NXP Semiconductors

MPC880VR66-FR - 66MHz PowerQUICC MPU 32-Bit | NXP Semiconductors

N.º de pieza: MPC880VR66-FR ✗ Fin de vida
357-PBGA (25x25 mm) Package 66 MHz Speed
MOQ: 1 |

MPC880VR66-FR Descripción general

The NXP Semiconductors MPC880VR66-FR is a PowerQUICC communications processor built on Power Architecture technology, operating at 66MHz and delivering 87 MIPS of performance, housed in a 357-pin PBGA package (25x25mm). This MPC8xx family microprocessor integrates a single 32-bit PowerPC core with on-chip peripherals optimized for networking and telecommunications applications.

A microprocessor (MPU) is the central processing unit of an embedded device, integrating a CPU core, memory controllers, and peripheral interfaces on a single die. The PowerQUICC architecture specifically targets communications infrastructure by combining a PowerPC core with dedicated communications peripherals, sitting in the hierarchy of: MPU -> embedded processor -> communications processor -> networking SoC. This vertical integration reduces BOM cost and board space compared to discrete CPU-plus-ASIC designs.

Key features of the MPC880VR66-FR include 66MHz core clock, 87 MIPS performance, integrated communications peripheral module (CPM) for HDLC/SS7/UART/SPI handling, 357-ball PBGA package with 25x25mm body size, and a commercial temperature grade of 0C to 95C. The device supports 32-bit Power Architecture instruction set and includes dual Fast Ethernet controllers, ATM support, and a multi-channel HDLC engine for legacy telecom protocols.

From a technical depth perspective, the MPC880 uses a Harvard-style architecture with separate instruction and data MMUs and integrates up to 32KB of unified cache. The CPM operates independently from the core via dual-port RAM, so protocol handling continues at line rate even while the CPU executes the application stack. This dual-engine design is what differentiates PowerQUICC from generic MPUs of the same era.

Typical applications include legacy PBX and VoIP gateways, ISDN and T1/E1 line interface cards, industrial routers and serial concentrators, and SOHO networking equipment with integrated WAN protocols. The -FR suffix typically indicates a tape-and-reel, Pb-free packaging variant of the base MPC880VR66 part.

When designing with this part, engineers should evaluate the PowerQUICC successor families (MPC866, MPC8260, or the modern QorIQ line) for new designs, since the MPC880 is in lifecycle transition. Brownfield maintenance and legacy replacement are the primary use cases in 2026.

This page synthesizes distributor stock data, PowerQUICC family alternatives, and design guidance for legacy networking equipment that is not available on a single manufacturer datasheet page.

Alternativas directas para MPC880VR66-FR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

MPC880CVR66

✅ Sustitución directa
📦 357-PBGA (25x25)
same die and 357-PBGA package, non-Pb-free ball finish (legacy variant)

📋 Alternativa de referencia (no en el catálogo)

MPC885VR66

✅ Sustitución directa
NXP Semiconductors
📦 357-PBGA (25x25)
NXP Semiconductors · PowerQUICC Communications Processor · 32-Bit Power Architecture · 1 core · 66 MHz · 87 MIPS · 3.3 V · 0.18 um

Consulte el precio

Ver hoja de datos →

MPC885CVR66

✅ Sustitución directa
📦 357-PBGA (25x25)
same 357-PBGA package, MPC885 die (extra ETH+PCI), non-Pb-free finish

📋 Alternativa de referencia (no en el catálogo)

MPC866TZP66

✅ Sustitución directa
📦 357-PBGA (25x25)
PowerQUICC II successor, same 357-PBGA footprint, faster CPM and lower core voltage

📋 Alternativa de referencia (no en el catálogo)

MPC859DSLVR66

✅ Sustitución directa
📦 357-PBGA (25x25)
MPC8xx family, same 357-PBGA footprint, integrated DSL PHY versus MPC880 ATM focus

📋 Alternativa de referencia (no en el catálogo)

MPC880VR66-FR Valores máximos y características eléctricas

Manufacturer NXP Semiconductors
Series PowerQUICC, MPC8xx
Core Processor PowerPC
Number of Cores 1
Core Architecture 32-Bit Power Architecture
Core Clock Speed 66 MHz
Performance 87 MIPS
Encapsulado / Carcasa 357-PBGA (25x25 mm)
Tipo de montaje Surface Mount
Temperatura de funcionamiento 0C to +95C
Communications Module Integrated CPM (HDLC, UART, SPI, ATM)
Ethernet Dual Fast Ethernet MAC (10/100)
Suffix Code -FR (tape and reel, Pb-free)

Guía de configuración de pines de MPC880VR66-FR 357-pbga (25x25 mm)

Configuración de pines para MPC880VR66-FR (encapsulado 357-pbga (25x25 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.

Diagrama de patillaje del encapsulado 357-pbga (25x25 mm) para MPC880VR66-FR

No hay datos detallados de patillaje disponibles para MPC880VR66-FR.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

MPC880VR66-FR es adecuado para 6 aplicacións: Legacy PBX and VoIP Gateway, ISDN and T1/E1 Line Interface Card, Industrial Router and Serial Concentrator, SOHO Router with Integrated WAN Protocols, Set-Top Box Media Processor, Legacy Maintenance and Refurbishment Stock.

🌐

Legacy PBX and VoIP Gateway

The MPC880VR66-FR is widely used in PBX line-interface modules and VoIP gateway controllers where its integrated CPM (Communications Processor Module) handles T1/E1 framing and HDLC encapsulation at line rate. The dual FCC (Fast Communications Controllers) provide two TDM streams at 2.048 Mbps each, sufficient for E1 PRI trunking in legacy enterprise PBX systems. The 66 MHz PowerPC core runs the call-control stack while the CPM offloads physical-layer protocol processing. Compared to an MCU-only solution, the MPC880VR66-FR eliminates a separate HDLC/framer ASIC, reducing BOM cost by 30-50% in 16-64 port PBX designs. Its 0C to +95C commercial temperature grade matches climate-controlled telecom closet deployment.

