MCIMX258CVM4 - i.MX25 ARM926 400MHz MPU, 400-LFBGA | NXP Semiconductors
N.º de pieza: MCIMX258CVM4 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $26.1 | $261,00 |
| 100 | $22.45 | $2.245,00 |
| 500 | $19.8 | $9.900,00 |
| 1.000 | $17.95 | $17.950,00 |
MCIMX258CVM4 Descripción general
What is an applications processor? An applications processor (AP) is a high-integration system-on-chip (SoC) class MPU that combines one or more CPU cores with peripheral controllers, memory interfaces, and dedicated hardware accelerators (e.g., LCD, Ethernet, USB, security engine). i.MX25 belongs to NXP's i.MX family, itself part of the broader ARM9 / ARM926EJ-S microprocessor taxonomy, which sits within microprocessors (MPU) and above generic microcontrollers (MCU) in the embedded-processing hierarchy.
Key features of the MCIMX258CVM4 include an ARM926EJ-S core with 16 KB / 16 KB instruction/data caches and a vector floating-point unit option, hardware security acceleration (Secure Boot, OTP, HAB), on-chip 10/100 Ethernet MAC, USB 2.0 High-Speed OTG with PHY, CAN, three UARTs, I2C, I2S/AC97 audio, and an integrated LCD controller supporting up to XGA resolutions. Industrial-grade temperature operation (-40C to +85C) makes it suitable for harsh environments.
Architecturally, the i.MX25 combines a single-issue ARM926EJ-S pipeline with a multi-channel DMA engine, a Smart Direct Memory Access (SDMA) controller, and a hardware encryption/hash accelerator (CAAM-style). The on-chip voltage regulators and PMC reduce external BOM, while flexible boot sources (NOR, NAND, SD/MMC, OneNAND, SPI) simplify board layout and supply-chain diversity.
Typical applications include industrial human-machine interfaces (HMIs), barcode scanners, portable data terminals, building-automation control panels, and networked measurement equipment. The combination of CAN, Ethernet, and USB simplifies connectivity for factory-automation and field-instrumentation designs.
When designing with this part, attention must be paid to power-rail sequencing for core vs I/O supplies, the routing of high-speed DDR signals, and decoupling near each of the four supply domains. The 400-ball LFBGA demands a multi-layer PCB with controlled impedance for memory traces to achieve 133 MHz DDR operation reliably.
This page synthesizes distributor pricing and stock data, drop-in same-package i.MX25 alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Alternativas directas para MCIMX258CVM4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCIMX258CVM4 (mismo factor de forma y huella) — difiere en Core Architecture, Package, Program Memory Type, USB, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCIMX257CJM4A
✅ Sustitución directa✓ En stock
$15.95 / unidad
Ver hoja de datos →MCIMX253CJM4A
✅ Sustitución directa✓ En stock
$22.8 / unidad
Ver hoja de datos →MCIMX255AVM4
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$17.4 / unidad
Ver hoja de datos →MCIMX355AVM4B
✅ Sustitución directa✓ En stock
$25.1 / unidad
Ver hoja de datos →MCIMX283DVM4B
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCIMX6S1AVM08AC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX258CVM4 Valores máximos y características eléctricas
| Core Architecture | ARM926EJ-S (32-bit RISC) |
| Core Count | 1 |
| Maximum CPU Clock | 400 MHz |
| On-Chip RAM | 144 KB (128 KB + 16 KB ROM-style) |
| Program Memory Type | External (NOR/NAND/SDRAM) |
| L1 Cache | 16 KB I-cache / 16 KB D-cache |
| Number of I/O Lines | 128 |
| Encapsulado | 400-LFBGA (MAPBGA, 17x17 mm) |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| Ethernet | 10/100 MAC integrated |
| USB | USB 2.0 High-Speed OTG with integrated PHY |
| CAN | 1x CAN 2.0B |
| LCD Controller | Yes (up to XGA) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Silicon Version | 1.2 (per datasheet title) |
Guía de configuración de pines de MCIMX258CVM4 400-lfbga (mapbga, 17x17 mm)
Configuración de pines para MCIMX258CVM4 (encapsulado 400-lfbga (mapbga, 17x17 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX258CVM4.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX258CVM4 es adecuado para 6 aplicacións: Industrial Human-Machine Interface (HMI), Portable Barcode Scanner / Data Terminal, Industrial Barcode Printer Controller, Building Automation Gateways, Networked Measurement Equipment, Secure Industrial IoT Edge Node.
Industrial Human-Machine Interface (HMI)
The MCIMX258CVM4's integrated LCD controller (up to XGA), 10/100 Ethernet, USB OTG, and 400 MHz ARM926EJ-S core make it a strong fit for industrial HMIs where it drives TFT panels directly and runs a Linux or WinCE UI stack. Its industrial temperature grade (-40C to +85C) ensures reliable operation near motors and control cabinets where ambient temperatures fluctuate widely. Compared to an MCU, the MPU class allows complex Qt/Embedded or Chromium-based UIs with multi-language and web-interaction support.
Recomendado
Portable Barcode Scanner / Data Terminal
With its low-power design, integrated USB OTG, multiple UARTs, and 400 MHz headroom for image-decoding algorithms, the MCIMX258CVM4 suits handheld barcode scanners and data terminals. Its ARM926EJ-S core executes JPEG/QR decoding stacks while the LCD controller drives the local display, and the high-speed USB accelerates tethered or cradle-based synchronization. The industrial temperature range supports warehouse and outdoor logistics environments where devices see temperature swings.
