MCIMX507CVK8B - i.MX50 ARM Cortex-A8 MPU 800MHz MAPBGA-416
N.º de pieza: MCIMX507CVK8B ⚠ Última compraMCIMX507CVK8B Descripción general
An applications processor (AP) is a system-on-chip (SoC) class integrated circuit that integrates a CPU core, graphics, memory controller, and peripheral interfaces onto a single die. Within the broader IC hierarchy, an AP sits under the hypernym chain: applications processor -> microprocessor (MPU) -> integrated circuit -> semiconductor. The i.MX50 family specifically bridges entry-level MPU designs and higher-end multimedia SoCs, making it a common choice for eReaders, industrial human-machine interfaces (HMIs), and low-cost embedded tablets.
Key features of the MCIMX507CVK8B include a single ARM Cortex-A8 core running up to 800 MHz, hardware NEON SIMD support, a multi-format hardware video decoder, integrated LCD controller, and a rich peripheral set including USB, Ethernet, and SD/MMC. The 416-MAPBGA package exposes a wide memory and I/O bus, and the device supports LPDDR/DDR2 external memory. NXP rates this part for the commercial temperature range, and the part has been flagged with an End-of-Life (EOL) notice on NXP's product page, with last-time-buy options dependent on specific PCN timelines.
Architecturally, the i.MX507 builds on the i.MX508 eReader-optimized SoC, sharing the same ARM Cortex-A8 core and many of the multimedia blocks, while trimming or disabling certain peripherals to lower cost. Compared with newer i.MX 6 series parts, the i.MX50 lacks the Cortex-A9/A53 cores and Vivante GC2000-class GPU; however, its mature software ecosystem (Linux, WinCE, Android 2.x-era BSPs) and lower BOM cost keep it attractive for legacy eReader and industrial designs.
Typical applications include dedicated eReaders and ePaper signage, industrial HMI panels, point-of-sale (POS) terminals, low-end portable media players, and consumer electronics with 7-10 inch WVGA displays. The integrated display pipeline and LVDS/RGB output make it well matched to ePaper and TFT-LCD panels in those form factors.
When designing with the MCIMX507CVK8B, pay close attention to power-rail sequencing (the i.MX50 requires a specific VCC/VPU/GPU ramp order) and thermal management - the 13x13 mm MAPBGA needs a properly designed PCB land pattern and thermal via array. Designers should also confirm BSP availability for their target OS, since this is a mature EOL part and NXP's long-term software support has shifted to newer i.MX families.
This page synthesizes distributor stock and pricing, drop-in i.MX50 alternatives, and practical design notes not aggregated in the manufacturer datasheet alone.
Alternativas directas para MCIMX507CVK8B — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCIMX507CVK8B (mismo factor de forma y huella) — difiere en Mounting Type, Package.
MCIMX508CVK8BR2
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Ver hoja de datos →MCIMX508CVM8BR2
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MCIMX507CVM8B
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MCIMX507CVK8B Valores máximos y características eléctricas
| Part Family | i.MX50 |
| Core Architecture | ARM Cortex-A8 |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum CPU Clock | 800 MHz |
| Encapsulado | 416-MAPBGA (13x13 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial |
| NEON SIMD Engine | Yes (hardware) |
| External Memory Support | DDR2 / LPDDR |
| Display Controller | Integrated LCD controller (RGB / LVDS) |
| Peripheral Interfaces | USB, Ethernet, SD/MMC, UART, SPI, I2C |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| Estado del ciclo de vida | End of Life / Last Time Buy (per NXP PCN) |
Guía de configuración de pines de MCIMX507CVK8B 416-mapbga (13x13 mm)
Configuración de pines para MCIMX507CVK8B (encapsulado 416-mapbga (13x13 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX507CVK8B.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX507CVK8B es adecuado para 6 aplicacións: Dedicated eReader and ePaper Signage, Industrial Human-Machine Interface (HMI) Panels, Point-of-Sale (POS) Terminals, Low-End Portable Media Players, Consumer Electronics with WVGA TFT-LCD Panels, Embedded Linux Industrial Controllers.
Dedicated eReader and ePaper Signage
The MCIMX507CVK8B targets cost-sensitive eReader and ePaper signage products with display sizes from 6 to 10 inches. The Cortex-A8 at 800 MHz drives panel refresh and user-interface logic, while the integrated LCD controller and SD/MMC interface connect directly to ePaper front ends. At typical eReader workloads (PDF page turn, UI navigation, sleep between page updates), the SoC stays well within its 1.5-2 W power envelope, enabling weeks of battery life. The MCIMX507 is the cost-trimmed alternative to the ePaper-optimized MCIMX508 when designers implement their own waveform lookup tables in software.
Recomendado
Industrial Human-Machine Interface (HMI) Panels
The MCIMX507CVK8B serves 7-10 inch WVGA industrial HMI panels where cost, long-term software stability, and ARM Cortex-A8 processing headroom outweigh the need for newer GPU acceleration. Its integrated LCD controller supports RGB and LVDS panel interfaces, while the Ethernet MAC enables connected factory-floor deployments. The part's commercial temperature grade suits indoor control cabinets; for harsher industrial temperatures, designers should evaluate i.MX 6ULL parts with extended temperature ratings. Linux BSP maturity and long-term kernel LTS support remain the strongest arguments for keeping i.MX50 in maintenance designs.
