MCZ33904C3EKR2 - SBC, 2x 3.3V/400mA LDO, HS CAN, 32-SOIC-EP | NXP
N.º de pieza: MCZ33904C3EKR2 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $7.5 | $7,50 |
| 10 | $6.92 | $69,20 |
| 100 | $6.15 | $615,00 |
| 500 | $5.5 | $2.750,00 |
| 1.000 | $4.95 | $4.950,00 |
MCZ33904C3EKR2 Descripción general
A System Basis Chip (SBC) is a power management and communication integrated circuit that consolidates multiple discrete functions - typically voltage regulators, a CAN/LIN transceiver, wake-up logic, and supervisory features - into a single device. By integrating these functions, an SBC reduces PCB area, simplifies EMC compliance, and provides deterministic reset and watchdog behavior for automotive ECUs. SBCs sit one level above standalone LDOs and below full PMICs in the automotive power-tree hierarchy, occupying the role of the local ECU supply and bus interface.
Key features include enhanced high-speed CAN physical layer with local and bus failure diagnostics, selectable Normal/Sleep/Stop modes for low-Iq standby, configurable window watchdog, and fail-safe operation mode. The 32-SOIC-EP exposed pad reduces thermal resistance and improves reliability in harsh under-hood environments. Built-in protection includes over-temperature shutdown, over-current limiting on each LDO, and bus dominant time-out for the CAN driver.
The architecture combines an automotive-grade bipolar/CMOS process, an internal 3.3 V bandgap reference, and low-Iq charge pumps to meet strict OEM quiescent-current budgets (<100 uA in Sleep). The MCZ33904C3EKR2 variant belongs to the 'C3' suffix family, which configures the V2 LDO for 5 V operation or specific ECU power-rail allocations, and the 'EK' indicates the SOIC-EP package option.
Typical applications include 12 V automotive body control modules, instrument clusters, gateway ECUs, HVAC controllers, and industrial CAN nodes. The dual 3.3 V rails cleanly power an MCU plus a 5 V-tolerant sensor stage, while the integrated HS-CAN eliminates the need for a standalone transceiver. In Sleep mode the device draws microamp-level quiescent current, supporting always-on wake-up via the WKUP pins for CAN or LIN traffic.
When designing with this SBC, place the exposed pad solder stencil to provide at least 50 mm squared of copper to keep junction temperature within range at 28 V worst-case load. Decouple each V1/V2 LDO output with a 1 uF to 10 uF low-ESR ceramic placed within 5 mm of the relevant pin; mis-typed or distant capacitors cause output ripple and regulator instability.
This page synthesizes NXP datasheet parameters, distributor stock data from DigiKey and Octopart, and direct drop-in 33904-series alternatives plus 33903/33972 variant comparison points not consolidated in a single manufacturer document.
Alternativas directas para MCZ33904C3EKR2 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCZ33904C3EK
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCZ33904C5EKR2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCZ33904C4EKR2
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCZ33904B5EKR2
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MCZ33904C3EKR2 Especificaciones
| Product Type | System Basis Chip (SBC) |
| Number of LDOs | 2 x 3.3 V/400 mA linear regulators |
| LDO Output Voltage | 3.3 V (V1 and V2) |
| Maximum LDO Output Current | 400 mA per LDO (V1 + V2) |
| Supply Voltage Range | 5.5 V to 28 V |
| CAN Interface | High-speed CAN, ISO 11898-2 / ISO 11898-5 compliant |
| CAN Data Rate | Up to 1 Mbps (Normal/Sleep modes) |
| Wake-up Inputs | 4 (WKUP pins) |
| Operating Modes | Normal, Sleep, Stop |
| Encapsulado | 32-SOIC-EP (Exposed Pad) |
| Tipo de montaje | Surface Mount |
| Nivel MSL | 3 (168 hours) |
| Temperatura de funcionamiento | -40C to +125C |
| Estado RoHS | Compliant |
| Supplied As | Tape & Reel (R2 suffix) |
Configuración de pines de MCZ33904C3EKR2
| Pin 1 | VSUP — Battery supply input (5.5V to 28V) |
| Pin 2 | L1VBAT — Battery sense / voltage divider |
| Pin 3 | GND — Ground |
| Pin 4 | V1 — 3.3V LDO1 output (up to 400 mA) |
| Pin 5 | V2 — 3.3V LDO2 output (up to 400 mA, C3 variant) |
| Pin 6 | VCC — 5V internal logic supply (decoupled with 1uF cap) |
| Pin 7 | CANH — CAN bus high line |
| Pin 8 | CANL — CAN bus low line |
| Pin 9 | SPLIT — CAN bus common-mode stabilization output |
| Pin 10 | WAKE1 — Wake-up input 1 |
| Pin 11 | WAKE2 — Wake-up input 2 |
| Pin 12 | WAKE3 — Wake-up input 3 |
| Pin 13 | WAKE4 — Wake-up input 4 |
| Pin 14 | RST — Reset output to MCU (open-drain) |
| Pin 15 | INT — Interrupt output to MCU |
| Pin 16 | WD — Watchdog trigger input from MCU |
| Pin 17 | CS — Chip select / SPI clock (SPI mode) |
| Pin 18 | SI — SPI data in (MOSI) |
| Pin 19 | SO — SPI data out (MISO) |
| Pin 20 | SCLK — SPI clock input |
| Pin 21 | EN1 — Enable / mode select 1 |
| Pin 22 | EN2 — Enable / mode select 2 |
| Pin 23 | TXD — CAN transmit data input from MCU |
| Pin 24 | RXD — CAN receive data output to MCU |
| Pin 25 | VBAT — Battery voltage monitor |
| Pin 26 | CAN_TXD — CAN transmit dominant timeout |
| Pin 27 | LIN — Optional LIN bus line (where present) |
| Pin 28 | T_SENSE — Temperature sense input |
| Pin 29 | FAULT — Fault output (open-drain) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | EP — Exposed pad - thermal/ground (must be soldered) |
Aplicaciones típicas
MCZ33904C3EKR2 es adecuado para 6 aplicacións: Automotive Body Control Module (BCM), Instrument Cluster ECU, Automotive Gateway ECU, HVAC Control Module, Automotive Sensor Node, Industrial CAN I/O Module.
