MPC8536CVTAKG - PowerQUICC III 600MHz e500 MPU | NXP
N.º de pieza: MPC8536CVTAKG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $159.97 | $159,97 |
| 10 | $152 | $1.520,00 |
| 100 | $144.1 | $14.410,00 |
| 500 | $138.5 | $69.250,00 |
| 1.000 | $132 | $132.000,00 |
MPC8536CVTAKG Descripción general
A microprocessor (MPU) such as the MPC8536 is a programmable integrated processor that executes software instructions, manages system control logic, and orchestrates peripheral devices. It sits at the top of the embedded computing hierarchy, above microcontrollers (MCUs) in software complexity and performance, and is commonly used in networking, telecom, and industrial control platforms. PowerQUICC III devices like the MPC8536 specifically target communications infrastructure by integrating flexible peripheral interfaces, multi-protocol support, and deterministic interrupt handling required by carrier-grade systems.
Key features of the MPC8536CVTAKG include a single 32-bit PowerPC e500 core operating at 600 MHz, integrated L1 cache, dual DDR memory controllers supporting DDR2 memory, four Gigabit Ethernet controllers with hardware acceleration, multiple PCI Express interfaces, and a security engine. The 783-ball FC-PBGA package provides high-density I/O required by the device's peripheral set while supporting industrial-grade thermal operation.
The architecture combines the e500 core with a high-bandwidth system bus interconnecting L2 cache, DDR2 memory controller, and I/O peripherals. This design optimizes data throughput for packet processing while maintaining deterministic latency for control plane tasks, making the device suitable for simultaneous data and control workloads in industrial networking equipment.
Typical applications include industrial-grade network routers and switches, telecom base station controllers, factory automation gateways, industrial IoT edge controllers, and embedded server appliances. The combination of CPU performance, multi-protocol I/O, and industrial temperature qualification makes the MPC8536CVTAKG well-suited for harsh-environment networking and control applications.
When designing with this device, careful attention must be paid to power delivery sequencing for the multiple voltage rails, signal integrity on the high-speed DDR2 and Gigabit Ethernet interfaces, and thermal management of the FC-PBGA package. PCB layout should follow the manufacturer's reference design exactly for impedance-controlled interfaces, and decoupling must be sized per the application note guidance for PowerQUICC III devices.
This page synthesizes distributor pricing, drop-in family variants, and practical design notes not found in the manufacturer datasheet alone, providing engineering decision support beyond the raw device documentation.
Alternativas directas para MPC8536CVTAKG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8536CVJAULA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8536ECVTAKG
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8536EAVTAKG
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8536ECVJAULA
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8536EAVJAULA
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC8536CVTAKG Valores máximos y características eléctricas
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Series | MPC8536 (PowerQUICC III) |
| Core Architecture | PowerPC e500 |
| Number of Cores | 1 |
| Core Clock Speed | 600 MHz |
| Ancho del bus de datos | 32-bit |
| Encapsulado | 783-ball FC-PBGA (29x29 mm) |
| Tipo de montaje | Surface Mount |
| Temperature Grade | Industrial |
| Memory Controller | DDR2 SDRAM (dual controller per family datasheet) |
| Ethernet | Multiple Gigabit Ethernet interfaces per family datasheet |
| PCI Express | Multiple PCIe interfaces per family datasheet |
| Security Engine | Integrated (per family feature set) |
Guía de configuración de pines de MPC8536CVTAKG 783-ball fc-pbga (29x29 mm)
Configuración de pines para MPC8536CVTAKG (encapsulado 783-ball fc-pbga (29x29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8536CVTAKG.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8536CVTAKG es adecuado para 6 aplicacións: Industrial Network Router, Telecom Base Station Controller, Factory Automation Gateway, Industrial IoT Edge Controller, Embedded Server Appliance, Industrial Control Platform.
Industrial Network Router
The MPC8536CVTAKG fits industrial network router designs by combining a 600 MHz e500 core with integrated Gigabit Ethernet MACs and PCI Express expansion. Per the family datasheet, the dual DDR2 controllers deliver bandwidth sufficient for wire-speed routing at gigabit rates. Industrial temperature qualification per the CVTAKG suffix supports deployment in factory floors and outdoor cabinets. Linux BSP support from NXP simplifies routing stack integration.
Recomendado
Telecom Base Station Controller
In telecom base station controller applications, the MPC8536CVTAKG provides deterministic interrupt handling and multi-protocol peripheral support required by carrier-grade equipment. The e500 core at 600 MHz executes real-time control plane tasks, while integrated security acceleration offloads encryption workloads. The 783-ball FC-PBGA package supports the high signal count needed for multiple TDM and Ethernet interfaces typical of base station controller designs.
Recomendado
Factory Automation Gateway
The MPC8536CVTAKG suits factory automation networks as a gateway processor bridging fieldbus protocols with Ethernet backbones. The 600 MHz e500 core runs protocol translation software for Modbus, PROFINET, or EtherNet/IP stacks while industrial temperature rating per the CVTAKG suffix enables operation in uncontrolled factory environments. Multiple serial interfaces and GPIO banks support legacy fieldbus connections alongside the integrated Gigabit Ethernet ports.
