MC9S12XD64CAA - 16-bit 80MHz S12X MCU, 64KB Flash | NXP
N.º de pieza: MC9S12XD64CAA ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $18.75 | $18,75 |
| 10 | $16.42 | $164,20 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.2 | $5.600,00 |
| 1.000 | $9.65 | $9.650,00 |
MC9S12XD64CAA Descripción general
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), working memory (RAM), and peripheral interfaces (ADC, communication controllers, GPIO) into one package. Within the embedded hierarchy it sits at the node: microcontroller -> embedded processor -> semiconductor IC. The HCS12X family adds a wider internal bus and richer peripherals (CAN, SCI, SPI, PWM, timers) to the classic HCS12, while keeping the CISC architecture and 16-bit data path. MC9S12XD64CAA therefore occupies the cost-down tier of the S12XD sub-family, sharing its peripherals with higher-flash siblings such as MC9S12XD128/MC9S12XD256.
Key features include 64 KB Flash with 4 KB RAM plus 1 KB EEPROM, an 80 MHz maximum CPU frequency driving a 40 MHz internal bus, and an 8-channel 10-bit ADC for analog sensing. Connectivity is supplied by CAN, SCI (UART), SPI, and I2C, while timers, PWM, and a watchdog provide real-time control. The 80-pin QFP (PQFP, 14x14 mm) exposes 59 GPIOs and supports 2.35 V - 2.75 V or 5 V operation per DigiKey/NXP specifications, enabling direct interface to 5 V sensors and actuators in automotive body and chassis applications.
Architecturally the device uses the enhanced HCS12X core with an instruction queue that prefetches the next opcodes while the current one executes, raising throughput versus the legacy HCS12 at the same bus speed. The 40 MHz internal bus allows the periphery to run at half the CPU clock, balancing performance and EMI. NXP's CISC implementation is mature for deterministic interrupt response, which matters in CAN-driven automotive networks. The on-chip EEPROM and 64 KB Flash support in-application reprogramming via background debug mode (BDM).
Typical applications include automotive body controllers, instrument clusters, CAN/LIN gateway nodes, industrial PLC I/O modules, and HVAC climate controllers where CAN connectivity, 5 V tolerance, and the HCS12 software ecosystem are decisive. The wide supply range and abundant timers suit brushed-motor and solenoid drivers.
When designing with this device, allocate a 4.7 kohm pull-up on the RESET line, decouple VDD/VSSX with 100 nF plus bulk caps, and reserve the BKGD pin for in-circuit debugging; consult the NXP S12XD-family reference manual for BDPM/BDM details. Use the 80-pin QFP footprint pad pattern verbatim - this part is end-of-life so plan a migration to MC9S12XEQ512CAG or similar S12XD-family siblings if long-term production is required.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the NXP datasheet alone.
Alternativas directas para MC9S12XD64CAA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MC9S12XD64CAA (mismo factor de forma y huella) — difiere en Operating Temperature, Package, ADC, Core Processor, Lifecycle Stage.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MC9S12XD64MAA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12XD128CAA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12XDG128CAA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12XEQ512CAG
✅ Sustitución directa✓ En stock
$14.4 / unidad
Ver hoja de datos →S912XEQ512J2MAA
✅ Sustitución directa✓ En stock
$8.6 / unidad
Ver hoja de datos →S9S12P64J0CQK
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MC9S12XD64CAA Valores máximos y características eléctricas
| Core Processor | HCS12X (16-bit CISC) |
| Core Size | 16-Bit |
| Maximum CPU Clock | 80 MHz |
| Internal Bus Speed | 40 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM | 4 KB |
| EEPROM | 1 KB |
| ADC | 8-channel, 10-bit |
| Tensión de alimentación | 2.35 V to 2.75 V (3.3 V) or 5 V |
| I/O Pins (GPIO) | 59 |
| Total I/O Ports | 119 (per digchip listing) |
| Connectivity | CAN, I2C, IrDA, LINbus, SCI (UART), SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Encapsulado | 80-QFP (PQFP, 14x14 mm) |
| Temperatura de funcionamiento | -40C to +85C |
| Tipo de montaje | Surface Mount |
| ROM Type | Flash |
| Lifecycle Stage | Not For New Designs (NRND) |
Guía de configuración de pines de MC9S12XD64CAA 80-qfp (pqfp, 14x14 mm)
Configuración de pines para MC9S12XD64CAA (encapsulado 80-qfp (pqfp, 14x14 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MC9S12XD64CAA.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MC9S12XD64CAA es adecuado para 6 aplicacións: Automotive Body Control Module, HVAC Climate Controller, Industrial CAN/LIN Gateway, Instrument Cluster Driver, Programmable Logic Controller I/O Module, Battery Management Slave Board.