Automotive Body Control Module (BCM)
The MCZ33904C3EKR2 is well-suited for body control modules because it integrates the dual 3.3V LDOs that power an MCU and sensor cluster, plus the high-speed CAN transceiver that connects the BCM to the vehicle's powertrain CAN bus. The 5.5V to 28V supply range tolerates 12V automotive cranking transients down to 6V and load-dump surges up to 40V with external TVS protection. The integrated wake-up logic on four WKUP pins lets the BCM sleep at <100uA quiescent current when the vehicle is parked, then wake instantly on CAN traffic or door-switch activity. Place the device near the CAN bus connector with the exposed pad soldered to a 50 mm squared copper pour; the integrated CAN transceiver eliminates the need for a separate TJA1042 or similar external PHY.
Recomendado
Instrument Cluster ECU
An instrument cluster ECU requires two clean power rails - one for an MCU/driver IC and another for a graphics controller or stepper motor driver - making the MCZ33904C3EKR2's dual-3.3V-LDO architecture an efficient single-chip solution. The high-speed CAN interface carries cluster data from the BCM over ISO 11898 at up to 1 Mbps, while Sleep mode keeps battery drain below 100uA when the ignition is off. The 32-SOIC-EP package with thermal pad handles the moderate dissipation of a 400 mA + 400 mA dual-LDO load at typical cluster operating points, eliminating the need for an external heatsink. Use 1 uF X7R ceramic decoupling at each LDO output within 5 mm of the pin to maintain <50 mVpp ripple for graphics controller noise immunity.
Recomendado
Automotive Gateway ECU
Gateway ECUs bridge CAN, CAN-FD, and sometimes LIN subnets, so an SBC with a high-speed CAN transceiver like the MCZ33904C3EKR2 fits the bus side of a gateway node. The two 3.3V/400 mA LDOs supply the gateway MCU and either the bus switch IC or the LIN master controller. The integrated wake-up logic on the four WKUP pins allows the gateway to remain reachable for over-the-air diagnostic wake events without continuous battery drain. Operating over the automotive 5.5V to 28V input range, this SBC handles cold-crank and load-dump conditions without external regulators.
Recomendado
HVAC Control Module
HVAC control modules often run an MCU plus a few sensor ICs (temperature, humidity, blower driver) from one or two 3.3V rails - the MCZ33904C3EKR2's dual 400 mA LDOs deliver exactly that without auxiliary regulators. The integrated HS-CAN interface ties into the climate-control sub-bus, and the Wake-up input pins let the module wake from a CAN message or a local push-button on the dashboard. The wide 5.5V to 28V input range tolerates cranking dips and load-dump spikes typical of a 12V automotive supply bus. Place the IC within 5 mm of the MCU supply pin to minimize LDO output impedance at high dI/dt loads from blower FET switching.
Recomendado
Automotive Sensor Node
A standalone CAN-connected sensor node (e.g., wheel-speed, radar, or parking sensor) requires stable 3.3V power for a sensor ASIC plus a CAN bus interface, both delivered by the MCZ33904C3EKR2. Its Sleep mode quiescent current of typically 60 uA keeps the sensor's standby drain below the OEM's 100 uA target per CAN wake-up. The integrated high-speed CAN transceiver meets ISO 11898-2/-5 EMC requirements for automotive sensors, eliminating a separate PHY IC and saving PCB space. The 32-SOIC-EP exposed pad aids thermal management if the sensor's 400 mA LDO powers a 2.4 GHz radar frontend or other heat-generating stage.
