MPC870ZT66 - PowerQUICC 66MHz 32-Bit Comm. Processor | NXP
N.º de pieza: MPC870ZT66 ⚠ Última compraMPC870ZT66 Descripción general
A PowerQUICC processor is a member of the NXP/Freescale communications-processor family that integrates a Power Architecture CPU core with system peripherals tailored for telecom and networking. Within the broader taxonomy it sits between a general-purpose microprocessor (MPU) and a fully integrated SoC: it provides hardware acceleration for communications protocols and DMA engines without integrating application-specific accelerator blocks found in later QorIQ layers. The MPC870ZT66 belongs to the MPC8xx sub-family, the same generation that popularized CPM (Communications Processor Module) architectures in routers and WAN access equipment.
Key features of the MPC870ZT66 include 66 MHz CPU clock, on-chip dual-port RAM for high-speed data movement, dual 10/100 Mbps Ethernet controllers via the Fast Ethernet Controller (FEC) block, an HDLC/serial communications controller supporting multiple synchronous and asynchronous protocols, and a memory controller supporting DRAM, SRAM, ROM and Flash. The device includes PCMCIA support, I2C, SPI, and a flexible system integration unit with interrupt controllers and timers.
The architectural approach combines the simplicity of a single-issue 32-bit core with a peripheral-rich design, allowing the device to offload protocol processing from the CPU. The CPM offloads serial framing, HDLC handling and MAC-level Ethernet processing, leaving the core free to run control-plane or routing-table software. This split architecture was the defining innovation of the PowerQUICC family.
Typical applications include SOHO routers, integrated access devices (IADs), DSLAM line cards, frame-relay and HDLC multiplexers, industrial serial-protocol bridges, and legacy telecom backplane controllers. The wide range of serial interfaces also suits building automation and SCADA gateways where multiple legacy serial buses must be terminated.
Design consideration: the 256-ball PBGA package requires a 4-layer minimum PCB with controlled-impedance routing for the external memory bus. Designers should follow the Freescale hardware specification for power-plane decoupling and DDR-style memory termination.
This page synthesizes current distributor availability, replacement candidates and design notes that are not consolidated in the original manufacturer datasheet, providing a single reference for engineers evaluating the MPC870ZT66 for new designs or for sustaining legacy systems.
Alternativas directas para MPC870ZT66 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC870ZT66 (mismo factor de forma y huella) — difiere en Core Architecture, Operating Temperature, Process Technology.
MPC870ZT100
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC870CZT66
✅ Sustitución directa ⚠️ Especificaciones sin verificarConsulte el precio
Ver hoja de datos →MPC871ZT66
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC875ZT66
✅ Sustitución directa ⚠️ Especificaciones sin verificarConsulte el precio
Ver hoja de datos →MPC853TZT66A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC880ZT66
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
MPC870ZT66 Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Number | MPC870ZT66 |
| Family | PowerQUICC MPC8xx |
| Core Architecture | Power Architecture, 32-bit |
| CPU Core Count | 1 |
| Maximum CPU Clock | 66 MHz |
| Tensión de alimentación | 3.3 V |
| Temperatura de funcionamiento | 0 C to +95 C |
| Encapsulado | 256-PBGA (23x23 mm) |
| Tipo de montaje | Surface Mount |
| Tray Packaging | Tray (per FindIC description) |
| Process Technology | 0.18 um |
| On-chip Memory | Dual-port RAM (size not specified in data) |
| Ethernet Controllers | 10/100 Mbps Fast Ethernet (FEC) |
| Serial Interfaces | HDLC, PCMCIA, I2C, SPI |
| Memory Controller | DRAM, SRAM, ROM, Flash |
| Lifecycle | End of Life / Last Time Buy per NXP page |
Guía de configuración de pines de MPC870ZT66 256-pbga (23x23 mm)
Configuración de pines para MPC870ZT66 (encapsulado 256-pbga (23x23 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC870ZT66.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC870ZT66 es adecuado para 6 aplicacións: SOHO Router / Integrated Access Device, HDLC / Frame-Relay Multiplexer, Industrial Serial-Protocol Bridge, Wireless Base-Station Controller Card, DSLAM Line Card / Access Multiplexer, Legacy Print Server / Networked Imaging Controller.
SOHO Router / Integrated Access Device
The MPC870ZT66 fits SOHO router and IAD designs because its dual 10/100 Ethernet MACs and HDLC-capable CPM offload framing for DSL or cable WAN links while the 66 MHz Power Architecture core runs routing and management stacks. Power dissipation for the part at full CPM utilization is typically under 2 W, well within a sealed plastic enclosure. Placed alongside a small PHY and DSL/cable frontend, the design fits a 100x100 mm board. A trade-off versus newer QorIQ parts is the 66 MHz core, which limits NAT throughput versus gigabit designs.
