NXP Semiconductors

MC9S12XHZ512CAL - 16-Bit HCS12X MCU, 512KB Flash, 80MHz | NXP

N.º de pieza: MC9S12XHZ512CAL ✗ Fin de vida
En stock Se envía en 1-3 días hábiles
2.5 V / 5 V (dual-range) Vdss 112-LQFP (20 x 20 mm) Package 80 MHz Speed 512 KB (512K x 8) Flash Memory
Desde $13.2 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-19
Precios por volumen
Cant. Precio unitario Total
1 $21.5 $21,50
10 $19.8 $198,00
100 $17.95 $1.795,00
500 $15.4 $7.700,00
1.000 $13.2 $13.200,00
ℹ️ Todos los precios están en USD

MC9S12XHZ512CAL Descripción general

The NXP MC9S12XHZ512CAL is a 16-bit HCS12X microcontroller delivering 512KB of on-chip Flash and an 80 MHz CPU speed, housed in a 112-pin LQFP (20x20 mm) package. It is part of the S12XHZ family, the industry's first instrumentation cluster MCU with an integrated TFT display driver, designed for low-end automotive dashboard graphics including analog gauges, dot-matrix displays, LCDs, and high-resolution color TFT panels.

An HCS12X microcontroller is a 16-bit CISC automotive-grade MCU built on the Freescale/NXP S12 architecture, used widely in body electronics, instrument clusters, and gateway modules. It belongs to the broader 16-bit MCU category, which sits between 8-bit microcontrollers (such as the HC08) and 32-bit Cortex-M devices in the automotive microcontroller taxonomy. The XHZ family in particular adds an on-chip TFT/DLCD display controller, multiple CAN channels, and a peripheral coprocessor (XGATE) tailored to cluster applications.

Key features of the MC9S12XHZ512CAL include 512KB Flash, 32KB RAM, 4KB EEPROM, an integrated TFT/DLCD display driver, an XGATE peripheral coprocessor for interrupt-driven data movement, multiple CAN 2.0 modules, an SCI, SPI, IIC, and an Enhanced Capture Timer. The 112-pin LQFP package supports 85 I/O lines and an industrial -40C to +85C operating range, making the device suitable for under-the-hood adjacent and cabin-mounted instrument clusters.

The HCS12X core preserves the proven S12 instruction set while adding an XGATE coprocessor that handles time-critical peripheral events in parallel with the CPU, reducing CPU interrupt load. The on-chip TFT driver supports up to VGA-class color displays, eliminating external display-controller ASICs and reducing both BOM cost and PCB complexity for cluster designs.

Typical applications are automotive instrument clusters, mid-range color TFT dashboards, body control modules, and industrial HMI panels with graphic displays. The combination of display integration, dual CAN, and 512KB Flash supports full-color cluster graphics with multiple gauge animations, telltale indicators, and turn-by-turn navigation rendering.

When designing with this part, ensure the supply voltage is within the rated 2.5V/5V dual-rail range and that the TFT display timing parameters are configured for the chosen panel. The XGATE coprocessor firmware must be loaded into RAM and chained to the relevant interrupt sources for deterministic display refresh.

This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in a single factory datasheet, helping engineers evaluate direct replacements and cluster-design trade-offs.

Alternativas directas para MC9S12XHZ512CAL — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con MC9S12XHZ512CAL (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Core Processor, Mounting Type, ADC Resolution.

NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Operating Temperature: -40C to +125C (junction)
Core Processor: HCS12X (16-bit, XGATE co-processor)
Comparar con MC9S12XHZ512CAL →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
Core Processor: HCS12X (16-bit CISC)
Comparar con MC9S12XHZ512CAL →
NXP Semiconductors
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Operating Temperature: -40C to +125C
ADC Resolution: 12-bit
Comparar con MC9S12XHZ512CAL →
NXP Semiconductors
Package: 112-pin LQFP (20 mm × 20 mm)
Mounting Type: Surface Mount (Gull-Wing leads)
Comparar con MC9S12XHZ512CAL →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

MC9S12XHZ384CAG

✅ Sustitución directa
📦 112-LQFP (20x20)
384 KB Flash vs 512 KB (-25%), same HCS12X core, same 112-LQFP package

📋 Alternativa de referencia (no en el catálogo)

MC9S12XHZ256CAG

✅ Sustitución directa
📦 112-LQFP (20x20)
256 KB Flash vs 512 KB (-50%), same HCS12X core, same 112-LQFP package

📋 Alternativa de referencia (no en el catálogo)

S912XET512BMAGR

✅ Sustitución directa
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ En stock

$6.6 / unidad

Ver hoja de datos →

MC9S12XEQ384CAG

✅ Sustitución directa
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ En stock

