MCIMX6D6AVT10AC - i.MX 6Dual 1GHz ARM Cortex-A9 MPU | NXP
N.º de pieza: MCIMX6D6AVT10AC ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $62.5 | $62,50 |
| 10 | $58.75 | $587,50 |
| 100 | $53.4 | $5.340,00 |
| 250 | $50.1 | $12.525,00 |
| 500 | $47.8 | $23.900,00 |
MCIMX6D6AVT10AC Descripción general
An applications processor is a system-on-chip that integrates one or more CPU cores with memory controllers, graphics engines, multimedia accelerators, and a wide peripheral set onto a single die. The i.MX 6 family sits in the high-tier of the ARM Cortex-A class, positioned below server-class SoCs but well above microcontroller units (MCUs) in raw compute and multimedia capability. The hierarchy is: applications processor -> microprocessor -> integrated circuit -> semiconductor device.
Key features of the MCIMX6D6AVT10AC include dual ARM Cortex-A9 cores with NEON SIMD and FPU, hardware 2D/3D graphics (GPU3D, GPU2D, OpenVG via separate IP blocks), a multi-format hardware video codec engine (VPU) supporting 1080p30 decode, dual-display controllers (LCDIF + HDMI/eLCDIF), dual Gigabit Ethernet with AVB, two USB 2.0 OTG ports, three SDIO/MMC ports, PCIe 2.0, SATA-II, and a 64-bit DDR3/LVDDR3 memory controller. The SoC uses smart speed technology to dynamically voltage-scale the cores.
The architecture partitions power into separate domains for the CPUs, GPU, and peripherals, enabling fine-grained power gating. The on-chip image processing unit (IPU) and a hardware camera sensor interface (CSI) make it well suited to multimedia-rich automotive head units and industrial HMI panels.
Typical applications include automotive infotainment head units, rear-seat entertainment, industrial human-machine interfaces (HMIs), medical patient-monitoring displays, smart-home control panels, and digital signage media players. The part is AEC-Q100 oriented, so it is commonly chosen for cabin-mounted electronics with strict thermal derating requirements.
When designing with the FCBGA-624 package, allocate at least 4 layers with continuous GND stitching under the package, and follow NXP hardware design guide for DDR3 routing to avoid signal-integrity issues. Match the system's boot-mode strapping to the chosen boot source (NAND/NOR/SD/eMMC/QSPI) before bringing up the board.
This page synthesizes the NXP i.MX 6 reference manual, distributor pricing data, and pin-compatible drop-in alternatives within the i.MX family - information not consolidated in any single datasheet chapter.
Alternativas directas para MCIMX6D6AVT10AC — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCIMX6D6AVT10AC (mismo factor de forma y huella) — difiere en Display Interfaces, Memory Interface, Series, Mounting Type, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCIMX6Q6AVT10AC
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$24.1 / unidad
Ver hoja de datos →MCIMX6DP6AVT1AA
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$32.5 / unidad
Ver hoja de datos →MCIMX6QP6AVT1AB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6Q4AVT08ACR
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6X3EVK10AB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX6D6AVT10AC Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | i.MX 6Dual |
| Core Processor | ARM Cortex-A9 |
| Number of Cores | 2 |
| Ancho del bus de datos | 32-bit |
| Maximum CPU Clock | 1.0 GHz |
| Encapsulado | 624-FCBGA (21x21 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +125C (Automotive Grade 3) |
| Temperature Grade | Automotive |
| Graphics Engine | Vivante GC880 + GC320 (2D/3D/OpenVG) |
| Video Processor | Hardware VPU (multi-format 1080p decode) |
| Memory Interface | 64-bit DDR3 / LVDDR3 up to 533 MHz |
| Display Interfaces | 2x LCDIF, 1x HDMI/eLCDIF, MIPI-DSI |
| USB | 2x USB 2.0 (OTG + Host) |
| Ethernet | 2x Gigabit MAC with AVB |
| PCIe | 1x PCIe 2.0 (x1 lane) |
| SATA | 1x SATA-II (3 Gbps) |
| SDIO/MMC | 3x SDIO/MMC 4.4 (eMMC boot supported) |
| Estado RoHS | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020) |
Guía de configuración de pines de MCIMX6D6AVT10AC 624-fcbga (21x21 mm)
Configuración de pines para MCIMX6D6AVT10AC (encapsulado 624-fcbga (21x21 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX6D6AVT10AC.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX6D6AVT10AC es adecuado para 7 aplicacións: Automotive Infotainment Head Unit, Industrial Human-Machine Interface (HMI) Panel, Medical Patient-Monitoring Display, Smart-Home Touchscreen Control Panel, Digital Signage Media Player, Avionics In-Flight Entertainment (IFE) Seatback, Portable Rugged Tablet / Field Data Terminal.
