MK50DX256ZCLL10 - 100MHz Cortex-M4 256KB MCU | NXP
N.º de pieza: MK50DX256ZCLL10 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $14.3475 | $14,35 |
| 10 | $14.3475 | $143,48 |
| 100 | $14.3475 | $1.434,75 |
| 500 | $14.3475 | $7.173,75 |
| 1.000 | $14.3475 | $14.347,50 |
MK50DX256ZCLL10 Descripción general
A microcontroller such as the MK50DX256ZCLL10 is a complete programmable control element: it combines a CPU core, memory, interrupt control, timers, communication interfaces, and analog or mixed-signal peripherals on one integrated circuit. In the system hierarchy, this ARM Cortex-M4 MCU belongs to the embedded processor and microcontroller class rather than the discrete semiconductor or passive-component categories. Its role is to execute firmware and coordinate sensors, actuators, communications, and human-machine interfaces.
The verified product information identifies a 32-bit ARM Cortex-M4 core, 100 MHz operating frequency, and 256 KB Flash memory. A 100-LQFP package provides 100 external leads and is suitable for board-level assembly where a relatively high pin count is acceptable. The listed Kinetis K50 positioning also makes the device relevant to industrial, measurement, communications, and embedded control designs that need a general-purpose MCU with substantial Flash storage.
The 100 MHz Cortex-M4 architecture is suited to interrupt-driven control loops, protocol handling, data acquisition, and supervisory tasks. The 256 KB Flash capacity provides room for an embedded application image, bootloader, configuration data, and library code. Compared with a very small low-power MCU, the MK50DX256ZCLL10 offers more compute and storage headroom, while its package and power-management requirements should be checked against the target board.
Typical applications include industrial monitoring, data-acquisition systems, building automation, embedded instrumentation, communication equipment, and motor or process-control platforms. For these uses, the MCU can execute control software while handling sensor inputs and communicating with external controllers. The exact peripheral set, supply limits, pin functions, memory map, and electrical limits must be confirmed in the manufacturer datasheet before final design release.
A key design consideration is PCB layout. The 100-LQFP package has closely spaced leads and requires careful routing of power, ground, decoupling, and high-speed signals. Confirm the recommended land pattern, exposed thermal requirements, and all alternate-function assignments from the NXP documentation rather than inferring them from the package name.
This page consolidates verified distributor and manufacturer information with selection guidance, application context, and design notes that are not normally included in a basic distributor listing. It is intended to help engineers identify the correct MCU and plan a reliable hardware implementation.
Alternativas directas para MK50DX256ZCLL10 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MK50DX256ZCLL10 (mismo factor de forma y huella) — difiere en Package, Flash Memory.
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MK50DX256CLL10
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$10.95 / unidad
Ver hoja de datos →MK50DX256ZCLL10 Valores máximos y características eléctricas
| Product Type | 32-bit ARM Cortex-M4 microcontroller |
| Core | ARM Cortex-M4 |
| Maximum CPU Frequency | 100 MHz |
| Flash Memory | 256 KB |
| Flash Organization | 256K x 8 bits |
| Architecture | 32-bit |
| Series | Kinetis K50 |
| Series Application | K5 measurement series |
| Encapsulado | 100-LQFP (14 x 14 mm) |
| Recuento de pines | 100 pins |
| Tipo de montaje | Surface mount |
| Tensión de alimentación | 3.3 V |
Guía de configuración de pines de MK50DX256ZCLL10 100-lqfp (14 x 14 mm)
Configuración de pines para MK50DX256ZCLL10 (encapsulado 100-lqfp (14 x 14 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MK50DX256ZCLL10.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MK50DX256ZCLL10 es adecuado para 6 aplicacións: Industrial Data Acquisition, Building Automation Controller, Embedded Instrumentation, Industrial Communication Gateway, Process Control Platform, Energy and Environmental Monitoring.
Industrial Data Acquisition
The MK50DX256ZCLL10 fits industrial acquisition systems that need a 100 MHz ARM Cortex-M4 CPU and 256 KB of Flash for signal processing, control state, and communication routines. It can supervise sensor inputs, execute filtering and calibration logic, and coordinate data transfer through available peripherals once those functions are confirmed in the datasheet. The 100-LQFP package provides numerous external connections for sensors and interface circuits, although its 100 leads require careful PCB layout. Compared with a small low-power MCU, the Cortex-M4 core offers more compute headroom, while the 256 KB Flash supports a larger application image. Verify the required ADC performance, serial interfaces, operating limits, and supply sequencing before release.
Recomendado
Building Automation Controller
A building automation controller can use the MK50DX256ZCLL10 for event processing, sensor management, actuator control, and communications. The 100 MHz Cortex-M4 core is suitable for a multitasking embedded application, while 256 KB Flash provides space for protocol handlers, configuration logic, and a bootloader. The 100-LQFP package is useful when a controller requires numerous discrete I/O or external bus connections. Design engineers should reserve pins for sensing inputs, relay or valve drives, communications, and debug access, then confirm alternate-function assignments from the NXP documentation. The MCU is advantageous where code and peripheral breadth matter more than the smallest possible package, but final selection requires validation of timing, isolation, environmental requirements, and low-power behavior.