Consulte el precio

Ver hoja de datos →

MC9S12DT512MPVE

✅ Sustitución directa
📦 112-LQFP (20x20)
S12XD body-control family, 512 KB Flash, same 112-LQFP footprint; no TFT display driver

📋 Alternativa de referencia (no en el catálogo)

MC9S12XHZ512CAL Valores máximos y características eléctricas

Core Processor HCS12X
Core Size 16-bit
Speed 80 MHz
Program Memory Size 512 KB (512K x 8) Flash
Number of I/O 85
Tensión de alimentación 2.5 V / 5 V (dual-range)
Temperatura de funcionamiento -40C to +85C
Encapsulado 112-LQFP (20 x 20 mm)
Tipo de montaje Surface Mount
Connectivity CAN, I2C, SCI, SPI
Peripherals TFT/DLCD driver, XGATE coprocessor, ECT, PWM
Program Memory Type FLASH
Series MC9S12
Nivel de sensibilidad a la humedad (MSL) 3 (per JEDEC J-STD-020)

Guía de configuración de pines de MC9S12XHZ512CAL 112-lqfp (20 x 20 mm)

Configuración de pines para MC9S12XHZ512CAL (encapsulado 112-lqfp (20 x 20 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 112-lqfp (20 x 20 mm) para MC9S12XHZ512CAL

No hay datos detallados de patillaje disponibles para MC9S12XHZ512CAL.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

MC9S12XHZ512CAL es adecuado para 6 aplicacións: Automotive Instrument Cluster with Color TFT, Mid-Range Analog Gauge Cluster with LCD, Body Control Module with CAN Gateway, Industrial HMI Panel with Color Display, Automotive Aftermarket Telematics, Off-Highway Vehicle Dashboard.

🚗

Automotive Instrument Cluster with Color TFT

The MC9S12XHZ512CAL is purpose-built for mid-range color TFT instrument clusters with its on-chip TFT/DLCD display driver and 512 KB Flash. Its 80 MHz HCS12X core plus XGATE coprocessor handle gauge animations, telltale indicators, and turn-by-turn navigation rendering while keeping CPU interrupt load manageable. Dual CAN channels connect to vehicle body and powertrain buses, and 85 I/O lines support backlight drivers, rotary encoders, and HMI buttons. Placed as the primary MCU on the cluster PCB, it eliminates an external display controller ASIC and shrinks BOM cost.

📺

Mid-Range Analog Gauge Cluster with LCD

For lower-cost analog-style clusters combining needle gauges with a small LCD message centre, the MC9S12XHZ512CAL delivers the right balance of integration and headroom. Its on-chip display controller drives the small LCD directly, the SCI link to gauge stepper motors is built-in, and the 512 KB Flash accommodates full calibration tables and cluster software with margin. The XGATE coprocessor keeps gauge sweep smooth even when the CPU is busy with CAN message decoding and indicator logic.

🏭

Body Control Module with CAN Gateway

The MC9S12XHZ512CAL fits mid-range body control modules that must bridge two CAN buses while handling local I/O expansion. Its dual CAN controllers, 85 GPIO, and 512 KB Flash support gateway tables, lighting control, and software upgrades over CAN or LIN. The -40C to +85C industrial temperature range covers under-dash and cabin environments; the 80 MHz HCS12X core provides margin for complex BCM state machines.

🧩

Industrial HMI Panel with Color Display

For industrial human-machine interface panels needing a color TFT readout without a dedicated graphics ASIC, the MC9S12XHZ512CAL provides a drop-in platform. Its integrated TFT controller, PWM channels, and ADC inputs support touchscreen-less control panels with rotary inputs, status LEDs, and a 4- to 7-inch color display. Flash headroom allows full graphical menu trees and multi-language string tables, while the 80 MHz core sustains smooth menu transitions.

📱

Automotive Aftermarket Telematics

Aftermarket telematics units that tap into vehicle CAN buses for fleet tracking, driver behaviour scoring, and remote diagnostics benefit from the MC9S12XHZ512CAL's dual CAN controllers and ample Flash. With 512 KB available, the device can host both OBD-II stack firmware and a custom protocol translation layer plus store diagnostic trouble codes (DTC) for offline retrieval. The HCS12X 16-bit core is well-suited to deterministic bus handling.

🏭

Off-Highway Vehicle Dashboard

Construction, agriculture, and material-handling equipment use dashboard modules that must survive harsh environments while presenting complex gauges and warning indicators to operators. The MC9S12XHZ512CAL's industrial temperature grade, dual CAN, and on-chip TFT controller are well-matched to off-highway dashboards that integrate engine data, hydraulic pressures, and position sensors. The 512 KB Flash accommodates full calibration for multiple vehicle variants.

