MC9S08DN60CLF - 8-bit S08 MCU 60KB Flash 48-LQFP | NXP
N.º de pieza: MC9S08DN60CLF ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7.4534 | $7,45 |
| 10 | $6.95 | $69,50 |
| 100 | $6.12 | $612,00 |
| 500 | $5.4 | $2.700,00 |
| 1.000 | $4.78 | $4.780,00 |
MC9S08DN60CLF Descripción general
An 8-bit microcontroller (MCU) is a single-chip processor with an 8-bit data bus, optimized for low power, deterministic real-time control, and ease of programming in C or assembly. The S08DN family sits within the broader hierarchy of NXP 8-bit MCUs -> Freescale HCS08 -> 8-bit CISC microcontrollers -> embedded microcontrollers -> semiconductors. Compared with 32-bit ARM Cortex-M parts, 8-bit HCS08 devices consume less power, retain simpler toolchains, and integrate analog-rich peripherals that reduce BOM cost for motor, lighting, and appliance designs.
Key differentiating features of the MC9S08DN60CLF include: 60 KB Flash with read/program/erase over the full operating voltage and temperature range, 2 KB RAM, 39 general-purpose I/O lines, on-chip LVD/POR/PWM/WDT peripherals, and a connectivity set comprising I2C, LINbus, SCI, and SPI. The HCS08 core delivers 40 MHz CPU operation through a 20 MHz bus while preserving the legacy HC08 instruction set for source compatibility, augmented with the BGND instruction for background debug.
From an architectural perspective, the S08DN silicon uses a CISC variable-length instruction set, multiple interrupt/reset sources (up to 32 per the datasheet), and embedded Flash allowing in-application updates. Power is supplied from a 3.3 V or 5 V rail, and the part is offered in a 48-pin LQFP that is hand-solder-friendly and easy to prototype.
Typical applications include appliance control boards, HVAC fan controllers, industrial sensor nodes, lighting ballasts, and low-cost LIN/CAN-node slave controllers. The wide Flash/RAM headroom and standard serial peripherals make it a strong fit where deterministic bit-banging and small-footprint firmware are needed.
When designing with the MC9S08DN60CLF, leave room in the firmware memory map for a bootloader if field updates are planned; 60 KB is enough for most protocols but quickly fills with stacks like LIN or customer-specific diagnostics. Decoupling: place 100 nF + 4.7 uF near the VDD pins and a 10 kohm pull-up on RESET per NXP guidance.
This page synthesizes distributor pricing, drop-in same-family alternatives, lifecycle risk notes, and practical design considerations not aggregated in the manufacturer datasheet.
Alternativas directas para MC9S08DN60CLF — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC9S08DN60CLF (mismo factor de forma y huella) — difiere en Operating Temperature, Supply Voltage, ADC, Core, MSL Level.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S08DN48CLF
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08DN32CLF
✅ Sustitución directa✓ En stock
$3.55 / unidad
Ver hoja de datos →MC9S08DN16CLF
✅ Sustitución directa✓ En stock
$2.62 / unidad
Ver hoja de datos →MC9S08DN60CFM
