MK11DN512VMC5 - 50MHz Cortex-M4 MCU 512KB Flash | NXP Kinetis K11
N.º de pieza: MK11DN512VMC5 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.25 | $112,50 |
| 100 | $9.95 | $995,00 |
| 500 | $8.85 | $4.425,00 |
| 1.000 | $7.8 | $7.800,00 |
MK11DN512VMC5 Descripción general
A microcontroller (microcontroller unit, MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and peripheral interfaces (I/O ports, timers, communication controllers) into one IC. In the taxonomy of semiconductors, an MCU sits between a microprocessor (CPU only) and a system-on-chip (SoC, which adds application accelerators and rich peripherals). The Kinetis K11 family is positioned for cost-sensitive applications requiring low power, security encryption, and tamper detection - bridging the gap between general-purpose Cortex-M4 MCUs and security-focused secure-element ICs.
Key features of the MK11DN512VMC5 include 512 KB (512K x 8) of program flash, 64 KB SRAM, an ARM Cortex-M4 core with single-precision FPU, 50 MHz maximum CPU frequency, 64 general-purpose I/O pins, and serial connectivity via I2C, IrDA, SPI, UART/USART, plus I2S for audio. On-chip peripherals include DMA, low-voltage detect (LVD), power-on reset (POR), pulse-width modulators (PWM), and a watchdog timer (WDT). The device operates from 1.8V/2.5V/3.3V supplies and supports industrial temperature grades.
The Kinetis K11 architecture combines a Cortex-M4 core with a dedicated security sub-system featuring hardware encryption and tamper detection, eliminating the need for an external secure-element companion IC. Its 121-MAPBGA 8x8 mm package exposes 64 GPIO pins while keeping the footprint compact for embedded security modules, smart meters, and tamper-evident appliances.
Typical applications include anti-tamper smart meters, hardware-encrypted IoT nodes, secure payment terminals, electronic door locks with tamper detection, and industrial sensor hubs that require cryptographic authentication. The DryIce block and secure storage make it well-suited for any battery-sensing design that requires detection of physical intrusion attempts.
When designing with the MK11DN512VMC5, allocate PCB area for the 121-ball MAPBGA 8x8 mm land pattern and ensure the four-layer hardware tracks for clean analog/digital separation. The K11 DryIce secure-storage block requires proper external battery voltage reference as well as firmware integration of the NXP Kinetis security SDK.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para MK11DN512VMC5 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MK11DN512VMC5 (mismo factor de forma y huella) — difiere en Package, Peripherals, Security Features, USB, Core Processor.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MK12DN512VMC5
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MK21DN512VMC5
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MK21DN512AVLK5
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4.8 / unidad
Ver hoja de datos →MK22DN512VMC5
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MK40DX64VLH7
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$2.28 / unidad
Ver hoja de datos →MK11DN512VMC5 Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors |
| Series | Kinetis K11 |
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| Maximum CPU Speed | 50 MHz |
| Program Memory Size | 512 KB (512K x 8) Flash |
| RAM Size | 64 KB |
| Number of I/O Pins | 64 |
| Tensión de alimentación | 1.8 V / 2.5 V / 3.3 V |
| Encapsulado | 121-MAPBGA (8x8 mm) |
| Tipo de montaje | Surface Mount |
| Connectivity | I2C, IrDA, SPI, UART/USART, I2S |
| Peripherals | DMA, I2S, LVD, POR, PWM, WDT |
| Security Features | Hardware CRC, Tamper Detect, Secure Storage, Hardware RNG, Hardware Encryption |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| Estado RoHS | Compliant |
Guía de configuración de pines de MK11DN512VMC5 121-mapbga (8x8 mm)
Configuración de pines para MK11DN512VMC5 (encapsulado 121-mapbga (8x8 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MK11DN512VMC5.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MK11DN512VMC5 es adecuado para 7 aplicacións: Anti-Tamper Smart Metering, Hardware-Encrypted IoT Nodes, Secure Payment Terminals, Electronic Door Locks with Tamper Detection, Industrial Sensor Hubs with Cryptographic Authentication, Tamper-Evident Appliances, Battery-Sensing Secure Modules.
Anti-Tamper Smart Metering
The MK11DN512VMC5 fits anti-tamper smart metering because of its integrated DryIce tamper-detection block and hardware encryption, which detect physical intrusion attempts and protect consumption data at rest. With 512 KB flash and 64 KB SRAM, the MCU can host a full DLMS/COSEM stack alongside NXP's Kinetis security SDK without external secure-element. Its 50 MHz Cortex-M4 core executes metering calculations and cryptographic operations within typical 15-minute aggregation windows. Operating from a single 3.3 V supply with industrial temperature grade -40C to +85C, the device is suited for outdoor meter installations across global mains environments.
Recomendado
Hardware-Encrypted IoT Nodes
The MK11DN512VMC5 enables hardware-encrypted IoT nodes by combining its Cortex-M4 core with an on-chip AES accelerator and hardware random-number generator, eliminating the need for an external secure-element. The 512 KB flash stores TLS/DTLS stacks alongside application firmware, while 64 KB SRAM holds TLS session buffers and sensor data. With SPI, I2C, and UART connectivity, the MCU interfaces directly to radios (Sub-GHz, BLE companions) and environmental sensors. The 121-MAPBGA 8x8 mm footprint keeps the node compact enough for wall-mount or battery-powered sensor enclosures.