Recomendado
Industrial IoT Edge Controller
For industrial IoT edge controllers, the MPC8536CVTAKG delivers sufficient compute for on-device analytics, protocol conversion, and secure cloud connectivity. The 600 MHz e500 core executes edge analytics workloads, while integrated security engines per the family specification handle TLS/IPsec termination. The industrial temperature grade and PowerQUICC III pedigree provide the long-term availability needed for industrial IoT product lifecycles spanning 10+ years.
Recomendado
Embedded Server Appliance
In embedded server appliance designs such as industrial NAS, print servers, or protocol-conversion gateways, the MPC8536CVTAKG provides the multi-protocol I/O set and memory bandwidth required. DDR2 support with the integrated memory controller supports adequate RAM for caching and buffering workloads. The e500 architecture's mature Linux ecosystem accelerates time-to-market for appliance software stacks including web management and storage subsystems.
Recomendado
Industrial Control Platform
The MPC8536CVTAKG serves industrial control platforms requiring deterministic control plane execution alongside high-bandwidth networking. The 600 MHz e500 core delivers predictable interrupt latency for control loops, while Gigabit Ethernet interfaces handle supervisory network traffic. Industrial temperature qualification per the CVTAKG suffix supports deployment in control cabinets and process plant environments. The PowerQUICC III architecture's long-term software support reduces platform maintenance risk.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8536CVTAKG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8536CVJAULA | MPC8536ECVTAKG | MPC8536EAVTAKG | MPC8536ECVJAULA | MPC8536EAVJAULA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-ball FC-PBGA (29x29 mm) | 783-ball FC-PBGA (29x29 mm) - same | 783-ball FC-PBGA (29x29 mm) - same | 783-ball FC-PBGA (29x29 mm) - same | 783-ball FC-PBGA (29x29 mm) - same | 783-ball FC-PBGA (29x29 mm) - same |
| Core Architecture | PowerPC e500 (32-bit) | PowerPC e500 (32-bit) - same | PowerPC e500 (32-bit) - same | PowerPC e500 (32-bit) - same | PowerPC e500 (32-bit) - same | PowerPC e500 (32-bit) - same |
| Core Clock Speed | 600 MHz | 600 MHz (per family) | 600 MHz (per family) | 600 MHz (per family) | 600 MHz (per family) | 600 MHz (per family) |
| Number of Cores | 1 | 1 | 1 | 1 | 1 | 1 |
| Security Engine | Integrated (per family) | Integrated (per family) | Integrated (per family) | Enhanced (per family feature) | Integrated (per family) | Enhanced (per family feature) |
Diferenciadores clave
- Industrial temperature grade with 600 MHz e500 core (frente a MPC8536CVJAULA)
- Production-grade silicon variant (frente a MPC8536ECVTAKG)
- Standard security engine configuration (frente a MPC8536EAVTAKG)
Notas de diseño
Estimated: The MPC8536CVTAKG requires multiple voltage rails (core, DDR I/O, standard I/O, Gigabit Ethernet PHY supply) per the MPC8536 hardware specifications document. Power sequencing must follow the order specified in the datasheet to prevent latch-up; typically core voltage rises before or simultaneously with I/O voltages. Use a multi-rail PMIC or discrete LDO/DCDC combination sized to handle the worst-case inrush current during power-up.
Estimated: The 783-ball FC-PBGA (29x29 mm) package requires a thermal via array directly beneath the die area to conduct heat to inner PCB copper layers or an optional heatsink. Per the family thermal model, theta_JA depends heavily on PCB layout; a 4-layer board with thermal vias typically achieves 8-12 C/W, while an 8-layer board with dedicated thermal planes can reach 4-6 C/W. Industrial temperature operation may require active cooling in enclosed, high-ambient installations.
High-speed DDR2, Gigabit Ethernet, and PCI Express interfaces require controlled impedance per the NXP hardware specifications document. Use 100-ohm differential routing for PCIe and Ethernet, and match DDR2 trace lengths within the tolerances specified (typically +/- 25 mils for byte lanes). Decoupling capacitors should be placed as close as possible to each power ball, with a mix of bulk, mid-frequency, and high-frequency ceramic capacitors to cover the full noise spectrum.
Common pitfalls when designing with the MPC8536CVTAKG include omitting the JTAG debugger header (needed for code development and boundary-scan testing), failing to provision for the required boot configuration resistors on the local bus, and under-sizing the DDR2 reference voltage (VREF) decoupling. Verify all configuration straps against the most recent NXP hardware specifications document, as default strap values have changed between silicon revisions within the same family.
Información de cumplimiento
Compliance status not present in the Verified Web Data snippet; verify RoHS/REACH status against the NXP product detail page or manufacturer's hardware specifications document before use in restricted-jurisdiction designs.