Recomendado
Point-of-Sale (POS) Terminals
Retail POS terminals benefit from the MCIMX507CVK8B's Cortex-A8 processing headroom for transaction handling, integrated LCD controller for the operator display, and built-in Ethernet and USB for peripherals (barcode scanners, receipt printers, cash drawers). The 416-MAPBGA package's compact 13x13 mm footprint simplifies the main board layout inside slim POS enclosures. Designers should pair the SoC with a TPM or secure element for PCI-PTS compliance, and leverage the hardware NEON engine for accelerating encryption workloads during card authorization.
Recomendado
Low-End Portable Media Players
The MCIMX507CVK8B's hardware multi-format video decoder (H.264, MPEG-4, VC-1) and integrated LCD controller suit 7-10 inch portable media players and entry-level tablets. The Cortex-A8 NEON engine accelerates audio codec processing, while LPDDR memory support keeps the power envelope low for battery-powered designs. Engineers can leverage existing Android 4.0-era or Linux BSPs to shorten time to market. For designs requiring 1080p playback or 3D graphics, migration to i.MX 6 or i.MX 8M Mini is recommended.
Recomendado
Consumer Electronics with WVGA TFT-LCD Panels
Smart-home control panels, digital photo frames, and entry-level learning devices all benefit from the MCIMX507CVK8B's integrated display pipeline at WVGA resolution. The hardware video decoder accelerates media playback on the integrated LCD controller, and the SD/MMC interface provides expandable storage for content libraries. With its mature Linux/Android BSP ecosystem, OEMs can reuse existing application code across product lines. The commercial temperature grade limits it to indoor consumer environments rather than outdoor or automotive use cases.
Recomendado
Embedded Linux Industrial Controllers
The MCIMX507CVK8B serves as a low-cost Linux-based controller in industrial automation, with its Cortex-A8 core handling soft-PLC logic, MQTT/Modbus gateway duties, and on-device visualization. The integrated Ethernet MAC supports real-time industrial protocols, while the GPIO and PWM peripherals connect to sensors, motor drivers, and actuators. Designers should validate against the EOL lifecycle status and plan firmware maintenance around the available last-time-buy stock, or migrate to i.MX 6ULL/8M Mini for new product generations.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX507CVK8B — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX508CVK8BR2 | MCIMX508CVM8BR2 | MCIMX507CVM8B |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 416-MAPBGA (13x13 mm) | 416-MAPBGA (13x13 mm) - same | 416-MAPBGA (13x13 mm) - same | 416-MAPBGA (13x13 mm) - same |
| CPU Core | ARM Cortex-A8 | ARM Cortex-A8 | ARM Cortex-A8 | ARM Cortex-A8 |
| Max Clock Speed | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| ePaper Display Controller | No (basic LCD controller) | Yes (enhanced) | Yes (enhanced) | No (basic LCD controller) |
| Lifecycle Status | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) | Last Time Buy (EOL) |
| External Memory | DDR2 / LPDDR | DDR2 / LPDDR | DDR2 / LPDDR | DDR2 / LPDDR |
Diferenciadores clave
- Cost-trimmed i.MX50 with no integrated ePaper controller (frente a MCIMX508CVK8BR2)
- Mature Linux/Android BSP ecosystem (frente a Newer i.MX 6ULL / i.MX 8M Mini parts)
- Hardware multi-format video decoder integrated (frente a Basic microcontrollers without video blocks)
Notas de diseño
The i.MX50 requires a specific power-rail sequencing order for VCC, VPU, and GPU supplies. Refer to the i.MX50 hardware development guide for the exact timing diagram. Failing to sequence rails correctly can prevent boot or cause long-term reliability degradation. Estimated: at 800 MHz with full peripheral activity, the SoC draws 1.5-2.5 W from the main VCC rail; budget 3 W worst-case for regulator sizing.
The 416-MAPBGA package requires a thermal via array directly under the die area to dissipate heat into the inner PCB copper planes. Reference the NXP i.MX50 hardware design guide land-pattern section for the recommended via pattern (typically 0.3 mm drill, 0.5 mm pitch grid). At 2.5 W dissipation in still air, junction temperature can exceed 100 C without proper thermal management - add a copper spreader or forced-air cooling for sealed enclosures.
DDR2/LPDDR routing on the i.MX50 is sensitive to trace-length matching - the byte lanes must be length-matched within ~25 mil, and the clock pair must be tuned to the average byte-lane length. Use the IBIS models from NXP to simulate signal integrity before tape-out. Keep the DDR reference voltage (VREF) decoupling within 100 mil of the memory device, and isolate analog and digital ground returns with a split or bridge under the SoC.
Do not assume i.MX50 family BSPs are interchangeable with newer i.MX 6 or i.MX 8 BSPs - the kernel configuration, boot ROM, and pin-muxing differ significantly. Verify the exact mask set (suffix letters after VK8B) before locking down the BSP version. Also note that the part is EOL: commit last-time-buy quantities early and design for forward migration to i.MX 6ULL/8M Mini for next-generation products.
Información de cumplimiento
RoHS and lead-free per NXP product declaration. REACH and halogen-free status not explicitly listed in the verified web data; AEC-Q100 not applicable for this commercial-grade MPU.
