MPC8323CVRADDC - 266MHz PowerQUICC II Pro MPU | NXP
N.º de pieza: MPC8323CVRADDC ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.95 | $389,50 |
| 100 | $34.2 | $3.420,00 |
| 500 | $29.85 | $14.925,00 |
| 1.000 | $26.4 | $26.400,00 |
MPC8323CVRADDC Descripción general
A microprocessor (MPU) is a single-chip CPU integrating core, cache, memory controller and peripherals. The MPC8323 belongs to the broader PowerPC/e300 family of embedded processors, sitting under the PowerQUICC II Pro communications-processor sub-family and ultimately under NXP's MPC83xx networking MPU hierarchy. It is designed for router, switch and access-equipment designs that need deterministic wire-speed throughput.
Key features include a 266 MHz e300c2 core with 16 KB I-cache and 16 KB D-cache, a QUICC Engine supporting UTOPIA, two multi-channel HDLC controllers, USB 2.0 (FS/HS), PCI 2.3, two 10/100/1000 Mbps Ethernet MACs (GMII/RGMII/RTBI), and a DDR1/DDR2 SDRAM memory controller. Voltage rails are 1.0 V core, 1.8 V/2.5 V DDR, and 3.3 V I/O. Industrial temperature range is -40C to +105C with the CV (commercial/industrial) suffix.
The architecture integrates the QE for protocol offload alongside the e300c2 core so that packet processing and routing/OS tasks run in parallel. The 90 nm process, on-chip DMA and dedicated peripheral bridges let designers replace discrete communications ASICs with a single SoC, reducing BOM and PCB area.
Typical applications include SOHO routers, xDSL/cable gateways, integrated access devices, multi-protocol control plane cards, and industrial serial-protocol converters. Pair the MPC8323CVRADDC with a PHY (e.g., Marvell Alaska), DDR2 SDRAM, and a NAND/NOR flash boot source for a complete BOM.
When designing, allocate sufficient decoupling on all voltage rails (1.0 V, 1.8 V, 2.5 V, 3.3 V), follow NXP's PBGA thermal layout, and validate DDR2 IBIS models. JTAG boundary-scan is supported for board test.
This page synthesizes distributor stock, 516-PBGA drop-in alternatives and design considerations beyond the manufacturer datasheet to help engineers shorten sourcing and qualification cycles.
Alternativas directas para MPC8323CVRADDC — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8323CVRADDC (mismo factor de forma y huella) — difiere en Memory Controller, Mounting Type, Package, Ethernet, USB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8323EZQADDC
✅ Sustitución directa✓ En stock
$14.06 / unidad
Ver hoja de datos →MPC8323ECVRADDC
✅ Sustitución directa✓ En stock
$62.4 / unidad
Ver hoja de datos →MPC8323CVRADHG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8323EZQADDCA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8313EVRADDC
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8321CZQADDC
✅ Sustitución directa✓ En stock
$25.9 / unidad
Ver hoja de datos →MPC8323CVRADDC Valores máximos y características eléctricas
| Core Architecture | PowerPC e300c2 |
| Core Frequency | 266 MHz |
| Core Count | 1 |
| Bit Width | 32-bit |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Communications Engine | QUICC Engine (QE) |
| Ethernet | 2x 10/100/1000 Mbps MAC (GMII/RGMII/RTBI) |
| USB | USB 2.0 (Full/High Speed) |
| PCI | PCI 2.3 |
| Memory Controller | DDR1/DDR2 SDRAM |
| Core Voltage | 1.0 V |
| DDR I/O Voltage | 1.8 V / 2.5 V |
| I/O Voltage | 3.3 V |
| Temperatura de funcionamiento | -40C to +105C |
| Process Technology | 90 nm CMOS |
| Encapsulado | 516-PBGA (27x27 mm) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Lead Free Status | Lead Free |
Guía de configuración de pines de MPC8323CVRADDC 516-pbga (27x27 mm)
Configuración de pines para MPC8323CVRADDC (encapsulado 516-pbga (27x27 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8323CVRADDC.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8323CVRADDC es adecuado para 7 aplicacións: SOHO Router / SMB Gateway, xDSL / Cable Modem Gateway (IAD), Industrial Multi-Protocol Serial Controller, Network Attached Storage (NAS) Controller, Wireless Backhaul / Microwave Link SoC, VoIP / IP-PBX Control Plane Processor, Industrial IoT Gateway / Edge Controller.