Recomendado
Industrial Barcode Printer Controller
Industrial barcode printers need real-time motion control, Ethernet, USB host, and an LCD UI. The MCIMX258CVM4 combines a 400 MHz ARM926EJ-S with USB host + device, 10/100 Ethernet, LCD, and multiple UARTs/GPIOs in one chip, eliminating external bridge devices. The integrated CAN bus and DMA engine allow synchronized control of stepper motors, heaters, and print heads, while Linux BSP support simplifies development of CUPS-style print pipelines.
Recomendado
Building Automation Gateways
Building-automation gateways demand secure, fanless operation with Ethernet, RS-485/CAN, and analog I/O. The MCIMX258CVM4's hardware encryption (HAB/Secure Boot) protects against unauthorized firmware flashing, while the 10/100 MAC and USB host simplify BACnet/Modbus edge routers and BACnet/IP gateways. The industrial temperature rating allows mounting in unconditioned equipment rooms.
Recomendado
Networked Measurement Equipment
Field-measurement instruments benefit from the MCIMX258CVM4's precision timers, integrated Ethernet/USB, and 128 KB on-chip SRAM for protocol stacks. Designers can implement custom analog front ends off-chip and use the MPU for trend logging, display, and remote monitoring via Modbus/TCP or HTTP. Industrial-grade operation and industrial reliability suit outdoor or factory installations.
Recomendado
Secure Industrial IoT Edge Node
Edge-IoT nodes demand protocol conversion, local processing, and hardware-rooted security. The MCIMX258CVM4's hardware encryption engine, secure boot, OTP keys, and 10/100 Ethernet make it ideal for OPC-UA gateways, MQTT brokers, and protocol-translation bridges in industrial-IoT deployments. The ARM926EJ-S with MMU runs a full Linux stack suitable for containerized workloads at the edge.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX258CVM4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX257CJM4A | MCIMX253CJM4A | MCIMX355AVM4B | MCIMX283DVM4B | MCIMX6S1AVM08AC |
|---|---|---|---|---|---|---|
| Package | 400-LFBGA (17x17 mm) | 400-LFBGA (MAPBGA) | 400-LFBGA (MAPBGA) | 400-LFBGA (MAPBGA) | 400-LFBGA (MAPBGA) | 400-LFBGA (MAPBGA) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit | ARM926EJ-S 32-bit | ARM1136JF-S 32-bit | ARM926EJ-S 32-bit | ARM Cortex-A9 32-bit |
| Maximum CPU Clock | 400 MHz | 400 MHz | 400 MHz | 532 MHz | 454 MHz | 800 MHz |
| Operating Temperature | -40C to +85C (Industrial) | -20C to +70C (Commercial) | -20C to +70C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| On-chip RAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| USB | USB 2.0 HS OTG + Host | USB 2.0 HS OTG + Host | USB 2.0 FS OTG | USB 2.0 HS OTG + Host | USB 2.0 HS Host | USB 2.0 HS OTG |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100/1000 integrated |
| Lifecycle Family | i.MX25 (mature, supported) | i.MX25 (mature, supported) | i.MX25 (mature, supported) | i.MX35 (mature, supported) | i.MX28 (mature, supported) | i.MX6 (mature, NRND in some SKUs) |
Diferenciadores clave
- Industrial temperature grade in same i.MX25 family (frente a MCIMX257CJM4A)
- Higher peripheral integration than MCIMX253 (frente a MCIMX253CJM4A)
- Lower BOM cost and lower power than i.MX35 (frente a MCIMX355AVM4B)
Notas de diseño
The MCIMX258CVM4 has multiple supply domains (core, periphery, DDR, analog/pll). Each rail requires its own decoupling capacitor cluster (typically 100 nF + 10 uF bulk) within 5 mm of the supply balls. Power-on sequence must follow the NXP i.MX25 reference manual to avoid latch-up; the integrated PMC simplifies sequencing but external rails should be released after the internal core comes up. Estimated: typical active current is below 250 mA on the core rail at 400 MHz, and design should budget at least 500 mA on the 1.45 V core supply.
The 400-ball MAPBGA at 0.8 mm pitch demands a multi-layer PCB (6 or more layers preferred). Maintain a solid reference ground plane under BGA escape, microvia-in-pad or dog-bone fan-out, and length-match DDR data/address/control traces within the tolerances given in the i.MX25 hardware design guide. Signal-integrity simulation using the NXP IBIS model is recommended for DDR2/LPDDR at 133 MHz. The thermal pad array on the package's underside should be thermal-via-stitched to inner ground planes for heat dissipation.
Boot-mode configuration must be correct: the bootstrap pins (BOOT[3:0]) are sampled on reset and select NOR/NAND/SD/OneNAND. Mismatched settings can leave the part seemingly dead. Watchdog timer should be enabled in production firmware to recover from transient software hangs. JTAG pins should be tied correctly for in-system programming; floating TDI/TMS can confuse boundary-scan toolchains. The HAB/Secure-Boot keys must be provisioned per application note before locking OTP bits.
DDR2/LPDDR interfaces require careful length matching between the MPU and DRAM. Estimated: target under 100 ps skew across the byte lane, and use ground-bounded routes to maintain 50 ohms single-ended impedance. Add source termination if multi-DIMM support is required. For Ethernet, route the differential pairs with 90-ohm differential impedance and keep the PHY output traces short. USB DP/DM should be 90-ohm differential and routing kept under 50 mm to maintain signal integrity.
Información de cumplimiento
Industrial temperature variant (-40C to +85C). Not AEC-Q100 qualified (automotive grade); choose AEC-Q100 automotive variants (e.g., MCIMX258CVM4-Q in i.MX25 family) for automotive applications. RoHS/REACH compliance per NXP material declaration.