Automotive Body Control Module
The MC9S12XD64CAA's HCS12X core at 80 MHz and integrated MSCAN controller suit automotive body controllers that orchestrate door locks, lighting, and mirror actuators. The 64 KB Flash holds the body-control state machine plus LIN node software, while 4 KB RAM and 1 KB EEPROM store configurable parameters and fault logs. Its 5 V I/O tolerance interfaces directly with body-domain sensors and smart switches, avoiding external level shifters. The 80-QFP package is well established in automotive PCB supply chains.
Recomendado
HVAC Climate Controller
The MC9S12XD64CAA for cloud-based thermal management is a strong fit for HVAC climate controllers that drive brushless DC fans, stepper-mode air mixers, and read cabin temperature sensors. Its 8-channel 10-bit ADC captures multiple thermistor inputs simultaneously, while PWM channels drive actuator motors. The 5 V I/O and 80-QFP footprint simplify integration with existing HVAC hardware designed for the HCS12 legacy family. The HCS12X instruction queue keeps HID calls short.
Recomendado
Industrial CAN/LIN Gateway
The MC9S12XD64CAA's integrated MSCAN, SCI, and LINbus controllers make it a natural gateway node that bridges a CAN backbone to LIN sub-buses in industrial automation panels. The HCS12X core runs the gateway routing and protocol-conversion stack in 64 KB Flash, while the 10-bit ADC monitors supply rail health. Its automotive heritage gives strong ESD and EMI margins for noisy industrial cabinets, and the 80-QFP package eases hand-rework during prototyping.
Recomendado
Instrument Cluster Driver
The MC9S12XD64CAA drives stepper-motor gauge pointers and segment-LCD displays in automotive instrument clusters. Its PWM outputs and timers generate the multi-phase stepper drive waveforms, while SCI links to the cluster's main processor and CAN interfaces with the vehicle network. The 80 MHz HCS12X core updates gauge positions smoothly, and 5 V tolerance matches traditional cluster-driver discrete components.
Recomendado
Programmable Logic Controller I/O Module
The MC9S12XD64CAA's 59 GPIOs and 8-channel 10-bit ADC serve as a distributed I/O module for industrial PLC backplanes, sampling digital inputs and analog sensor channels then reporting over CAN or SCI. The HCS12X core runs deterministic scan loops under timer interrupts, exploiting the legacy HCS12 programmer's model for predictable jitter. The 80-QFP package supports reflow soldering on standard ENIG PCB finishes, and 5 V tolerance accommodates legacy 24 V industrial sensor interfaces.
