect allocation and long lead times. Keep BSCAN/JTAG pins accessible for in-system programming and boundary-scan testing. Resistive termination on serial lines (RS-485/RS-232 transceivers) must be applied; the on-chip serial channels drive CMOS-level signals and do not include bus termination. Validate PCMCIA bus timing per the reference manual whenever using the legacy PC Card interface.
Memory bus (DRAM/SRAM/Flash) and PCMCIA signals all operate at the same 50 MHz system clock but edge rates are aggressive; route these nets on inner PCB layers with controlled impedance (typically 50 ohms single-ended). Keep memory bus length matching to within 2-3 cm across each byte group to maintain setup/hold margins. Use series damping resistors on heavily-loaded address/control lines if the bus is longer than approximately 8 cm. Avoid routing high-speed signals across the BGA substrate cut-out - the 357-ball array already constrains escape routing heavily.
The 3.3 V supply should be derived from a low-noise LDO (or DC-DC followed by an LDO) to reduce clock-domain jitter and CPM serial noise. Use separate ground returns for analog (clock PLLs) and digital logic whenever the design supports split grounds tied at one point near the BGA. Brown-out reset circuitry must hold HRESET low until all supplies are stable; the POR pin has a defined hysteresis window which should be respected.
Información de cumplimiento
Per DigiKey and Hotenda listings: Lead Free / RoHS compliant status is confirmed. Reach, halogen-free, and conflict-minerals declarations are not explicitly stated in the verified distributor data; consult NXP product compliance documentation.