Recomendado
HDLC / Frame-Relay Multiplexer
The MPC870ZT66's CPM supports multiple HDLC channels simultaneously, making it suitable for aggregating frame-relay and HDLC traffic over T1/E1 links. The 66 MHz core handles channelized control-plane tasks while the CPM handles bit-level framing without CPU intervention, freeing the core for SNMP and routing updates. With 3.3V I/O the part interfaces directly to standard T1/E1 framer ICs. Compared with a soft-modem implementation on a generic MPU, the integrated CPM reduces firmware complexity and latency.
Recomendado
Industrial Serial-Protocol Bridge
Industrial gateways that translate between legacy RS-232/RS-485 serial buses and Ethernet benefit from the MPC870ZT66's UART and Ethernet MAC combination. The 32-bit core runs the protocol-translation stack while the integrated UARTs and HDLC blocks handle field-bus framing at deterministic rates. Operating range of 0 to +95 C covers most indoor cabinet installations, and the 256-PBGA package supports conduction-cooled enclosures. The trade-off is the package size (23x23 mm) which is large by modern industrial MCU standards.
Recomendado
Wireless Base-Station Controller Card
The MPC870ZT66 historically powered 2G/3G base-station control cards where its Ethernet MACs connected to backhaul and the CPM managed E1/T1 links to the radio. The Power Architecture core runs the Layer-2 control stack while the CPM handles real-time Abis or Abis-like framing. Although newer base stations use QorIQ, the MPC870ZT66 remains in deployed infrastructure with lifecycle-extension programs. With 0.18 um CMOS the device offers predictable timing for synchronous serial protocols.
Recomendado
DSLAM Line Card / Access Multiplexer
DSLAM line cards require fast protocol framing and per-line aggregation, which the MPC870ZT66's HDLC channels and dual Ethernet MACs handle efficiently. The 66 MHz core processes per-subscriber control packets while the CPM terminates ATM or HDLC traffic. Power dissipation fits within a single-slot line-card thermal envelope. The PBGA footprint provides the package robustness needed for convection-cooled shelves.
Recomendado
Legacy Print Server / Networked Imaging Controller
Networked print servers and MFP controllers historically used the MPC870ZT66 to terminate Ethernet and drive image pipelines through memory-mapped parallel interfaces. The dual-port RAM and external memory controller support high-bandwidth DMA transfers required by image rendering. Operating temperature of 0 to +95 C suits office-equipment environments. Compared with newer ARM-based controllers, the MPC870 offers higher deterministic interrupt latency for synchronous paper-feed mechanisms.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC870ZT66 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC870ZT100 | MPC870CZT66 | MPC871ZT66 | MPC875ZT66 | MPC853TZT66A | MPC880ZT66 |
|---|---|---|---|---|---|---|---|
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| CPU Clock | 66 MHz | 100 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Core Architecture | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit | Power Architecture, 32-bit |
| Ethernet MACs | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 2 x 10/100 Mbps | 3 x 10/100 Mbps | 2 x 10/100 Mbps | 1 x 10/100 Mbps | 2 x 10/100 Mbps |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Family / Sub-series | MPC8xx (PowerQUICC I) | MPC8xx (PowerQUICC I) | MPC8xx (PowerQUICC I) | MPC8xx (PowerQUICC I) | MPC8xx (PowerQUICC I) | MPC8xx (PowerQUICC I) | MPC8xx (PowerQUICC I) |
Diferenciadores clave
- Pin-compatible upgrade path within the MPC870 family (frente a MPC870ZT100)
- Higher Ethernet port count for aggregation designs (frente a MPC871ZT66)
- Same-family reduced BOM option (frente a MPC853TZT66A)
Notas de diseño
The MPC870ZT66 PBGA package has a published theta-JA in the range of 20-25 C/W for a 4-layer JEDEC test board; at 1.5 W typical dissipation the junction temperature rise is approximately 30-38 C above ambient. Designers targeting +95 C upper ambient should keep dissipation below 1 W or attach a small thermal pad under the PBGA to spread heat into the inner ground plane. Estimated: dissipation figure derived from datasheet typical power tables; thermal resistance from PBGA package datasheet.
Route the external memory bus with controlled impedance (50 ohm single-ended, 100 ohm differential for clock) and match lengths within +/- 250 mil across the byte lanes. Place decoupling as 0.1 uF X7R capacitors within 100 mil of every VCC/VSS pair, plus bulk 10 uF tantalum or ceramic at the PBGA corners. The 256-ball PBGA requires a 1.0 mm or 1.27 mm pitch land pattern; verify against the Freescale hardware specification land-pattern recommendation.
Do not assume new-old-stock MPC870ZT66 parts are factory-fresh; verify date code and request lot traceability from distributors like Rochester Electronics or Flip Electronics. Because the part is in Last Time Buy, counterfeit risk is elevated - insist on manufacturer Certificate of Conformance. Also note that the JTAG boundary-scan chain must be terminated per the Freescale hardware spec or debug access will be unstable.
Información de cumplimiento
Compliance data not provided in the verified web data; defaults are 'unknown' per Data Authenticity Rule 1. The part is rated 0 to +95C (commercial grade), so AEC-Q100 automotive qualification is not applicable.