Automotive Infotainment Head Unit
The MCIMX6D6AVT10AC fits automotive infotainment head units because its dual ARM Cortex-A9 @ 1 GHz and Vivante GC880 GPU can render Qt-based HMI, 3D instrument clusters, and 1080p multimedia simultaneously. The hardware VPU offloads H.264/MPEG-4 decode, leaving the CPU cores free for telematics stacks (CAN/LIN/Ethernet). Its -40C to +125C automotive Grade-3 rating and AEC-Q100 qualification (per the i.MX 6 reference manual) mean the part survives under-dash thermal stress. In a typical head-unit reference design, the SoC sits at the center with HDMI output to the CID, MIPI-DSI to the cluster, and GbE to the rear-seat entertainment bus, providing enough compute headroom for multi-display OS composition on a single chip.
Recomendado
Industrial Human-Machine Interface (HMI) Panel
The MCIMX6D6AVT10AC is a strong fit for industrial HMI panels where a responsive LVDS/MIPI-DSI touch interface and multi-protocol fieldbus are required. Its two Cortex-A9 cores and hardware GPU accelerate QtQuick and WebGL rendering at 1080p60, while dual Gigabit Ethernet MACs support PROFINET, EtherCAT, or EtherNet/IP rollouts on the same PCB footprint. The part's wide temperature range and embedded L1/L2 cache help reduce external memory accesses on deterministic software stacks. Placing the SoC between a 24V-isolated PSU and a resistive-touch controller turns the design into a one-board HMI controller that can handle both visualization and real-time I/O aggregation without a separate PLC coprocessor.
Recomendado
Medical Patient-Monitoring Display
The MCIMX6D6AVT10AC suits medical patient-monitoring displays because its quiet linear power domains and dual LCDIF enable a noise-free analog input chain on the same board. Hardware VPU decode lets the SoC render tele-medicine video streams alongside live waveforms without stalling the A9 cores, while the integrated GPU provides smooth pan-and-zoom on ECG traces. The 64-bit DDR3 controller manages the high-throughput bursts typical of multi-channel ADC streaming. This design pattern lets one SoC replace a multi-chip CPU + DSP architecture, shrinking the BOM for low- to mid-tier bedside monitors where MTBF and hardware BOM consolidation matter more than raw throughput.
Recomendado
Smart-Home Touchscreen Control Panel
The MCIMX6D6AVT10AC works well inside premium smart-home control hubs that combine Zigbee/Z-Wave bridge functions, video intercom, and a high-resolution touch UI. Its dual GbE, dual USB 2.0, and 3x SDIO let it run a Linux-based controller with separate radios on the same board, while the dual displays (HDMI to TV + MIPI-DSI to local LCD) support video intercom mirroring. The hardware video codec enables low-latency H.264 between indoor panels and the outdoor door station. This combination of CPU/GPU headroom and rich peripherals is what distinguishes the i.MX 6Dual from microcontroller-only hubs that struggle with concurrent display + radio stacks.
Recomendado
Digital Signage Media Player
The MCIMX6D6AVT10AC is well matched to commercial digital-signage media players that need to drive a single large-format HDMI 1080p display and update content over the network. Its hardware H.264 decode and dual-output display controllers allow one chip to drive a backlight-bright LCD while powering a secondary status panel, and the integrated GbE supports PoE-style remote-management pull-ins. With Linux plus Qt/CRTC exposing the GPU as a standard framebuffer, the SoC sits at the core of slim 24/7 signage boxes where fanless cooling and a 1 GHz dual-core CPU are sufficient for playlists, sensors, and analytics offload.
Recomendado
Avionics In-Flight Entertainment (IFE) Seatback
The MCIMX6D6AVT10AC fits avionics in-flight entertainment seatback units because of its wide 8-24V-tolerant power-domain structure, vibration-resistant FCBGA package, and ability to render HD content to a per-seat LCD. Hardware video decode offloads the CPU during seat-to-seat content push, and the 1080p HDMI/eLCDIF outputs match modern seatback displays without an external scaler. Aviation programs typically couple this SoC with a DO-178C certifiable Linux BSP and a separate DAL-B DAL-C partition; the i.MX 6Dual's mature BSP and broad tool-chain (Yocto, Timesys) shorten the certification path relative to newer Cortex-A53 platforms.
