MK22FN256VMP12 - 120MHz Cortex-M4F MCU 256KB Flash | NXP
N.º de pieza: MK22FN256VMP12 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $15.9 | $15,90 |
| 10 | $14.31 | $143,10 |
| 100 | $12.75 | $1.275,00 |
| 500 | $11.2 | $5.600,00 |
| 1.000 | $9.85 | $9.850,00 |
MK22FN256VMP12 Descripción general
A microcontroller (MCU) is an integrated circuit that combines a processor core, program memory (typically flash), data memory (SRAM), and programmable peripherals (ADCs, timers, communication interfaces, GPIO) on a single silicon die. MCUs sit inside the broader category of microprocessors -> processors -> digital ICs -> semiconductors. The K22F family specifically emphasizes low-power flexibility combined with performance efficiency, targeting applications that need Cortex-M4F DSP instructions and floating-point math while keeping bill-of-material costs low.
Key features include a Cortex-M4F core with single-precision FPU, 256 KB program flash, 48 KB SRAM, Full-Speed USB 2.0 with on-chip transceiver and crystal-less operation, a 16-bit SAR ADC with up to 16 channels, multiple Low-Power Timer (LPTMR) and FlexTimer (FTM) instances, low-leakage wake-up unit, and operating voltage of 1.71V to 3.6V. The MAPBGA-64 package suits compact handheld designs and supports industrial temperature ranges (-40C to +105C).
The K22F architecture uses a Cortex-M4F core with DSP extensions and single-precision floating point, connected through a multi-layer AHB/APB bus matrix for deterministic peripheral access. The on-chip voltage regulator with internal DCDC converter supports low-power Run, Wait, and Stop modes while maintaining RTC and RAM retention, allowing system designers to optimize for battery life without external power-management ICs.
Typical applications include industrial HMI panels, USB peripherals such as POS terminals and barcode scanners, low-power sensor hubs, motor control reference designs, and wearable consumer electronics. The integrated USB and 12-bit DAC simplify audio playback or signal-generation designs without requiring an external interface IC.
When designing with the MK22FN256VMP12, ensure that the USB pins have proper 90-ohm differential routing if Full-Speed USB is enabled, and place the decoupling capacitor network as close as possible to the VDDA and VDD pins. The MAPBGA-64 footprint requires PCB design with microvia fan-outs for reliable assembly at production volumes.
This page synthesizes distributor pricing, drop-in K22F alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting engineers evaluating MK22-family MCU selection for next-generation embedded products.
Alternativas directas para MK22FN256VMP12 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MK22FN256VMP12 (mismo factor de forma y huella) — difiere en Mounting Type, SRAM, Package, Core Processor, Maximum Clock Frequency.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MK22FN512VMP12
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →MK22FN128VMP10
✅ Sustitución directa✓ En stock
$3.18 / unidad
Ver hoja de datos →MK22FN256VMP12 Valores máximos y características eléctricas
| Core | ARM Cortex-M4F with FPU |
| Frecuencia de reloj máxima | 120 MHz |
| Program Flash Memory | 256 KB |
| SRAM | 48 KB |
| Operating Voltage Range | 1.71 V to 3.6 V |
| USB Interface | USB 2.0 Full-Speed with on-chip transceiver, crystal-less option |
| ADC | 16-bit SAR ADC, up to 16 single-ended channels |
| DAC | 12-bit DAC |
| Encapsulado | 64-MAPBGA (5x5 mm) |
| Rango de temperatura de funcionamiento | -40 C to +105 C (Industrial) |
| Low-Power Modes | Run, Wait, Stop, VLPR, VLPW, VLPS with RTC retention |
| Communication Interfaces | USB, UART, SPI, I2C, I2S, CAN (select signal) |
| Tipo de montaje | Surface Mount (BGA) |
| Nivel MSL | 3 (168 hours) |
| Estado RoHS | Compliant |
| Series | Kinetis K22 |
Guía de configuración de pines de MK22FN256VMP12 64-mapbga (5x5 mm)
Configuración de pines para MK22FN256VMP12 (encapsulado 64-mapbga (5x5 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MK22FN256VMP12.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MK22FN256VMP12 es adecuado para 7 aplicacións: USB Barcode Scanner, Industrial HMI Panel Controller, Low-Power Sensor Hub, USB Audio Class Device, Motor Control Reference Design, Wearable Fitness Tracker, Point-of-Sale (POS) Terminal.