SOHO Router / SMB Gateway
The MPC8323CVRADDC's QUICC Engine (QE) accelerates PPPoE, PPPoA and multi-channel HDLC termination at line rate, while two integrated 10/100/1000 MACs deliver wire-speed NAT, QoS and firewall throughput for SOHO/SMB router designs. The 266 MHz e300c2 core runs the routing stack and management UI; the DDR2 controller supports the route-table and NAT-connection memory. Industrial temperature -40C to +105C makes the part suitable for outdoor CPE and harsh-environment small-office gateways without additional qualification.
Recomendado
xDSL / Cable Modem Gateway (IAD)
In xDSL/cable gateway and Integrated Access Device (IAD) designs, the MPC8323CVRADDC terminates WAN protocols via the QE while its USB 2.0 high-speed port drives Wi-Fi companion chipsets. The processor's DDR2 controller handles VoIP RTP buffers and the routing table, and PCI 2.3 supports legacy mini-PCI Wi-Fi modules. Power consumption fits in fanless SOHO enclosures. The non-E variant is preferred when no on-chip SEC is required, lowering BOM cost in mass-market residential gateways.
Recomendado
Industrial Multi-Protocol Serial Controller
The QE's per-channel DMA enables the MPC8323CVRADDC to terminate dozens of HDLC, UART, transparent and BISYNC channels in parallel for industrial multi-protocol controllers and protocol converters. The -40C to +105C operating range and 27x27 mm 516-PBGE package support factory-floor deployment. Linux/RTOS BSPs from the Freescale/NXP PowerQUICC ecosystem provide ready-made serial stacks for IEC 60870, DNP3 and MODBUS gateway applications.
Recomendado
Network Attached Storage (NAS) Controller
For low-to-mid capacity NAS controllers, the MPC8323CVRADDC's GbE MAC and DDR2 controller deliver gigabit wire-speed SMB/NFS throughput, and PCI 2.3 supports SATA/PATA host-bus adapters. The 266 MHz e300c2 runs lightweight Linux NAS stacks (OpenWrt/NAS-head distributions). Drop-in compatibility with the MPC8323E (SEC 2.0) supports optional hardware-accelerated SMB3 encryption without re-spinning the PCB.
Recomendado
Wireless Backhaul / Microwave Link SoC
In licensed/unlicensed microwave backhaul units, the MPC8323CVRADDC's QE handles TDM/E1 backhaul traffic while GbE MACs carry packet traffic, all bridged through the e300c2. The 90 nm CMOS process and industrial temperature range suit outdoor-unit deployments. NXP reference designs for similar wireless backhaul SoCs are adaptable to this part with the standard Linux BSP and U-Boot boot loader.
Recomendado
VoIP / IP-PBX Control Plane Processor
The MPC8323CVRADDC's dual GbE MACs segment voice and data VLANs, the QE handles TDM/E1 PSTN trunks, and the e300c2 runs Asterisk/VoIP stacks for small IP-PBX systems. DDR2 memory provides RTP jitter and conference-bridge buffers; PCI 2.3 supports hardware echo-cancel / transcoding cards. The non-E variant avoids crypto licensing for VoIP designs that don't require IPsec/SRTP acceleration on-chip.