Recomendado
Battery Management Slave Board
The MC9S12XD64CAA supervises individual cells in a battery management system, using the 10-bit ADC for cell-voltage and thermistor-overload averaging, and the LINbus controller for slave communication with the master BMS controller. Its 5 V tolerance and automotive-grade heritage suit 12 V lead-acid and low-voltage Li-ion packs. The HCS12X core at 80 MHz runs cell-balancing control loops in real time, while the 1 KB EEPROM stores calibration and lifetime data.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MC9S12XD64CAA — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MC9S12XD64MAA | MC9S12XD128CAA | MC9S12XDG128CAA | MC9S12XEQ512CAG | S912XEQ512J2MAA | S9S12P64J0CQK |
|---|---|---|---|---|---|---|---|
| Package | 80-QFP (14x14 mm) | 80-QFP (14x14 mm) | 80-QFP (14x14 mm) | 80-QFP (14x14 mm) | 144-QFP | 80-QFP (14x14 mm) | 80-QFP (14x14 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash | 64 KB | 64 KB | 128 KB | 128 KB | 512 KB | 512 KB | 64 KB |
| RAM | 4 KB | 4 KB | 8 KB | 8 KB | 32 KB | 32 KB | 4 KB |
| Core | HCS12X 16-bit 80 MHz | HCS12X 16-bit 80 MHz | HCS12X 16-bit 80 MHz | HCS12X 16-bit 80 MHz | HCS12X 16-bit 80 MHz | HCS12X 16-bit 80 MHz | S12P 16-bit (lower perf) |
| EEPROM | 1 KB | 1 KB | 2 KB | 2 KB | 4 KB | 4 KB | 1 KB |
| ADC | 8-ch 10-bit | 8-ch 10-bit | 8-ch 10-bit | 8-ch 10-bit | 8-ch 10-bit | 8-ch 10-bit | 8-ch 10-bit |
| CAN Controller | Yes (MSCAN) | Yes (MSCAN) | Yes (MSCAN) | Yes (multi-CAN) | Yes (multi-CAN) | Yes (multi-CAN) | Yes (MSCAN) |
| Lifecycle Status | NRND | Active | Active | Active | Active | Active | Active |
Diferenciadores clave
- Same-Flash factory-fresh alternative (frente a MC9S12XD64MAA)
- Doubled Flash without PCB rework (frente a MC9S12XD128CAA)
- Long-term production alternative
- Multi-CAN controller in same footprint (frente a MC9S12XDG128CAA)
- Higher Flash with same 80-QFP (frente a S912XEQ512J2MAA)
Notas de diseño
Estimated: At 80 MHz the HCS12X core draws roughly 50-65 mA from VDD (3.3 V typical) plus port pin current. Decouple VDD/VSSX pairs with 100 nF ceramic plus 10 uF bulk caps placed within 5 mm of each pair. For 5 V operation ensure VDDR (I/O supply) tracks VDDX within tolerance and add a ferrite bead to isolate ADC reference noise.
Use the standard 80-QFP (14x14 mm) land pattern per IPC-7351 with 0.5 mm pitch. Keep the BKGD (background debug) trace short (<50 mm) and isolated from high-current traces; route RESET with a 4.7 kohm pull-up to VDDR and place the decoupling caps adjacent to the MCU. Add a ground pour under the 60 VSSX thermal pad to improve thermal dissipation (estimated theta_JA ~50 C/W for 80-QFP).
For CAN bus, add a 120 ohm split termination (two 60 ohm resistors with a 4.7 nF capacitor to ground at the midpoint) at each bus end to suppress ringing. Match CANH/CANL trace lengths to within 5 mm and keep them at least 3x the trace width away from switching nodes. SPI traces to sensors should be length-matched within 25 mm when running above 10 MHz to avoid skew.
Do not assume the 1 KB EEPROM is byte-endurance rated like an external memory - NXP rates internal EEPROM at 10k-100k cycles per sector. Use wear-leveling for parameter storage. Also note that the ADC accuracy depends on the bandgap reference; warm-up time of ~5 ms after enabling the ATD module is required before conversion for specified accuracy. The MODC register must be configured correctly for normal (non-BDM) single-chip mode or the MCU will not execute user code.
Información de cumplimiento
RoHS and lead-free per NXP product environmental documentation. AEC-Q100 qualification is not explicitly stated in the verified data; the part is qualified for industrial/automotive body-controller applications but AEC-Q100 grade is [DATA_NEEDED]. Lifecycle is NRND as of 2026-10-20.