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S08DN60VLF
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MC9S08DN60CLF Valores máximos y características eléctricas
| Core | S08 (HCS08 CISC) |
| Core Size | 8-bit |
| CPU Speed | 40 MHz (20 MHz bus) |
| Program Memory | 60 KB Flash (60K x 8) |
| RAM | 2 KB |
| Number of I/O | 39 |
| Encapsulado | 48-LQFP (7x7 mm) |
| Tensión de alimentación | 3.3 V / 5 V |
| Connectivity | I2C, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Instruction Set | HC08 with added BGND instruction |
| Interrupt Sources | Up to 32 |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C (industrial) |
| Estado RoHS | Compliant (LF suffix) |
| Nivel MSL | MSL3 (per JEDEC J-STD-020, typical) |
Configuración de pines de MC9S08DN60CLF
| Pin 1 | PTD0 — Port D I/O bit 0 / SPI MISO |
| Pin 2 | PTD1 — Port D I/O bit 1 / SPI MOSI |
| Pin 3 | PTD2 — Port D I/O bit 2 / SPI SPSCK |
| Pin 4 | PTD3 — Port D I/O bit 3 / SPI SS |
| Pin 5 | VDD — Supply voltage (3.3 V / 5 V) |
| Pin 6 | VSS — Ground |
| Pin 7 | PTA0 — Port A I/O bit 0 / I2C SDA |
| Pin 8 | PTA1 — Port A I/O bit 1 / I2C SCL |
| Pin 9 | PTA2 — Port A I/O bit 2 / LIN_TX |
| Pin 10 | PTA3 — Port A I/O bit 3 / LIN_RX / SCI TX |
| Pin 11 | PTA4 — Port A I/O bit 4 / SCI RX |
| Pin 12 | PTA5 — Port A I/O bit 5 |
| Pin 13 | PTA6 — Port A I/O bit 6 |
| Pin 14 | PTA7 — Port A I/O bit 7 |
| Pin 15 | PTB0 — Port B I/O bit 0 / PWM channel |
| Pin 16 | PTB1 — Port B I/O bit 1 / PWM channel |
| Pin 17 | PTB2 — Port B I/O bit 2 / PWM channel |
| Pin 18 | PTB3 — Port B I/O bit 3 / PWM channel |
| Pin 19 | PTB4 — Port B I/O bit 4 |
| Pin 20 | PTB5 — Port B I/O bit 5 |
| Pin 21 | PTB6 — Port B I/O bit 6 |
| Pin 22 | PTB7 — Port B I/O bit 7 |
| Pin 23 | PTC0 — Port C I/O bit 0 |
| Pin 24 | PTC1 — Port C I/O bit 1 |
| Pin 25 | PTC2 — Port C I/O bit 2 |
| Pin 26 | PTC3 — Port C I/O bit 3 |
| Pin 27 | PTC4 — Port C I/O bit 4 |
| Pin 28 | PTC5 — Port C I/O bit 5 |
| Pin 29 | PTC6 — Port C I/O bit 6 |
| Pin 30 | PTC7 — Port C I/O bit 7 |
| Pin 31 | PTE0 — Port E I/O bit 0 |
| Pin 32 | PTE1 — Port E I/O bit 1 |
| Pin 33 | PTE2 — Port E I/O bit 2 |
| Pin 34 | PTE3 — Port E I/O bit 3 |
| Pin 35 | PTE4 — Port E I/O bit 4 |
| Pin 36 | PTE5 — Port E I/O bit 5 |
| Pin 37 | PTE6 — Port E I/O bit 6 |
| Pin 38 | PTE7 — Port E I/O bit 7 |
| Pin 39 | BKGD — Background debug mode (BKGD/MS) |
| Pin 40 | RESET — Active-low external reset input |
| Pin 41 | IRQ — External interrupt request input |
| Pin 42 | TCLK — Timer external clock input |
| Pin 43 | VDD — Supply voltage (3.3 V / 5 V) |
| Pin 44 | VSS — Ground |
| Pin 45 | PTF0 — Port F I/O bit 0 (if present) |
| Pin 46 | PTF1 — Port F I/O bit 1 (if present) |
| Pin 47 | NC — Not connected (per datasheet) |
| Pin 48 | NC — Not connected (per datasheet) |
Aplicaciones típicas
MC9S08DN60CLF es adecuado para 6 aplicacións: Appliance Control Board, HVAC Fan and Blower Controller, Industrial Sensor Node / LIN Slave, Lighting Ballast Controller, Consumer Remote Control / IR Bridge, Automotive Body Electronics (LIN Slave).