Recomendado
Secure Payment Terminals
The MK11DN512VMC5 serves as the secure host MCU in PIN-entry devices and payment terminals, where hardware encryption and tamper detection are mandatory for PCI PTS compliance. Its 50 MHz Cortex-M4 handles user-interface rendering and transaction flow, while the hardware encryption block offloads AES/RSA operations. The DryIce secure-storage area holds PIN keys and transaction certificates, with tamper events triggering instant zeroization. The 64 GPIO pins drive keypad scanning, LCD, and secure card-reader interfaces. Industrial temperature rating ensures reliability in unattended outdoor payment kiosks.
Recomendado
Electronic Door Locks with Tamper Detection
The MK11DN512VMC5 fits electronic door locks and access-control modules where physical-tamper detection and credential encryption are critical. The DryIce block monitors tamper pins for cover removal, drilling, or forced-entry attempts, while the hardware encryption block protects stored credentials and audit logs. With 64 GPIO pins, the MCU directly drives keypad matrices, RFID readers, motor control PWM, and audible feedback. The 512 KB flash hosts the access-control application plus secure credential storage, and 64 KB SRAM handles transaction buffers. The 121-MAPBGA 8x8 mm footprint fits inside slim lock housings.
Recomendado
Industrial Sensor Hubs with Cryptographic Authentication
The MK11DN512VMC5 enables industrial sensor hubs with cryptographic authentication by combining its hardware encryption and RNG blocks with rich serial connectivity (I2C, SPI, UART, I2S). The MCU authenticates sensor readings using HMAC signatures, preventing data tampering across the industrial bus. With 512 KB flash and 64 KB SRAM, multiple sensor stacks coexist with edge analytics. The 50 MHz core processes high-rate sensor data, and 64 GPIO drive status LEDs, relays, and isolated interfaces. Industrial temperature grade -40C to +85C supports factory-floor deployment.
Recomendado
Tamper-Evident Appliances
The MK11DN512VMC5 is well suited for tamper-evident appliances such as medical infusion pumps, gaming terminals, and lottery machines, where regulatory compliance requires hardware tamper response. Its DryIce secure-storage block logs intrusion events in non-volatile memory and triggers zeroization routines within milliseconds. The hardware CRC module ensures data-integrity verification of stored logs and configuration. The Cortex-M4 core runs the appliance user interface and audit firmware, while 64 GPIO drive displays, keypads, and motor control. The 121-MAPBGA 8x8 mm package fits inside sealed appliance enclosures.
Recomendado
Battery-Sensing Secure Modules
The MK11DN512VMC5 fits battery-sensing secure modules that require both tamper detection and reliable backup-battery monitoring, supported by its integrated DryIce block that maintains tamper-detection state through external battery backup. The 50 MHz Cortex-M4 core handles secure-state logging and intrusion-event timestamping during main-power loss. The 64 KB SRAM buffers pending tamper events for later upload. Operating from 1.8 V, 2.5 V, or 3.3 V supplies and industrial temperature grade -40C to +85C, the device is ideal for long-life battery-backed modules such as utility meters and alarm panels.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MK11DN512VMC5 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MK12DN512VMC5 | MK21DN512VMC5 | MK21DN512AVLK5 | MK22DN512VMC5 | MK40DX64VLH7 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-MAPBGA (8x8 mm) | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same | 121-MAPBGA (8x8 mm) - same |
| Core | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 |
| CPU Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 64 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 16 KB |
| DryIce Tamper Block | Yes | No | No | No | No | No |
Diferenciadores clave
- Integrated DryIce tamper-detection block (frente a MK12DN512VMC5)
- Hardware encryption accelerator on-chip (frente a MK22DN512VMC5)
- Highest density memory in K11 sub-family (frente a MK40DX64VLH7)
Notas de diseño
The 121-MAPBGA 8x8 mm package requires a four-layer PCB with matched-impedance routing and a continuous ground plane directly under the BGA to provide thermal dissipation and reference return paths. Per NXP's K11 hardware design notes, escape routing on the top layer should fan out to inner layers with 0.5 mm pitch vias. X-ray inspection of solder joints is recommended for production BGA assembly verification.
Bulk-decoupling capacitors (one 10 uF ceramic + one 0.1 uF ceramic per VDD/VSS pair) must be placed within 5 mm of the BGA supply balls, per the K11 datasheet power-distribution network guidance. Add a ferrite bead between external supply and MCU VDD if the design shares a rail with noisy switching converters. The integrated voltage regulator requires an external inductor and capacitors; refer to the K11 reference manual for component values.
Estimated: DryIce secure-storage register retention requires an external backup battery on the VBAT pin - omitting this battery causes tamper state to be lost on main-power removal, which violates secure-storage guarantees. Per the K11 datasheet, the VBAT pin must remain powered through all tamper events. Designers should not assume SRAM retention without VBAT.
At maximum CPU activity (50 MHz, all peripherals enabled), the K11 draws approximately 50 mA from VDD, dissipating roughly 165 mW at 3.3 V. The 121-MAPBGA thermal pad must be soldered to a grounded copper pour of at least 25 mm x 25 mm to keep junction temperature within industrial limits. Per NXP thermal guidance, derate CPU speed above +85C ambient if the thermal pad is reduced.
Información de cumplimiento
RoHS and REACH compliance confirmed by manufacturer datasheet. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified (industrial-grade MCU).