What is the operating voltage of MC9S12XHZ512CAL?
The MC9S12XHZ512CAL operates from a dual-range 2.5V/5V supply, with 5V for I/O and analog portions and 2.5V for the internal core. According to the NXP MC9S12XHZ512 datasheet, both rails must remain within their respective tolerances during operation, including cold-crank and load-dump transients typical of automotive 12V battery systems.
What is the Flash memory size of MC9S12XHZ512CAL?
The MC9S12XHZ512CAL integrates 512 KB of on-chip Flash memory organised as 512K x 8 bits. According to NXP product information, this is the largest Flash density in the S12XHZ cluster family, allowing full-color TFT cluster graphics, navigation rendering, and bootloader storage in a single device.
Does MC9S12XHZ512CAL have an integrated TFT display driver?
Yes, the MC9S12XHZ512CAL integrates an on-chip TFT/DLCD display controller that supports up to six analog gauges, dot-matrix displays, LCDs, and high-resolution color TFT panels. According to NXP, this eliminates the need for an external display-controller ASIC and simplifies mid-range automotive cluster designs.
Where can I buy MC9S12XHZ512CAL and what is the price?
The MC9S12XHZ512CAL is available from authorized distributors including DigiKey, Mouser, and Win Source, with stocks typically shipping same-day at the qty-1 level. The price is approximately $21.50 per unit at qty-1, dropping to around $13.20 at qty-1000, as of 2026-10-19. Note: NXP product pages mark this part as approaching end of life.
What is the lead time for MC9S12XHZ512CAL?
Lead time for the MC9S12XHZ512CAL is currently stock-dependent; DigiKey and Mouser list it as ships-today when inventory exists. Because NXP product information marks the part as End of Life / approaching obsolescence, buyers should confirm long-term supply with NXP or use authorised buffer-stock partners before committing to a new design.
Is MC9S12XHZ512CAL in stock at distributors?
Yes, the MC9S12XHZ512CAL is currently listed at DigiKey, Mouser, and Win Source with confirmed stock as of 2026-10-19. Stock levels fluctuate because NXP marks this part as Not For New Designs, so distributors will only replenish through existing OEM/aftermarket channels rather than new production runs.
What is the difference between MC9S12XHZ512CAL and MC9S12XHZ384?
The MC9S12XHZ512CAL has 512 KB of Flash compared to 384 KB on the MC9S12XHZ384, while sharing the same HCS12X 80 MHz core and 112-pin LQFP package. According to NXP datasheet document history, the lower-memory XHZ384 variant was added in revision 01.03 to give designers a cost-optimised option for simpler clusters.
What is the difference between MC9S12XHZ512CAL and MC9S12XDT512MAA?
The MC9S12XHZ512CAL is in the XHZ cluster family with on-chip TFT/DLCD display driver, whereas the MC9S12XDT512MAA is in the XDT body-control family without the display controller. Both share 512 KB Flash and an 80 MHz HCS12X core, but the XDT uses a 80-pin QFP package versus 112-pin LQFP for the XHZ.
What is the best drop-in replacement for MC9S12XHZ512CAL?
The closest same-footprint drop-in replacement is the S912XET512BMAGR, which shares the HCS12X core and a 112-pin LQFP option while offering 512 KB Flash. Among cross-brand options, no single drop-in part exists because the on-chip TFT driver is proprietary to NXP, but the S12XHZ family offers 256/384 KB variants as direct cluster-design substitutes.
Can STM32H563ZIT6 replace MC9S12XHZ512CAL in an instrument cluster?
No, the STM32H563ZIT6 cannot drop into an MC9S12XHZ512CAL footprint because it uses a 144-pin LQFP rather than the 112-pin LQFP of the XHZ, and its Cortex-M33 core is not binary-compatible with HCS12X code. A redesign is required, though STM32 + external TFT controller can perform the same cluster workload at lower cost.
When should I choose MC9S12XHZ512CAL over a 32-bit MCU?
Choose MC9S12XHZ512CAL when you need the proven HCS12X toolchain, on-chip TFT driver, and dual-CAN connectivity in a single 16-bit part for mid-range instrument clusters. Move to a 32-bit Cortex-M device only when workloads require Ethernet, larger RAM, or higher graphics throughput than the XGATE coprocessor can sustain.
Where can I download the MC9S12XHZ512CAL datasheet PDF?
The official MC9S12XHZ512 datasheet PDF is hosted on the NXP website at the URL shown in this product page datasheet link. The document carries revision 1.06, published 14 October 2010, and contains the full S12XHZ family spec covering XHZ256, XHZ384, and XHZ512 variants. Mirror copies are also available on alldatasheet.com and findic.us.
Where can I find the MC9S12XHZ512CAL pinout?
The MC9S12XHZ512CAL pinout is defined in the official datasheet section covering the 112-pin LQFP package. The complete signal map includes TFT display data and clock lines, CAN, SCI, SPI, IIC, timer I/O, ADC inputs, and 85 GPIO ports; pin 1 is identified by the standard LQFP top-left marker dot.
What is the operating temperature range of MC9S12XHZ512CAL?
The MC9S12XHZ512CAL operates from -40C to +85C, designated as the industrial-grade temperature range. According to NXP ordering information, parts with the CAL suffix carry this industrial temperature grade, while CAL suffix variants typically support automotive dashboard applications under SAE thermal environments.
What communications interfaces does MC9S12XHZ512CAL support?
The MC9S12XHZ512CAL supports multiple CAN 2.0 modules, an SCI (UART), an SPI, and an IIC peripheral set. According to NXP documentation, the S12XHZ family was designed with at least two CAN channels to connect simultaneously to the vehicle CAN body bus and the powertrain CAN bus in instrument-cluster applications.
Does MC9S12XHZ512CAL use the HCS12X core with XGATE coprocessor?
Yes, the MC9S12XHZ512CAL combines the main HCS12X CPU with an XGATE peripheral coprocessor that executes RISC-like instructions on a separate data path. According to NXP, the XGATE handles interrupt-driven peripheral servicing in parallel with the CPU, freeing the CPU to focus on graphics and application logic in cluster workloads.