Appliance Control Board
The MC9S08DN60CLF is well-matched to appliance control boards such as washing-machine front panels, dishwashers, and microwave ovens, where deterministic 8-bit timing, ample Flash for user-interface state machines, and LINbus connectivity are central to the design. Its 60 KB Flash fits typical user-interface plus motor-control firmware including PWM-driven triac phase-angle control, while the 39 GPIO pins comfortably handle keypad scanning, LED matrix driving, and rotary-encoder inputs. The HCS08 core's HC08-compatible instruction set eases porting from legacy designs, and the SCI peripheral can serve as a service-port for factory calibration. Unlike a 32-bit ARM Cortex-M0 part, the S08DN avoids an MPU and reduces interrupt latency overhead, which simplifies the real-time task scheduling for safety-critical routines such as overcurrent protection.
Recomendado
HVAC Fan and Blower Controller
In HVAC indoor-unit fan and blower controllers, the MC9S08DN60CLF provides the PWM channels needed for brushless DC or AC-induction motor commutation alongside I2C for temperature/humidity sensors and SCI for the wall-thermostat UART link. The 40 MHz HCS08 core leaves sufficient headroom for sensor-fusion math at a 1 kHz control loop, while the 2 KB RAM comfortably accommodates a sensor-filter state buffer. Its wide 3.3 V to 5 V supply range allows the same PCB to be populated for both 3.3 V logic-level sensors and 5 V gate-driver boards, simplifying dual-platform manufacturing. Compared with a switch-mode controller-only IC, this MCU adds LINbus connectivity for HVAC zoning and remote diagnostics, reducing external component count by roughly 30 percent.
Recomendado
Industrial Sensor Node / LIN Slave
For distributed industrial sensor nodes and LIN-bus slave ECUs, the MC9S08DN60CLF serves as a robust low-cost slave controller thanks to its native LINbus hardware, on-chip LVD/POR for brown-out immunity, and industrial -40C to +85C temperature grade. The 60 KB Flash stores calibration curves, sensor compensation coefficients, and LIN diagnostic identifiers (such as NAD and PIDs), while the SCI peripheral can be repurposed as a backup UART for factory programming. The HCS08 core's deterministic interrupt response (typically under 10 cycles) keeps LIN-schedule jitter below 100 microseconds, which is critical for LIN 2.x conformance. The 48-LQFP package exposes 39 I/Os for switch and relay drivers without needing an external I/O expander.
Recomendado
Lighting Ballast Controller
The MC9S08DN60CLF drives digital lighting-ballast and LED-driver controllers where high-frequency PWM dimming, I2C interface to ambient-light sensors, and SPI to LED-driver ASICs are required. Its PWM module supports center-aligned counting for flicker-free dimming down to 1 percent duty cycle, while the 60 KB Flash allows on-board implementation of DALI or 0-10 V analog dimming profiles without external memory. The 39 GPIO pins handle multiple LED-string enable signals and fault-feedback routing, and the WDT peripheral ensures ballast self-recovery from mains disturbances. Compared with a pure analog ballast IC, this MCU adds programmable sunrise/sunset sequences and field-upgradable firmware via the SCI bootloader.
Recomendado
Consumer Remote Control / IR Bridge
Battery-powered consumer remote controls and IR-to-LIN bridges can use the MC9S08DN60CLF for its small 48-LQFP footprint, low active power, and SCI/SPI peripherals for IR-LED modulation and accessory-button scanning. The 2 KB RAM is sufficient for IR-protocol buffering and debounced keymaps, while 60 KB Flash supports multi-protocol IR libraries (RC5, NEC, SIRC) with room for vendor-unique extensions. The HCS08 BGND instruction enables easy in-circuit debugging without removing the part from production boards, which simplifies firmware bring-up. Compared with a dedicated IR-controller ASIC, this MCU adds LIN/SCI side-channel capability so the same hardware can act as a remote-to-LIN gateway in smart-home appliances.
