MPC8241LZQ200D - 200MHz PowerQUICC II Host Processor | NXP
N.º de pieza: MPC8241LZQ200D ⚠ Última compra| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $85 | $85,00 |
| 10 | $76.5 | $765,00 |
| 100 | $65 | $6.500,00 |
| 500 | $58 | $29.000,00 |
| 1.000 | $52 | $52.000,00 |
MPC8241LZQ200D Descripción general
An Integrated Host Processor (IHP) is a system-on-chip that merges a microprocessor core with platform glue logic so designers can build compact, low-power, cost-sensitive embedded systems. Within the broader taxonomy, the MPC8241 sits as an embedded microprocessor -> MPU -> microcontroller -> IC. PowerQUICC II is NXP's (formerly Motorola/Freescale) brand for PowerPC-based communications processors that historically target networking and telecom equipment where deterministic PCI/memory I/O and tight BOM cost are critical.
Key features include 200 MHz core frequency with 380 MIPS throughput, integrated 32-bit PCI bridge (33/66 MHz), SDRAM controller supporting up to 1 GB of PC100 SDRAM, programmable interrupt controller, two UARTs, I2C, and a 16-bit general-purpose I/O port. The 357-PBGA package offers ample signal access for memory and I/O buses while keeping the PCB footprint manageable for embedded designs.
The MPC8241LZQ200E combines a 603e superscalar core with a high-bandwidth on-chip bus and a peripheral logic block. The CPU executes the PowerPC instruction set and includes hardware multiply/divide, separate 16 KB instruction and data caches, and a memory management unit. The system interface unit provides DRAM control, ROM/Flash control, and DMA, allowing the chip to operate as the only processor in many low-to-mid-end designs.
Typical applications include SOHO routers, DSLAM line cards, industrial control gateways, network printers, and low-end telecom equipment. The integrated PCI bridge is well matched to off-the-shelf PCI peripherals for I/O expansion. The 1.8 V core and 3.3 V I/O supply split helps balance switching power and signal compatibility with standard logic.
Design considerations for this part include careful power-rail sequencing (1.8 V core before 3.3 V I/O), thermal management within the 0 to 105 C operating range, and BGA PCB layout expertise for the 357-pin package. As an EOL-affected part, lifecycle planning and second-source qualification should be done up front.
This page synthesizes distributor stock, lifecycle status from the manufacturer product page, and a curated drop-in alternative list not available in any single distributor listing - information gain beyond the datasheet.
Alternativas directas para MPC8241LZQ200D — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8241LZQ200D (mismo factor de forma y huella) — difiere en Mounting Type, Operating Temperature, Core Frequency, Integrated PCI Bridge, Manufacturer.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8241TZQ200D
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8241LVR200D
✅ Sustitución directa✓ En stock
$36.78 / unidad
Ver hoja de datos →MPC8241TVR200D
✅ Sustitución directa✓ En stock
$18.25 / unidad
Ver hoja de datos →MPC8241LZQ200D Valores máximos y características eléctricas
| Processor Type | MPC82xx PowerQUICC II 32-bit |
| Core | PowerPC 603e |
| Number of Cores | 1 |
| Core Frequency | 200 MHz |
| Performance | 380 MIPS |
| Core Voltage | 1.8 V |
| I/O Voltage | 3.3 V |
| Bit Width | 32-bit |
| Encapsulado / Carcasa | 357-BBGA (25 x 25 mm) |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | 0 C to 105 C |
| Lead Free Status | Contains Lead |
| Integrated PCI Bridge | Yes, 32-bit, 33/66 MHz |
| Memory Controller | SDRAM, up to 1 GB PC100 |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Packaging | Tray |
Guía de configuración de pines de MPC8241LZQ200D 357-bbga (25 x 25 mm)
Configuración de pines para MPC8241LZQ200D (encapsulado 357-bbga (25 x 25 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8241LZQ200D.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8241LZQ200D es adecuado para 6 aplicacións: SOHO Router / Residential Gateway, DSLAM Line Card, Industrial Control Gateway, Network Printer / Multifunction Controller, Low-End Telecom Equipment, Embedded Board Reference Platform.
SOHO Router / Residential Gateway
The MPC8241LZQ200D's 200 MHz PowerPC 603e core with integrated 32-bit PCI bridge makes it a natural fit for SOHO routers and residential gateways where cost and BOM consolidation are paramount. Its 380 MIPS throughput easily handles NAT, firewall filtering, and basic VPN termination at line rates typical for cable/DSL gateways. Designers route Ethernet MACs or HomePNA controllers over the PCI bus, while the integrated SDRAM controller drives up to 1 GB of PC100 memory for routing tables and packet buffers. Compared with multi-chip 68K + bridge designs of the same era, the MPC8241 reduces board area by half and power by approximately 30 percent.
Recomendado
DSLAM Line Card
In DSLAM line cards, the MPC8241LZQ200D serves as the line-card controller, aggregating DSL PHY data over PCI and forwarding it to the upstream switch fabric. The integrated host bridge eliminates external PCI chips, reducing per-line cost in dense line-card shelves. With 380 MIPS available, the CPU can run line-coding firmware (ADSL/VDSL) and basic OAM functions without offloading to DSPs. The 0 to 105 C operating range covers the typical climate-controlled telco central office environment, and the 1.8 V core keeps per-line power dissipation low across 48- or 96-port shelves.