Datos de referencia de ingeniería para MC9S12XHZ512CAL — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MC9S12XHZ512CAL for mid-range color TFT instrument clusters where you want to eliminate an external display-controller ASIC and stay within the proven HCS12X 16-bit toolchain. Pick the MC9S12XHZ384CAG or MC9S12XHZ256CAG if you can take a 25% or 50% Flash reduction in exchange for a lower unit cost on simpler cluster designs. Move to the S912XET512BMAGR if your design does not need the on-chip TFT driver and prefers the S12XE family for newer software maintenance, though you must add an external display controller. For body-control modules without a TFT display, the MC9S12DT512MPVE offers the same 512 KB Flash at a lower price. All listed alternatives share the 112-pin LQFP footprint; the XHZ family is the only option that integrates the TFT controller.

Comparación con alternativas

Parámetro Este producto MC9S12XHZ384CAG MC9S12XHZ256CAG S912XET512BMAGR MC9S12XEQ384CAG
Package 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP (20x20) 112-LQFP 112-LQFP (20x20)
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS12X 16-bit HCS12X 16-bit HCS12X 16-bit S12XE 16-bit HCS12XE 16-bit
Flash Size 512 KB 384 KB 256 KB 512 KB 384 KB
On-Chip TFT Driver Yes Yes Yes No No
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Lifecycle Status NRND NRND NRND Active NRND

Diferenciadores clave

  • Integrated on-chip TFT/DLCD display driver (frente a MC9S12DT512MPVE)
  • XGATE peripheral coprocessor (frente a MC9S12A512CPVE)
  • Largest Flash in S12XHZ family (frente a MC9S12XHZ384CAG)

Notas de diseño

The MC9S12XHZ512CAL requires a clean 5V supply for I/O and analog domains plus a 2.5V core regulator. Estimated: with VIN=5V, VDD_DR=5V, VDD=2.5V internal LDO, and I_total=100 mA full load, the on-die dissipation is roughly 0.5 W. Use a 100 nF decoupling cap within 5 mm of each power pin and a 10 uF bulk cap on each supply rail.

Route the TFT data and clock traces as matched-length pairs to within 100 mils of target impedance 50 ohms to preserve display timing margin. Place the external TFT reference-voltage bypass capacitors within 3 mm of the REGC and VDDX pins. Keep the CAN bus traces away from the TFT clock lines to avoid radiated emissions compliance failures.

Do not use the XGATE channel 7 vector without first initialising the XGATE RAM region; firmware that calls XGATE from interrupt context without setting up R0-R7 corrupts cluster state. Always initialise the PLL using the documented CLKSEL and PLLCTL sequences before raising the bus frequency above 4 MHz to avoid lockup.

Información de cumplimiento

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Compliant

RoHS and lead-free compliance per NXP product information. AEC-Q100 not explicitly listed for this industrial-grade part; AEC-Q100-grade cluster MCUs are listed under separate suffix designations. Halogen-free status not confirmed.

Datos verificados el: 2026-10-19 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

NXP Semiconductors MC9S12XHZ512CAL MC9S12XHZ384CAG MC9S12XHZ256CAG S912XET512BMAGR MC9S12XEQ384CAG MC9S12DT512MPVE HCS12X core HCS12 XGATE coprocessor 16-bit microcontroller automotive MCU instrument cluster TFT display driver CAN 2.0 SCI SPI IIC LQFP-112 surface mount package RoHS compliant industrial temperature grade Freescale Semiconductor Flash memory EEPROM RAM DLCD controller
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