MPC8308CZQAGDA - PowerQUICC II Pro SoC 400MHz | NXP Semiconductors
N.º de pieza: MPC8308CZQAGDA ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.8 | $3.180,00 |
| 500 | $28.4 | $14.200,00 |
| 1.000 | $25.6 | $25.600,00 |
MPC8308CZQAGDA Descripción general
A PowerQUICC II Pro SoC belongs to the family of communications processors that combine a high-performance Power Architecture core with integrated peripheral controllers. Within the broader taxonomy, the MPC8308 sits inside the PowerQUICC family, then communications processors, then microprocessors (MPU), then integrated circuits (IC). Its integrated DDR2 controller eliminates the need for an external memory controller chip, reducing board area and BOM cost in cost-sensitive designs.
Key differentiating features include the on-chip security engine, dual Gigabit Ethernet MACs with integrated PHYs, and hardware acceleration for common networking tasks. The processor supports a wide operating temperature range of -40C to +105C, making it suitable for industrial environments. Compared with the MPC8308CZQAGD (Rev 1.0), the 'A' suffix (Rev 1.1) typically denotes an updated revision with errata fixes and minor functional refinements per Freescale/NXP documentation practice.
Architecturally, the e300c3 core implements the Power Architecture Book E instruction set with a 16 KB L1 instruction cache and 16 KB L1 data cache. The system interface unit (SIU) glues DDR2, local bus, and PCI Express controllers to the core, while the communication-specific peripherals are managed through dedicated DMA engines that offload protocol processing from the CPU.
Typical applications include smart grid home energy gateways, data concentrators, wireless LAN access points, wireless femto base stations, consumer printers, and industrial control/automation systems. The integrated Gigabit Ethernet and PCI Express interfaces are particularly valuable in networked embedded designs where BOM cost must be minimized.
When designing with this part, ensure the PCB footprint matches the 473-pin MAP-BGA land pattern with proper via-in-pad or dog-bone fanout. Decoupling must include bulk capacitors near the core and DDR2 supplies, and DDR2 signal routing must follow the fly-by termination recommended in the hardware specification. Note that this part is marked End-of-Life (EOL) on the NXP product page; designers should evaluate the latest PowerQUICC successors or equivalent NXP layerscape devices for new designs.
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes (BGA fanout, DDR2 layout, thermal considerations) not consolidated in the manufacturer datasheet, alongside a parameter comparison against MPC8308 family drop-in variants.
Alternativas directas para MPC8308CZQAGDA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8308CZQAGDA (mismo factor de forma y huella) — difiere en Memory Controller, RoHS Status, Operating Temperature Range, Package, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8308CZQAGD
✅ Sustitución directa✓ En stock
$18.1 / unidad
Ver hoja de datos →MPC8308VMAGDA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8308VMAGD
✅ Sustitución directa✓ En stock
$25.6 / unidad
Ver hoja de datos →MPC8308CZQADD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8308CZQAFF
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8308CZQAGDA Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors |
| Series | PowerQUICC II Pro |
| Core Processor | PowerPC e300c3 |
| Number of Cores | 1 |
| Core Architecture | 32-Bit Power Architecture |
| Maximum CPU Frequency | 400 MHz |
| Encapsulado / Carcasa | 473-MAPBGA (19x19 mm) |
| Tipo de montaje | Surface Mount |
| Rango de temperatura de funcionamiento | -40C to +105C |
| Memory Controller | DDR2 (integrated) |
| Integrated Ethernet | Dual Gigabit Ethernet MACs |
| PCI Express Support | Yes (integrated) |
| USB Support | USB 2.0 (integrated) |
| Part Status | End of Life (EOL) |
| Estado RoHS | Compliant |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
Guía de configuración de pines de MPC8308CZQAGDA 473-mapbga (19x19 mm)
Configuración de pines para MPC8308CZQAGDA (encapsulado 473-mapbga (19x19 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8308CZQAGDA.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8308CZQAGDA es adecuado para 6 aplicacións: Smart Grid Home Energy Gateway, Wireless LAN Access Point, Industrial Control / Factory Automation, Wireless Femto Base Station, Consumer Printer Controller, Data Concentrator / Aggregation Node.