USB Barcode Scanner
The MK22FN256VMP12 suits USB barcode scanners because its on-chip Full-Speed USB transceiver eliminates external PHY components, while the 120 MHz Cortex-M4F core runs image-decode algorithms with low latency. The 256 KB flash fits firmware for 1D/2D barcode libraries, and the 48 KB SRAM buffers decoded payloads before HID report transmission. Crystal-less USB operation further reduces BOM and board area. Decoupling 100 nF and 4.7 uF capacitors placed near VDD/VDDA pins are required for stable USB enumeration during host polling.
Recomendado
Industrial HMI Panel Controller
The MK22FN256VMP12 drives small industrial HMI panels where the Cortex-M4F core renders graphical UI via SPI-connected TFT displays and scans capacitive touch via I2C. Operating voltage down to 1.71 V supports 3.3 V-only designs, while the 16-bit SAR ADC reads backlight current, temperature, and button inputs. The MAPBGA-64 footprint is well-suited to compact panel PCBs. Designers should provide hardware watchdog reset via the K22's on-chip WDOG to recover from firmware hangs during continuous industrial operation.
Recomendado
Low-Power Sensor Hub
The MK22FN256VMP12 acts as a sensor hub aggregating data from I2C and SPI sensors in battery-powered IoT devices. Its low-leakage Run, Wait, and Stop modes with RTC retention let the MCU idle at microamp-level currents while waiting for sensor interrupts, then wake to full 120 MHz operation in microseconds. The integrated 12-bit DAC and 16-bit ADC support analog sensor calibration loops without external converters. Use the low-power timer (LPTMR) to schedule periodic sensor sampling without waking the CPU.
Recomendado
USB Audio Class Device
The MK22FN256VMP12 supports USB Audio Class 1.0 devices such as USB speakers, headphones, and audio interfaces. The I2S peripheral connects to external audio codecs while the USB stack handles isochronous audio streaming at 48 kHz. The Cortex-M4F DSP extensions perform software audio processing (EQ, mixing, effects) without external DSP. 48 KB SRAM serves as audio sample buffer, and the 12-bit DAC provides a basic analog output option for low-cost designs where external codec is undesirable.
Recomendado
Motor Control Reference Design
The MK22FN256VMP12 executes single-shunt and dual-shunt FOC motor control algorithms using its FlexTimer (FTM) peripherals for PWM generation and the 16-bit SAR ADC for current sensing. The 120 MHz Cortex-M4F provides sufficient headroom for 20 kHz control loops on BLDC and PMSM motors up to several hundred watts. Hardware fault inputs from comparators shut down PWM outputs within one cycle, providing critical overcurrent protection. Designers should isolate analog and digital grounds and route ADC traces away from PWM traces.
Recomendado
Wearable Fitness Tracker
The MK22FN256VMP12 powers wearable fitness bands that read heart-rate sensors, accelerometers, and display information on small OLED panels. The 5x5 mm MAPBGA package fits in compact wrist-worn enclosures, and low-power Stop mode with RTC retention allows weeks of standby on a small Li-ion battery. The 12-bit DAC generates audio cues for notifications while the 16-bit ADC reads PPG sensor outputs for heart-rate algorithms. Designers should leverage the K22's segmented LCD interface option if migrating to display-heavy wearables.