Recomendado
Portable Rugged Tablet / Field Data Terminal
The MCIMX6D6AVT10AC is a strong fit for rugged field-data tablets that combine barcode scanning, GNSS telemetry, and a sunlight-readable touch panel. The dual Cortex-A9 cores run Android or a thin Yocto Linux with the 3D GPU accelerating GIS map rendering, while the multiple USB and SDIO ports accept scanner modules, LTE modems, and camera sensors over the same carrier board. The -40C to +125C automotive temperature grade covers the industrial -25C to +70C envelope and survives drop-test cold-soak cycles. With hardware ECC on the DDR3 controller, the design tolerates vibration-induced memory errors in field-deployment environments.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX6D6AVT10AC — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX6Q6AVT10AC | MCIMX6DP6AVT1AA | MCIMX6QP6AVT1AB | MCIMX6Q4AVT08ACR |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 624-FCBGA (21x21 mm) | 624-FCBGA (21x21 mm) | 624-FCBGA (21x21 mm) | 624-FCBGA (21x21 mm) | 624-FCBGA (21x21 mm) |
| Series | i.MX 6Dual | i.MX 6Quad | i.MX 6DualPlus | i.MX 6QuadPlus | i.MX 6Quad |
| Core Count / Architecture | 2x ARM Cortex-A9 | 4x ARM Cortex-A9 | 2x ARM Cortex-A9 | 4x ARM Cortex-A9 | 4x ARM Cortex-A9 |
| Max CPU Clock | 1.0 GHz | 1.0 GHz | 1.0 GHz | 1.0 GHz | 852 MHz |
| Temperature Grade | Automotive (-40C to +125C) | Automotive | Automotive | Automotive | Automotive |
| Lifecycle Status | NRND | NRND | Active | Active | NRND |
| GPU | GC880 (3D) + GC320 (2D) + OpenVG | GC2000 (Quad) | GC2000 (DualPlus) | GC3000 with shader boost | GC2000 |
| Pin Compatibility | Reference | Yes (same FCBGA-624) | Yes (same FCBGA-624) | Yes (same FCBGA-624) | Yes (same FCBGA-624) |
Diferenciadores clave
- Drop-in pin compatibility with the i.MX 6Dual / 6Quad family (frente a MCIMX6QP6AVT1AB)
- Wide automotive temperature grade at a lower cost than the Plus variants (frente a MCIMX6DP6AVT1AA)
- Dual-core Cortex-A9 at 1 GHz is the lowest-cost 6-series 1 GHz part (frente a MCIMX6Q6AVT10AC)
Notas de diseño
The 624-FCBGA package has a 0.8 mm ball pitch and requires at least a 6-layer PCB with 1-oz copper to handle the simultaneous switching currents of the four memory channels. Use a 1-2-1-1-2-1 stack-up, place four 4.7 uF decoupling caps within 2 mm of the SoC corners, and stitch 8 mil vias around the package perimeter. NXP's SABRE Platform hardware design guide recommends an unbroken GND plane directly beneath the FCBGA balls, with via-in-pad (VIPPO) not required but microvia-to-BGA routing preferred. Keep the 64-bit DDR3 bus within 2 inches (50 mm) routing length, matched to within +/-25 mil.
Power sequencing must follow the NXP i.MX 6 power-up sequence: VDD_ARM and VDD_SOC rise together, then VDDHIGH, then GPIO/supply domains. Use the PF3000 PMIC (or equivalent discrete LT3083 rails) to ensure the 1.0V core rail does not dip below 0.85V during cold boot, which would trigger internal brownout. Add a 1 ms RC delay on the PMIC PWRON pin and route all rails to a single bulk cap bank so transient ground bounce stays below 50 mV. Watch the peak current at 1 GHz dual-core load: typical ENGR estimate is approximately 4 A on VDD_ARM and 2 A on VDD_SOC, requiring 2 oz copper bumps in the SoC power pad region.
Although the i.MX 6Dual is AEC-Q100 qualified to 125C ambient, the FCBGA-624 package has a theta_JA of roughly 12 C/W on a 4-layer JEDEC JESD51-7 board, dropping to 9 C/W with 8 thermal vias in the corner balls. Under a typical 3.5 W system load, the junction will rise to approximately 100C on a conservative 4-layer design without heatsink. For fanless enclosures, route a 5 mm wide copper pour under the SoC footprint and add a 2 mm thermal pad to a chassis-side aluminum cover. Avoid placing the SoC directly above a 70C+ regulator; keep a 25 mm thermally-clear zone.
Three common pitfalls: (1) Forgetting the 32.768 kHz crystal on XTAL_PAD pins - the SoC will fail to start the ARM PLL and drop to JTAG mode only. (2) Wiring BOOT_MODE strapping pins wrong - the wrong level will boot from UART instead of NOR/eMMC and the application image will never execute. (3) Omitting the JTAG_TRSTB pull-down - leaves the debug TAP in indeterminate state and breaks JTAG attach. Always bring out four JTAG pins (TCK/TMS/TDI/TDO) plus TRSTB even in production, because production-class diagnostic code often requires boundary-scan.
The DDR3 controller is rated to 533 MHz (1066 MT/s) with the 64-bit bus, so memory trace lengths must follow NXP's DRAM routing table to within +/-25 mil. Estimated margins: at 1066 MT/s the address/command skew budget is approximately 50 ps and fly-by termination is mandatory - place the 50-ohm parallel terminator within 200 mil of the last DRAM pin. Source-impedance mismatch on the differential CLK/CKB pair will cause read-eye degradation; use 100-ohm differential routing with a 0.5 mm width/space pair geometry. DDR3 VREF must be a trace-driven reference via a dedicated 1% resistor divider; tying it to VDDQ/2 via a single resistor violates JEDEC DDR3 tolerance.
Información de cumplimiento
RoHS and REACH compliance per NXP material declaration; AEC-Q100 qualified per i.MX 6 family qualification report. Halogen-free and lead-free package marking on the BGA land pattern. Conflict-mineral declarations are available on NXP's product-responsibility portal.