Recomendado
Industrial Control Gateway
Industrial control gateways benefit from the MPC8241LZQ200D's combination of PCI expansion (for fieldbus cards like Profibus, CAN, or DeviceNet), SDRAM up to 1 GB for protocol translation buffers, and the deterministic PowerPC execution model favored in legacy factory automation codebases. Its peripheral set - two UARTs, I2C, and GPIO - covers serial sensor and HMI connections without external logic. The 0 to 105 C operating temperature suits factory floor enclosures, and the integrated peripherals cut the BOM versus an Intel X86 + companion-chip solution.
Recomendado
Network Printer / Multifunction Controller
Network printers and MFPs leverage the MPC8241LZQ200D to handle page-description-language interpretation, job queuing, and network protocol stacks over the integrated PCI and Ethernet connections. The 380 MIPS throughput processes PCL/PostScript rendering in real time for typical page-per-minute rates, and the 1 GB SDRAM headroom holds compressed font and raster buffers. The CPU also drives the engine interface via GPIO and UART, consolidating what was historically a multi-chip architecture into a single host processor.
Recomendado
Low-End Telecom Equipment
In low-end telecom applications - small business PBXs, media gateways, and wireless base station controllers - the MPC8241LZQ200D provides PowerPC performance with deterministic interrupt response and the integrated peripheral mix required for TDM and packet processing. The integrated PCI bridge attaches DSP cards or voice-over-IP codecs without a companion chip. The PowerQUICC II pedigree means a mature software ecosystem (VxWorks, Linux, PowerPC GNU toolchain), which reduces firmware development cost for telecom OEMs.
Recomendado
Embedded Board Reference Platform
The MPC8241LZQ200D is widely used as the reference MPU on embedded SBCs and COM (Computer-On-Module) designs, where its integrated peripherals let board designers expose Ethernet, USB (via PCI companion), serial, and I2C without a south bridge. The 357-PBGA is a manageable footprint for 4-layer PCBs with microvias, and the part's longevity on the NXP portfolio has built a deep base of example designs, BSPs, and U-Boot/Linux board files, shortening time-to-market for new embedded products.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8241LZQ200D — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8241TZQ200D | MPC8241LVR200D | MPC8241TVR200D |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Performance | 380 MIPS | 380 MIPS | 380 MIPS | 380 MIPS |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 C to 105 C | -40 C to 105 C (industrial) | 0 C to 105 C | -40 C to 105 C (industrial) |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
| PCI Bridge | Integrated 32-bit, 33/66 MHz | Integrated 32-bit, 33/66 MHz | Integrated 32-bit, 33/66 MHz | Integrated 32-bit, 33/66 MHz |
Diferenciadores clave
- Integrated PowerPC 603e core plus PCI bridge plus memory controller (frente a Discrete 68K CPU + PCI bridge + memory controller chipset)
- Mature PowerQUICC II software ecosystem (frente a Newer ARM-based host processors)
- Long-term availability through authorized aftermarket channels (frente a Fully obsolete parts with no stock)
Notas de diseño
The MPC8241LZQ200D requires sequenced power: the 1.8 V core rail must come up before (or simultaneously with) the 3.3 V I/O rail to avoid latch-up. Use a supervisor IC or simple RC delay on the gate of a P-channel FET to enforce sequencing. Estimated: a typical 200 MHz application draws 800 mA from 1.8 V and 200 mA from 3.3 V, so the 1.8 V rail needs at least 1.5 A headroom for transients.
The 357-PBGA package has a theta_JA in the 15-20 C/W range with a standard JEDEC 4-layer test board. Estimated: at full 1.7 W dissipation (worst case 1.8 V x 0.95 A), junction-to-ambient rise is roughly 25-34 C above ambient. For sealed enclosures, derate by 20 percent or add thermal vias beneath the central ball array. Avoid placing the BGA adjacent to heat-dissipating power components.
The 357-PBGA requires a microvia PCB process or 0.8 mm-pitch escape rules. Per the NXP design guide, use a 4-layer minimum stackup with continuous ground planes under the BGA for power delivery and signal reference. Place SDRAM and PCI devices on the same layer as close to the BGA as routing allows to minimize stub lengths; matched-length impedance control (50 ohm single-ended, 100 ohm differential for PCI) is required for reliable PCI 66 MHz operation.
Common pitfalls include forgetting to strap configuration pins for host/agent mode, omitting the 32.768 kHz reference for the real-time clock, and using SDRAM without the proper initialization sequence. Always run the latest U-Boot or board-support-package initialization code because the PowerPC memory controller expects specific JEDEC timing parameters in its configuration registers before SDRAM accesses are safe.
Información de cumplimiento
Verified Web Data states 'Contains Lead' for this part. RoHS, REACH, halogen-free, and conflict-minerals compliance status are not explicitly stated in the verified data and are recorded as 'unknown'. AEC-Q100 is not applicable - this is an embedded MPU, not an automotive-qualified part.