Recomendado
Point-of-Sale (POS) Terminal
The MK22FN256VMP12 supports compact POS terminals integrating USB device connectivity, secure key entry, and receipt printing. The 256 KB flash accommodates encryption libraries (AES, SHA), USB HID stacks, and printer drivers, while 48 KB SRAM handles transaction buffers. The integrated USB Full-Speed with crystal-less option enables direct connection to host PCs without external clock components. Designers should use the K22's hardware RNG and tamper pins to detect enclosure intrusion events on POS hardware.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MK22FN256VMP12 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MK22FN512VMP12 | MK22FN128VMP10 |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 64-MAPBGA (5x5 mm) | 64-MAPBGA (5x5 mm) - same | 64-MAPBGA (5x5 mm) - same |
| Core | ARM Cortex-M4F with FPU | ARM Cortex-M4F with FPU - same | ARM Cortex-M4F with FPU - same |
| Maximum Clock Frequency | 120 MHz | 120 MHz - same | 100 MHz (-17%) |
| Program Flash | 256 KB | 512 KB (+100%) | 128 KB (-50%) |
| SRAM | 48 KB | 128 KB (+167%) | 16 KB (-67%) |
| USB Interface | USB 2.0 Full-Speed, on-chip transceiver, crystal-less | USB 2.0 Full-Speed, on-chip transceiver, crystal-less - same | USB 2.0 Full-Speed, on-chip transceiver |
| Operating Voltage Range | 1.71 V to 3.6 V | 1.71 V to 3.6 V - same | 1.71 V to 3.6 V - same |
Diferenciadores clave
- Higher SRAM than the MK22FN128 variant while keeping same flash tier (frente a MK22FN128VMP10)
- Smaller flash than MK22FN512 while preserving pinout (frente a MK22FN512VMP12)
- Crystal-less Full-Speed USB eliminates external 48 MHz crystal (frente a MK22FN128VMP10)
Notas de diseño
The 64-MAPBGA package has 64 solder balls on a 5x5 mm body. Use microvia fan-outs (0.1 mm laser vias) from BGA pads to inner signal layers per NXP AN4832 BGA layout guidelines. Place a 4.7 uF bulk capacitor and 100 nF decoupling on each VDD/VDDA pin pair, with traces shorter than 5 mm to minimize inductance. Ground plane stitching vias should surround the BGA at 1 mm spacing for signal integrity.
The on-chip voltage regulator requires a 4.7 uF capacitor on the VDDA pin and 100 nF on each VDD pin. For USB applications, place the 3.3V USB regulator output capacitor within 2 mm of the VREGIN pin. Decouple the analog VDDA separately from digital VDD with a ferrite bead to prevent ADC sampling noise. Enable the on-chip DCDC converter (DCDC_VBAT) for battery applications to reduce quiescent current by approximately 30% versus the internal LDO mode.
USB DP/DM differential pair requires 90-ohm differential impedance with trace lengths matched within 2 mm. Route the pair over an unbroken ground plane and avoid stubs longer than 1 mm. The crystal-less USB mode uses the internal 48 MHz IRC; if using an external crystal, place the XTAL32 and EXTAL32 traces short and symmetric, surrounded by ground guard ring. Avoid routing ADC inputs near PWM or USB signals to prevent coupling into analog measurements.
Do not omit the external reset supervisor or RC delay on the RESET_b pin; the internal pull-up is weak and noise on the reset line causes unpredictable boot behavior. Always configure the NMI pin properly during initialization - leaving it floating can trap the core in interrupt loops. The MAPBGA's exposed die pad (if present in this MAPBGA variant) must be soldered to the ground plane for thermal dissipation and electrical performance; missing this pad connection leads to overheating under high CPU load.
Información de cumplimiento
RoHS compliant per NXP product page. Industrial temperature grade (-40C to +105C). Not AEC-Q100 qualified - choose AEC-Q100 qualified part variants for automotive applications.