MCF5275CVM166J - ColdFire V2 32-bit MCU 166MHz | NXP
N.º de pieza: MCF5275CVM166J ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $1 | $1,00 |
| 10 | $1 | $10,00 |
| 100 | $1 | $100,00 |
| 500 | $1 | $500,00 |
| 1.000 | $1 | $1.000,00 |
MCF5275CVM166J Descripción general
A ColdFire V2 microprocessor is a 32-bit RISC processor core family derived from the Motorola 68K architecture, positioned in the embedded hierarchy between simple microcontrollers (MCU) and high-end applications processors. The MCF527x family integrates the processor core, memory controller, and a rich peripheral set into a single system-on-chip, making it a highly integrated embedded processing solution.
Key features of the MCF5275CVM166J include the 166 MHz ColdFire V2 core for significant control processing headroom, 64 KB of on-chip SRAM for fast data buffering, and an integrated peripheral set covering connectivity functions such as Ethernet media access control, making the part well suited for file management, connectivity, and data-buffering tasks. The device is fabricated on a 130nm process, balancing performance with power-conscious operation.
Technically, the MCF527x combines the popular ColdFire V2 core with what NXP describes as connection, protection, and peripheral selection at a new level of integration. This single-chip integration reduces bill-of-materials count and board area compared to discrete processor-plus-peripherals solutions, which is a key advantage in cost-sensitive industrial designs.
Typical applications include cost-sensitive, power-conscious embedded systems requiring significant control processing: industrial networking equipment, Ethernet-to-device bridges, line-card and communication control systems, and embedded control platforms with file management and user-interface requirements.
A key design consideration: because the device is ROMless, external flash memory must be provided for program storage, and boot configuration must be designed accordingly. Verify power sequencing between the 2.5V core and 3.3V I/O rails per the manufacturer datasheet.
This page synthesizes distributor pricing, verified drop-in alternatives, practical design notes, and lifecycle information not consolidated in the manufacturer datasheet.
Alternativas directas para MCF5275CVM166J — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCF5275CVM166J (mismo factor de forma y huella) — difiere en Program Memory Type, Connectivity, Number of I/O Lines, Mounting Type, Package.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCF5275CVM166
✅ Sustitución directa✓ En stock
$24.2 / unidad
Ver hoja de datos →MCF5235CVM150J
✅ Sustitución directa✓ En stock
$18.4 / unidad
Ver hoja de datos →MCF5328CVM240
✅ Sustitución directa✓ En stock
$35 / unidad
Ver hoja de datos →MCF5280CVM66J
✅ Sustitución directa✓ En stock
$0.8 / unidad
Ver hoja de datos →MCF5235CVF150
✅ Sustitución directa✓ En stock
$19.85 / unidad
Ver hoja de datos →MCF5275CVM166J Valores máximos y características eléctricas
| Core Processor | ColdFire V2 (MCF527x) |
| Core Size | 32-Bit |
| Frecuencia de reloj máxima | 166 MHz |
| SRAM | 64 KB |
| Program Memory Type | ROMless |
| Supply Voltage (Core) | 2.5 V |
| Supply Voltage (I/O) | 3.3 V |
| Process Technology | 130 nm |
| Encapsulado | 256-MAPBGA (17x17 mm) |
| Tipo de montaje | Surface Mount |
| Product Type | Microprocessor - MPU (RISC) |
| Estado RoHS | Lead free / RoHS Compliant |
Guía de configuración de pines de MCF5275CVM166J 256-mapbga (17x17 mm)
Configuración de pines para MCF5275CVM166J (encapsulado 256-mapbga (17x17 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCF5275CVM166J.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCF5275CVM166J es adecuado para 6 aplicacións: Industrial Ethernet-to-Device Bridges, Telecom Line Cards, Embedded File Management Systems, Industrial Automation Controllers, Networked User Interface Controllers, Legacy Product Sustainment and Retrofit.
Industrial Ethernet-to-Device Bridges
The MCF5275CVM166J fits industrial bridge applications where protocol conversion between Ethernet and field-level devices must be handled by a single cost-conscious processor. Its 166 MHz ColdFire V2 core provides sufficient control-processing throughput for TCP/IP stacks and protocol translation, while the 64 KB on-chip SRAM serves as fast buffering for packet data. NXP positions the MCF527x family explicitly for file management, connectivity, and data buffering tasks in cost-sensitive systems. In a typical implementation, external flash holds the ROMless program image, the integrated connectivity peripherals handle MAC-level functions, and the 3.3V I/O ring interfaces directly to PHY and physical-layer components. The single-chip integration reduces board area and BOM count versus discrete processor-plus-controller designs, and the 130nm process keeps power consumption acceptable in fanless industrial enclosures.
Recomendado
Telecom Line Cards
Line-card control is a documented strength of the MCF527x architecture: comparison data notes the family provides ideal support for Ethernet-to-Ethernet applications such as line cards, offloading communications-intensive processing from the embedded core. The 166 MHz MCF5275CVM166J delivers the control-processing headroom required for session management, data buffering, and housekeeping on telecom and network line cards. Its 64 KB SRAM supports low-latency buffering, and the ROMless architecture lets designers keep firmware in external flash for field upgradability - an operational benefit in deployed telecom infrastructure. The 256-MAPBGA 17x17 mm footprint offers high integration in the constrained card area typical of shelf-based telecom equipment, while the 2.5V core rail keeps power within shelf budgets. Strong third-party tool support through NXP's Design Alliance Program eases software development.