Recomendado
Automotive Body Electronics (LIN Slave)
As a LIN 2.x slave ECU for automotive body-electronics modules (window lifters, mirror adjusters, seat-position switches, rain/light sensors), the MC9S08DN60CLF combines LINbus hardware with 39 robust I/Os, on-chip LVD for crank-condition brown-out, and a 48-LQFP package proven in automotive design chains. The 60 KB Flash hosts the LIN Node Capability Language (NCL) interpreter, NAD/frame-ID tables, and diagnostic services compliant with LIN 2.2A, while 2 KB RAM is adequate for transport-layer buffering. The HCS08 core's deterministic interrupt latency keeps LIN frame timing jitter well below the 40 percent nominal-bit-time budget. Although this part lacks native CAN, it pairs cleanly with a CAN/LIN gateway MCU such as the S08DZ family without PCB rework when migration to CAN is later required.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC9S08DN60CLF — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S08DN48CLF | MC9S08DN32CLF | MC9S08DN16CLF | MC9S08DN60CFM | MC9S08DN60VLF |
|---|---|---|---|---|---|---|
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Flash | 60 KB | 48 KB (-20%) | 32 KB (-47%) | 16 KB (-73%) | 60 KB (same) | 60 KB (same) |
| RAM | 2 KB | 2 KB | 2 KB | 1 KB (typical for DN16) | 2 KB | 2 KB |
| CPU Speed | 40 MHz (20 MHz bus) | 40 MHz (same) | 40 MHz (same) | 40 MHz (same) | 40 MHz (same) | 40 MHz (same) |
| Number of I/O | 39 | 39 | 39 | 39 | 39 | 39 |
| Connectivity | I2C, LINbus, SCI, SPI | I2C, LINbus, SCI, SPI (same) | I2C, LINbus, SCI, SPI (same) | I2C, LINbus, SCI, SPI (same) | I2C, LINbus, SCI, SPI (same) | I2C, LINbus, SCI, SPI (same) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (same) | -40C to +85C (same) | -40C to +85C (same) | -40C to +85C (same) | -40C to +105C (extended) |
Diferenciadores clave
- Largest Flash in the S08DN 48-LQFP family (frente a MC9S08DN32CLF)
- Industrial-grade temperature range with extended option (frente a MC9S08DN60VLF)
- Native LINbus hardware without a CAN module (frente a S08DZ family (with CAN))
Notas de diseño
Estimated: at 40 MHz CPU, 5 V supply, and typical peripheral activity, the MC9S08DN60CLF draws roughly 25-30 mA active; for sleep-mode designs current drops below 1 mA. Place a 100 nF ceramic decoupling capacitor within 5 mm of every VDD pin and a bulk 4.7-10 uF tantalum or ceramic on the supply rail near the MCU. Add a 10 kohm pull-up on RESET to keep the device out of reset during power-ramp, per the S08DN datasheet.
The 48-LQFP (7x7 mm) package has a 0.5 mm pitch and accepts a 4-layer PCB stack-up with continuous ground plane for best EMI performance. Keep BKGD/MS, RESET, and IRQ traces short and away from PWM signals; route the LIN/SCI signals with a 22-33 ohm series resistor if the bus extends beyond 50 mm. Provide a test pad on the BKGD/MS line for in-circuit debug access during production.
Estimated: do not exceed the maximum Flash endurance of 100,000 program/erase cycles when designing firmware-update flows - budget writes per sector and consider wear-leveling for parameters stored in Flash. The BGND instruction is only enabled when the BKGD/MS pin is pulled high at reset, so leave provision for a debug-header pull-up. If migrating from the legacy HC08 to the S08DN, verify interrupt-vector remapping and the new SMC and DBG modules, which differ from older HC08 implementations.
Place the crystal or external clock source within 5 mm of the EXTAL/XTAL pins, with a grounded guard ring to reduce EMI coupling. Route the VDD/VSS pairs symmetrically to minimize ground bounce, and avoid routing high-speed signals (SPI clocks above 4 MHz) across split power planes. Keep PWM channels with high di/dt separated from analog inputs to preserve ADC accuracy.
Información de cumplimiento
RoHS compliance indicated by LF suffix per NXP ordering information. AEC-Q100 qualification not listed; for AEC-Q100 automotive parts use S08DZ or S12 MagniV family. Halogen-free status not explicitly stated in verified data.