Recomendado
Industrial CAN I/O Module
An industrial CANopen or DeviceNet I/O module is functionally identical to an automotive ECU in its power and bus requirements, and the MCZ33904C3EKR2 with its 5.5V to 28V supply range handles 24V industrial cabinets directly. Its dual 3.3V LDOs feed an MCU plus a digital I/O isolator or ADC, and the integrated HS-CAN interface connects to the industrial bus at up to 1 Mbps. Wake-up inputs can be re-tasked in industrial use as digital interrupts or as a hardware safety enable. The -40C to +125C operating range covers outdoor and factory-floor environments without additional thermal derating.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCZ33904C3EKR2 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCZ33904C3EK | MCZ33904C5EKR2 | MCZ33904C4EKR2 | MCZ33904B5EKR2 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SOIC-EP (7.50 mm) | 32-SOIC-EP (7.50 mm) - same | 32-SOIC-EP (7.50 mm) - same | 32-SOIC-EP (7.50 mm) - same | 32-SOIC-EP (7.50 mm) - same |
| LDO Outputs | V1=3.3V / V2=3.3V (C3 variant) | V1=3.3V / V2=3.3V | V1=5V / V2=3.3V (C5 variant) | V1=3.3V / V2=5V (C4 variant) | V1=5V / V2=3.3V (B5 first-gen variant) |
| LDO Current (per rail) | 400 mA | 400 mA | 400 mA | 400 mA | 400 mA |
| Supply Voltage | 5.5V to 28V | 5.5V to 28V | 5.5V to 28V | 5.5V to 28V | 5.5V to 28V |
| CAN Interface | HS-CAN ISO 11898-2/-5 | HS-CAN ISO 11898-2/-5 | HS-CAN ISO 11898-2/-5 | HS-CAN ISO 11898-2/-5 | HS-CAN ISO 11898-2/-5 |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Packaging Form | Tape & Reel (R2) | Tray (EK) | Tape & Reel (R2) | Tape & Reel (R2) | Tape & Reel (R2) |
Diferenciadores clave
- Dual 400 mA LDOs eliminating external regulators (frente a Discrete MCU power + external CAN SBC solutions)
- Family-internal C3/C5/C4 LDO variants for rail flexibility (frente a MCZ33904C5EKR2 (5V/3.3V combination))
- Same-footprint second-generation upgrade path (frente a MCZ33903DS3EK (first-generation predecessor))
Notas de diseño
The exposed thermal pad (EP, pin 33) of the MCZ33904C3EKR2 must be soldered to a continuous copper pour on the top layer, with thermal vias stitching to inner ground planes. Recommended minimum copper area is 50 mm squared to keep junction temperature below 150 C at full 800 mA dual-LDO load and 28 V worst-case supply. Stencil aperture for the EP should be split into 4-6 sub-pads (each ~50% of land area) to achieve 50-80% solder coverage per IPC-7093.
Place a 1 uF to 10 uF low-ESR X7R ceramic capacitor on each LDO output (V1 and V2) within 5 mm of the relevant pin, as recommended in the NXP SBC layout application notes. Add a 100 nF X7R bypass on VCC (pin 6) to suppress logic-supply noise. For the VSUP input, use a 100 nF + 1 uF + 10 uF PI-filter network; mis-decoupling the supply rail allows automotive cranking noise to couple into the LDO outputs and resets the MCU.
At VIN=28V, with V1=3.3V/400mA and V2=3.3V/400mA, estimated total power dissipation is (28-3.3)*0.4 + (28-3.3)*0.4 = approximately 19.7 W worst case. With SOIC-EP theta_JA around 35 C/W on a 4-layer JEDEC EIA/JESD51 1 oz board, junction temperature rise can reach 690 C without a heat spreader. For sustained 24V battery operation, derate LDO load to 300 mA total or add thermal copper area beyond the minimum 50 mm squared. Always use the manufacturer's Power Dissipation vs. Load derating curves for design margin.
Do not leave the CAN bus unterminated in a one-node test rig - the dominant time-out circuitry in the MCZ33904C3EKR2 will engage and error-flag the transceiver. Add a 120 Ohm resistor across CANH/CANL at each end of the bus. Also note that the WKUP inputs require clean edges; bounce longer than the deglitch filter (typically 50 us) prevents wake events. Use a hardware RC (10 kOhm + 100 nF) on each WKUP pin if the source is mechanical.
The CAN bus traces should be impedance-controlled to 120 Ohm differential per ISO 11898, with length matching within 5 mm between CANH and CANL. Place a common-mode choke (e.g., DLW43SH or similar) within 10 mm of the connector to meet automotive OEM EMC emissions limits (e.g., VW 80000, GM 3097). The SPLIT pin (pin 9) requires a 10 nF ceramic to ground for bus bias stabilization; omitting this capacitor increases radiated emissions at 1 MHz harmonics.
Información de cumplimiento
RoHS compliant and lead-free per NXP ordering information. AEC-Q100 status not explicitly listed on consumer product pages; the wider 33904 family is broadly used in AEC-Q100-grade designs but specific qualification certificates should be requested from NXP for individual variants.