Recomendado
Industrial IoT Gateway / Edge Controller
Industrial IoT gateways and edge controllers use the MPC8323CVRADDC's QE for legacy serial fieldbus aggregation (Modbus RTU, DNP3, IEC 60870), GbE for northbound IP connectivity, and USB 2.0 for cellular/Wi-Fi modems. The -40C to +105C industrial temperature range and lead-free 516-PBGA package support DIN-rail mounted edge nodes in factories, substations and outdoor installations running Linux with long-term support kernels.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8323CVRADDC — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8323EZQADDC | MPC8323ECVRADDC | MPC8323CVRADHG | MPC8323EZQADDCA | MPC8313EVRADDC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27 mm) | 516-PBGA - same | 516-PBGA - same | 516-PBGA - same | 516-PBGA - same | 516-PBGA - same |
| Core Clock Speed | 266 MHz | 266 MHz | 266 MHz | 400 MHz (+50%) | 266 MHz | 266 MHz |
| Core Architecture | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c2 | PowerPC e300c3 |
| Security Engine (SEC 2.0) | No | Yes | Yes | No | Yes | Yes |
| QUICC Engine (QE) | Yes | Yes | Yes | Yes | Yes | No |
| Gigabit Ethernet MACs | 2 | 2 | 2 | 2 | 2 | 1 |
| Operating Temperature | -40C to +105C | 0C to +105C (ZQ suffix) | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Process Node | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 130 nm |
Diferenciadores clave
- QUICC Engine without SEC 2.0 - lower cost for non-crypto designs (frente a MPC8323EZQADDC)
- Industrial temperature grade in standard 516-PBGA (frente a MPC8323EZQADDC)
- Dual GbE + DDR2 in 27x27 mm 516-PBGA (frente a MPC8313EVRADDC)
Notas de diseño
The MPC8323CVRADDC requires four independent voltage rails: 1.0 V core (VCORE), 1.8 V or 2.5 V DDR I/O (VDDR), 3.3 V I/O (VCC33), and 1.5 V/1.8 V for DDR termination. Per NXP datasheet recommendations, use a sequencer (such as NUP4201) to enforce core-before-I/O power-up; failure to sequence can trigger latch-up. Estimated worst-case power is ~3.5 W at 266 MHz core with GbE + QE active; allocate a 4 W budget with 1 square inch copper pour under the 516-PBGA exposed pad.
The 27x27 mm 516-PBGA package depends on the PCB top/bottom copper pour for heat dissipation. With theta-JA around 15-20 C/W on a JEDEC 4-layer test board (NXP datasheet thermal section), and ~3.5 W dissipation, junction temperature rises ~70-100 C above ambient. For industrial temperature grade (-40C to +105C) with Tj max 125C, keep ambient < 50C in enclosed enclosures or de-rate clock. Always validate with a thermal camera in prototype builds.
Place the DDR2 SDRAM as close to the MPC8323CVRADDC's DDR address/data/control balls as possible; trace length matching per NXP's MPC8323E Design Checklist (within 25 mils for byte lanes, 50 mils address-to-clock). Use 100 ohm differential impedance for RGMII and reference the NXP Hardware Specifications manual section 'DDR SDRAM Layout Guidelines' for via-in-pad and microstrip/stripline rules.
Keep the 25 MHz system reference clock trace short and guarded; the MPC8371's PCIe reference clock is not applicable here but the 266 MHz core clock and GbE RGMII clocks are EMI-sensitive. Place the QUICC Engine serial TDM traces (UTOPIA, HDLC) away from GbE and DDR traces to minimize crosstalk. The JTAG TAP signals (TCK/TDI/TDO/TMS/TRST) require 4.7 kohm pull-ups on TMS and TRST per IEEE 1149.1.
Do not apply release when confusing the BitMask header. Avoid confusing the MPC8323 (PowerQUICC II Pro, e300c2 core, 90 nm) with the MPC8360 (PowerQUICC II Pro, e300c3, different peripheral mix) or the MPC8313E (single GbE, no QE). The 'CVRADDDC' suffix encodes: CV = industrial temperature, R = tape and reel, ADD = 266 MHz, D = revision D, C = Pb-free. Always order double-throw NXP part numbers from authorized channels to avoid counterfeits.
Información de cumplimiento
RoHS compliant per NXP product page. Lead Free (Pb-free). Industrial temperature grade -40C to +105C. Halogen-free status not explicitly stated in verified web data - marked unknown. Not qualified to AEC-Q100 (telecom/industrial MPU, not automotive).