Smart Grid Home Energy Gateway
The MPC8308CZQAGDA fits smart grid home energy gateways because its dual Gigabit Ethernet MACs support simultaneous WAN (cloud link) and LAN (HAN) connectivity, while the integrated DDR2 controller and USB 2.0 host enable local HMI and metrology interfaces. Operating at 400 MHz, the e300c3 core runs gateway protocol stacks (DLMS/COSEM, ZigBee IP, Wi-SUN) without external accelerator silicon. Placed as the central SoC on the gateway main board, it eliminates the need for separate PHY and bridge chips. Trade-off: as an EOL part, designers should also qualify a Layerscape successor (LS1021A) for next-generation gateway designs.
Recomendado
Wireless LAN Access Point
For wireless LAN access points, the MPC8308CZQAGDA provides the host processor capability to manage 802.11 MAC-layer associations, encryption (WPA2/WPA3), and QoS scheduling. Its PCI Express interface links directly to a Wi-Fi chipset, while Gigabit Ethernet provides the upstream wired backhaul. Operating at 400 MHz, the e300c3 core comfortably handles control-plane tasks without becoming the bottleneck (data-plane offload is delegated to the Wi-Fi chipset). Placed between the Ethernet PHY and the Wi-Fi module, the SoC consolidates networking, host CPU, and glue logic. Trade-off: throughput ceiling is bounded by CPU clock versus dedicated network processors.
Recomendado
Industrial Control / Factory Automation
The MPC8308CZQAGDA is well suited for industrial control and factory automation nodes because its extended -40C to +105C temperature range tolerates cabinet environments, while integrated Ethernet, USB, and local bus handle sensor aggregation and actuator control. The 400 MHz e300c3 core runs deterministic control loops (Linux PREEMPT_RT or MQX) and industrial protocols (Modbus/TCP, EtherCAT slave, PROFINET). Placed as the central controller on a DIN-rail or backplane module, it eliminates external bridge chips and reduces BOM. Trade-off: real-time Ethernet performance is bounded versus dedicated ASIC slaves.
Recomendado
Wireless Femto Base Station
For wireless femto base stations, the MPC8308CZQAGDA integrates the host processing needed for Layer 3 management, baseband coordination, and backhaul transport. Its Gigabit Ethernet MAC provides the IPsec/IPv6-capable backhaul link, while PCI Express and local bus connect to baseband DSPs and RF front-end controllers. At 400 MHz, the e300c3 handles small-cell MAC scheduling and SON (self-organizing network) functions. Placed on the baseband card with associated RF and DSP, it acts as the central SoC host. Trade-off: CPU frequency is modest versus newer Layerscape SoCs; suitable for femto (low user count) rather than pico/micro base stations.
Recomendado
Consumer Printer Controller
The MPC8308CZQAGDA fits consumer printer controllers because its DDR2 controller, USB 2.0, and Gigabit Ethernet enable a single-chip printer engine controller that handles rendering, networking (AirPrint, IPP), and USB host for walk-up printing. The 400 MHz e300c3 core can process print-job PDL (PCL, PostScript, GDI) without dedicated hardware accelerators. Placed on the formatter board, it consolidates the controller functionality that previously required a controller ASIC plus companion processor. Trade-off: lacks dedicated image-processing pipelines versus printer ASICs.