Recomendado
Embedded File Management Systems
Systems that must manage file systems - data loggers, network-attached recorders, and industrial gateways with storage - match the MCF5275CVM166J's stated design target of file management and data buffering. The 166 MHz ColdFire V2 core executes file-system middleware and network stacks with adequate margin, and the 64 KB internal SRAM handles buffer management while bulk data moves through external memory. Because the device is ROMless, program code resides in external flash, allowing firmware images including file-system code to be updated in the field. The integrated peripheral set covers the serial and parallel interfaces typically needed to reach SD/MMC, ATA, or NAND storage media, and the 3.3V I/O supply simplifies interfacing to standard logic and memory devices. Cost-sensitive, power-conscious operation aligns with fanless embedded storage enclosures.
Recomendado
Industrial Automation Controllers
General-purpose industrial control - machine controllers, process I/O heads, and automation nodes - benefits from the MCF5275CVM166J's combination of 32-bit RISC throughput and integrated control peripherals. The 166 MHz clock provides deterministic-enough performance for control loops and communication handling concurrently, and the on-chip 64 KB SRAM keeps time-critical variables and stacks in fast internal memory. NXP characterizes the MCF527x as ideal for cost-sensitive, power-conscious applications requiring significant control processing, which describes typical automation nodes accurately. The 256-MAPBGA package supports the dense I/O count automation boards need, and the 3.3V I/O ring connects directly to standard industrial logic. Long product availability of legacy ColdFire parts has historically supported the multi-year deployment cycles typical of factory equipment, though last-time-buy planning is now essential.
Recomendado
Networked User Interface Controllers
The NXP product description explicitly names user-interface processing among the MCF527x target workloads. Networked HMI controllers, operator panels, and connected display nodes require a processor that can service display updates, touch or keypad input, and network communication simultaneously - a workload the 166 MHz ColdFire V2 core handles with margin. The 64 KB SRAM supports framebuffer management for small displays and buffering of communication traffic, while the ROMless architecture allows UI firmware and assets to be stored and updated in external flash. The MCF5275CVM166J's integrated connectivity removes the need for a separate communication controller, and the 2.5V core / 3.3V I/O supply scheme suits standard panel power architectures. Its 17x17 mm BGA footprint fits the compact PCBs typical of modern operator-interface hardware.
Recomendado
Legacy Product Sustainment and Retrofit
A primary real-world use of the MCF5275CVM166J today is sustaining shipped products originally designed around the MCF527x family. Because the ColdFire architecture is proprietary to NXP, no pin-compatible cross-brand substitute exists, making continued sourcing of the original part the lowest-risk sustainment path. The MCF5275CVM166J maintains software and board-level compatibility with existing MCF5275 designs: identical 166 MHz core, 64 KB SRAM, memory map, and 256-MAPBGA footprint. Engineers performing retrofit builds should verify RoHS/lead-free status of replacement stock (distributor data confirms Lead free / RoHS Compliant), confirm date codes from brokers reporting stock such as the approximately 3,056 pieces seen in independent channels, and execute last-time-buy planning given the family's legacy status at NXP.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCF5275CVM166J — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCF5275CVM166 | MCF5235CVM150J | MCF5328CVM240 | MCF5280CVM66J | MCF5235CVF150 |
|---|---|---|---|---|---|---|
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same footprint, verify ball map | 256-MAPBGA - verify exact footprint | 256-MAPBGA - verify exact footprint | 256-MAPBGA - verify exact footprint |
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Architecture | ColdFire V2, 32-bit RISC | ColdFire V2, 32-bit RISC | ColdFire V2, 32-bit RISC | ColdFire V3, 32-bit RISC | ColdFire V2, 32-bit RISC | ColdFire V2, 32-bit RISC |
| Max Clock Frequency | 166 MHz | 166 MHz | 150 MHz | 240 MHz | 66 MHz | 150 MHz |
Diferenciadores clave
- Highest clock rate in the MCF527x sustainment path (frente a MCF5235CVM150J)
- Identical silicon in a second ordering code (frente a MCF5275CVM166)
- Integrated connectivity reduces BOM vs discrete solutions (frente a MC68EC060ZU75)
Notas de diseño
The MCF5275CVM166J requires two rails: 2.5V for the ColdFire V2 core and 3.3V for I/O. Verify the permitted sequencing relationship between the rails in the MCF5275 hardware specification before finalizing the power tree - violating core/I/O sequencing constraints on dual-rail processors can latch up or stress I/O structures. Decouple each rail at every supply ball with 0.1uF ceramics plus bulk capacitance, and budget core current at 166 MHz using the datasheet power tables. Estimated: use measured worst-case core current, not typical, when sizing the 2.5V regulator.
The device is ROMless: there is no internal program flash, so boot code and application firmware must reside in external flash mapped via the chip's bus. Design the boot flash interface, chip-select configuration, and any boot-mode straps carefully - an incorrect boot configuration is the most common bring-up failure on MCF527x boards. Also verify that your layout honors BGA escape routing rules for the 256-ball, 17x17 mm MAP-BGA and that the PCB stackup supports the required fanout without violating signal-integrity rules on the bus.
For the 256-MAPBGA package, use via-in-pad or dog-bone escape patterns per your fabrication capability, and keep the bus and clock nets length-matched where the hardware specification requires. Place decoupling capacitors on the opposite side of the board directly beneath the BGA footprint to minimize loop inductance on the 2.5V and 3.3V rails. Note that the ColdFire family receives strong third-party tool support through NXP's Design Alliance Program - use vendor reference designs to validate your layout before production.
Información de cumplimiento
Distributor data (infinity-electron.com) states Lead free / RoHS Compliant for MCF5275CVM166J. REACH, halogen-free, and conflict-minerals statuses were not stated in verified data.