Recomendado
Embedded Instrumentation
The MK50DX256ZCLL10 is a reasonable candidate for embedded instrumentation that combines control firmware with measurement-related functions. Its 100 MHz ARM Cortex-M4 processor can handle sampling coordination, digital filtering, calibration tables, and a communications stack, while 256 KB Flash provides room for application code and configuration. The K5 measurement-series positioning makes the family relevant to measurement designs, but the exact ADC architecture, resolution, sampling rate, references, and analog inputs must be confirmed in the manufacturer datasheet. The 100-LQFP package also allows numerous external signal and power connections. Engineers should assess analog layout, grounding, reference noise, calibration strategy, and enclosure temperature conditions before committing the MCU to a precision measurement design.
Recomendado
Industrial Communication Gateway
For an industrial communication gateway, the MK50DX256ZCLL10 can execute protocol stacks, buffer management logic, status monitoring, and supervisory control. The 100 MHz Cortex-M4 core provides more processing capacity than very small low-power MCUs, and 256 KB Flash gives firmware developers a substantial code budget for communication drivers and update handling. The 100-LQFP package provides a large pin count for external interfaces and debugging. It does not, by itself, specify which Ethernet, CAN, UART, or other communication peripherals are available; those interfaces must be confirmed before selecting the device. Board-level planning should include signal termination, connector protection, isolated power where required, firmware update strategy, and watchdog recovery for unattended field operation.
Recomendado
Process Control Platform
The MK50DX256ZCLL10 can serve as the central controller in a process-control platform when the design requires deterministic firmware execution, multiple external connections, and sufficient program storage. A 100 MHz Cortex-M4 core can coordinate control loops, state machines, diagnostics, and communications, while the 256 KB Flash capacity can hold application code, configuration, and a recovery image. The 100-LQFP package is appropriate when the controller requires numerous sensor, actuator, and communication connections. Actual control-loop timing depends on the verified peripheral set and interrupt configuration, so engineers should review timer resolution, PWM, ADC, and communication features in the datasheet. Thermal, grounding, isolation, and safety requirements must be handled at the system level rather than inferred from the MCU package.
Recomendado
Energy and Environmental Monitoring
A monitoring node can use the MK50DX256ZCLL10 to acquire sensor data, apply filtering, maintain operating state, and report results through a communications interface. The 256 KB Flash provides room for firmware, calibration data, and field-upgrade logic, while the 100 MHz core can service multiple measurement and control tasks. The 100-LQFP package gives the designer access to a substantial number of I/O pins for sensors, status indicators, and external interface transceivers. Because the verified data does not list the MCU's ADC, timer, or low-power features, the designer must confirm those functions before claiming standalone battery or precision-sensor performance. Board planning should also address sensor noise, power-supply isolation, enclosure temperature, and robust recovery after power loss.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MK50DX256ZCLL10 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MK50DX256CLL10 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Package | 100-LQFP (14 x 14 mm) | 100-LQFP; exact package confirmation required |
| CPU Core | ARM Cortex-M4 | Cortex-M0+ according to related NXP snippet |
| Flash Memory | 256 KB | 256 KB according to related listing |
Diferenciadores clave
- Higher verified processing frequency (frente a MK50DX256CLL10)
- Explicit Kinetis K50 positioning (frente a MK50DX256CLL10)
- Substantial verified Flash capacity (frente a MK50DX256CLL10)
Notas de diseño
Use the NXP-recommended 100-LQFP land pattern and place the device so that power, ground, and high-speed signals have short, controlled paths. Confirm every pin assignment and alternate function against the official datasheet before routing. The 100-lead footprint leaves limited spacing between leads, so check courtyard clearance, solder-paste volume, assembly capability, and test-point access during layout review.
The verified distributor data identifies MK50DX256ZCLL10 as a 3.3 V device. Place local decoupling capacitors close to the device power pins according to the manufacturer recommended layout, and route ground returns without long loops. Do not derive allowable voltage tolerance, current limits, or sequencing requirements from the distributor description; obtain those values from the official datasheet and validate them against the system power tree.
Do not treat a same-family or related NXP MPN as a drop-in MCU without checking the exact pinout, core, memory map, peripheral functions, interrupt vectors, boot configuration, and software support. The supplied evidence describes MK50DX256CLL10 differently from MK50DX256ZCLL10, so board revision and firmware compatibility must both be reviewed before substitution.
If the design uses analog measurement inputs, separate sensitive analog routing from switching and digital return currents, and keep the MCU power ground arrangement consistent with the selected measurement architecture. Verify the ADC, reference, and analog-pin specifications in the NXP datasheet before relying on this part for signal accuracy. PCB copper area and thermal performance should be evaluated with the actual ambient temperature and enclosure.
The 100-LQFP package is surface mount and its thermal performance depends on the PCB copper, assembly, airflow, and ambient temperature. Use the package power and thermal information from the NXP datasheet for a production thermal calculation. As a design process step, estimate worst-case junction temperature from actual supply voltage, core activity, I/O load, and board thermal resistance rather than assuming that the package name alone guarantees safe operation.
Información de cumplimiento
The supplied web snippets do not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. These fields must be confirmed on the NXP product documentation or current manufacturer compliance material.