Recomendado
Data Concentrator / Aggregation Node
The MPC8308CZQAGDA suits data concentrator nodes in AMI (advanced metering infrastructure) and IoT aggregation networks because its dual Gigabit Ethernet enables daisy-chained or ring-topology deployments, while PCI Express and USB connect to downstream radios (RF mesh, PLC). The 400 MHz e300c3 core aggregates meter/bearer data, runs DLMS/COSEM or equivalent protocols, and forwards via upstream WAN. Placed as the central node SoC, it consolidates networking, protocol processing, and host control. Trade-off: encryption throughput at 400 MHz limits very high-density concentrators; for larger deployments consider Layerscape LS1024A.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8308CZQAGDA — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8308CZQAGD | MPC8308VMAGDA | MPC8308VMAGD | MPC8308CZQADD | MPC8308CZQAFF |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 473-MAPBGA (19x19) | 473-MAPBGA (19x19) - same | 473-MAPBGA (19x19) - same | 473-MAPBGA (19x19) - same | 473-MAPBGA (19x19) - same | 473-MAPBGA (19x19) - same |
| Core | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
| CPU Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Operating Temperature | -40C to +105C | -40C to +105C | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +105C | -40C to +105C |
| Silicon Revision | 1.1 | 1.0 | 1.1 | 1.0 | 1.0 | 1.1 |
| DDR2 Memory Controller | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) |
| Gigabit Ethernet | Dual MACs (integrated) | Dual MACs (integrated) | Dual MACs (integrated) | Dual MACs (integrated) | Dual MACs (integrated) | Dual MACs (integrated) |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
Diferenciadores clave
- Silicon revision 1.1 with errata fixes (frente a MPC8308CZQAGD)
- Extended industrial temperature range (frente a MPC8308VMAGDA)
- Integrated dual Gigabit Ethernet MACs (frente a MPC8306)
- On-chip DDR2 memory controller (frente a MPC8280 (PowerQUICC II))
Notas de diseño
The 473-pin MAP-BGA (19x19 mm) requires careful PCB land-pattern and fanout design. Use microvia-in-pad or dog-bone fanout with via pitch matching the BGA ball pitch (typically 1.0 mm). Maintain a continuous ground plane beneath the BGA to provide a low-impedance return path and thermal dissipation. Follow NXP hardware specification design guidelines for layer stackup: minimum 6-layer stack with dedicated ground and power planes is recommended for signal integrity on DDR2, PCI Express, and Gigabit Ethernet signals.
DDR2 signal routing must follow the fly-by topology recommended in the hardware specification. Place DDR2 termination resistors (Rtt) as close as possible to the memory devices and route differential clocks (DDR2 CK/CK#) with matched length (within 5 mils). Keep DDR2 signals on inner layers with reference to a solid ground plane to control impedance (target 50 ohm single-ended, 100 ohm differential). Maximum trace lengths and via counts must comply with the DDR2 timing budget documented in the electrical characteristics section.
Although the MPC8308CZQAGDA dissipates modest power at 400 MHz (typical core power approximately 1-2 W), the MAP-BGA package relies on PCB thermal vias beneath the die for heat removal. Place an array of thermal vias (typically 0.3 mm drill, 0.5 mm pitch) directly under the package's thermal pad/exposed die region. Connect these vias to internal ground planes for spreading heat. For -40C to +105C industrial operation, ensure the junction temperature stays below 125C by validating thermal performance with worst-case ambient and workload conditions in your enclosure.
Do not assume pin compatibility between the MPC8308 family and earlier MPC8306/MPC8307/MPC8309 devices - the BGA ball map and peripheral mix differ. The MPC8308CZQAGDA silicon revision 1.1 ('A' suffix) incorporates errata fixes over revision 1.0 (MPC8308CZQAGD); if your firmware was qualified against rev 1.0 errata, review the latest NXP errata document before substituting rev 1.1. Also note that as an EOL part, place orders ahead of design freeze and qualify a Layerscape successor in parallel.
The MPC8308CZQAGDA requires multiple supply rails (core, DDR2 I/O, Ethernet I/O, general I/O). Sequence the rails per the hardware specification to prevent latch-up: typically core voltage first, then DDR2 I/O, then peripheral I/O. Use a power management IC (such as the NXP MMPF0100 or equivalent) to generate and sequence the rails. Place decoupling capacitors (0.1 uF ceramic + bulk) as close as possible to each supply pin on the BGA, with high-frequency capacitors on the opposite side of the PCB for shortest return paths.
Información de cumplimiento
RoHS compliant per NXP product page. AEC-Q100 not applicable - this is an industrial communications processor, not an automotive-qualified IC. Lead-free MAP-BGA package per NXP product specifications. EOL status confirmed per NXP product page header (End of Life Overview / PCN attached).