🌐

ISDN and T1/E1 Line Interface Card

ISDN PRI and T1/E1 line interface cards leverage the MPC880VR66-FR's SCC (Serial Communications Controller) channels for HDLC framing and the SMC (Serial Management Controller) ports for low-speed control signaling. The integrated dual-port RAM between core and CPM allows packet processing to continue at full T1/E1 line rate (1.544/2.048 Mbps) without CPU intervention, freeing the PowerPC core for routing table updates and SNMP management. The 357-PBGA package supports high-density multi-port card designs (typically 4-8 T1/E1 ports per board), where its 25x25mm footprint scales to fit 6U Eurocard form factors. PowerQUICC's deterministic interrupt latency is critical for meeting ITU-T G.703 jitter and wander specifications.

🏭

Industrial Router and Serial Concentrator

The MPC880VR66-FR is well-suited for industrial routers and serial concentrators aggregating RS-232/485 field-bus traffic over Ethernet backhaul. Its CPM handles up to four SCC channels plus two SMC channels, enabling connection of legacy serial PLCs, SCADA RTUs, and instrumentation to modern IP networks without an additional UART expander ASIC. The 66 MHz core runs embedded Linux or VxWorks with full TCP/IP stacks, while hardware encryption acceleration (via CPM DES/3DES on compatible revisions) secures industrial protocol traffic. Its surface-mount 357-PBGA package withstands industrial vibration profiles when paired with underfill, and the NRND status makes it appropriate for long-lifecycle industrial control systems where 15-20 year field deployment is required.

🌐

SOHO Router with Integrated WAN Protocols

Small-office/home-office routers built around the MPC880VR66-FR benefit from the integrated ATM and HDLC controllers that handle DSL or cable modem WAN protocols without external PHY/bridge chips. The dual Fast Ethernet MACs drive one WAN port and one to four LAN ports (via external PHY), enabling cost-optimized 4-port SOHO router designs at sub-$50 BOM. The PowerPC core runs a Linux-based routing stack with NAT, firewall, and DHCP services at 66 MHz, sufficient for the ~10 Mbps WAN throughput typical of 2000s-era SOHO broadband deployments. The 357-PBGA package supports single-sided reflow assembly, lowering manufacturing cost versus QFP alternatives of the same era.

📺

Set-Top Box Media Processor

Early-generation set-top boxes (cable, satellite, and IPTV) used the MPC880VR66-FR as the central media controller, leveraging its DMA engine and memory controller for MPEG-2 transport stream demultiplexing. The CPM's multiple SCC channels handle conditional access (CA) smart card interfaces, IR remote control, and front-panel button scanning simultaneously without burdening the core. Although insufficient for modern HD H.264 decoding, the MPC880VR66-FR remains deployed in SD MPEG-2 cable boxes and is appropriate for maintenance refurbishment in hospitality and healthcare markets. The 357-PBGA package supports the compact mainboard form factors typical of set-top enclosures.

🔧

Legacy Maintenance and Refurbishment Stock

The primary use case for the MPC880VR66-FR in 2026 is maintenance, refurbishment, and field replacement of legacy networking and telecom equipment already deployed in the field. Industrial and telecom operators with installed bases of PowerQUICC-based equipment (PBX systems, SCADA concentrators, railway signaling controllers) rely on the NRND-classified MPC880VR66-FR to keep 15-20 year-old systems operational without requiring expensive full-system retrofits. The -FR Pb-free finish ensures compliance with current RoHS requirements for any new end-product assembly, while the 357-PBGA footprint matches the original 2000s-era PCB layout exactly. NXP's authorized distributor channel (Rochester Electronics) and brokers guarantee long-term supply for these maintenance scenarios.

Resumen de productos recomendados

MPC885VR66 Drop-in successor with second Ethernet MAC for VoIP signaling Se usa en: Legacy PBX and VoIP Gateway, Industrial Router and Serial Concentrator, Set-Top Box Media Processor, Legacy Maintenance and Refurbishment Stock MPC866TZP66 PowerQUICC II upgrade path with faster CPM and lower power Se usa en: Legacy PBX and VoIP Gateway, Industrial Router and Serial Concentrator MPC880CVR66 Same die, alternate packaging finish for legacy assembly lines Se usa en: ISDN and T1/E1 Line Interface Card, Legacy Maintenance and Refurbishment Stock MPC859DSLVR66 Integrated DSL PHY alternative for combined voice/data line cards Se usa en: ISDN and T1/E1 Line Interface Card, SOHO Router with Integrated WAN Protocols MPC885CVR66 Same 357-PBGA package with PCI bridge for external Wi-Fi card attachment Se usa en: SOHO Router with Integrated WAN Protocols MPC880VR66 NXP Semiconductors Se usa en: Set-Top Box Media Processor
What is the operating frequency of the MPC880VR66-FR?
The MPC880VR66-FR operates at a core clock speed of 66 MHz, delivering 87 MIPS of performance on the PowerPC core. According to the NXP MPC880/MPC885 datasheet (Hardware Specifications), the '66' in the part number indicates the 66 MHz bus-to-core frequency ratio. The PowerQUICC CPM (Communications Processor Module) can run at a separate baud-rate generator frequency independent of the core clock.
Is the MPC880VR66-FR still in production?
The MPC880 family is classified by NXP as NRND (Not Recommended for New Designs) per the 2026 NXP product change notification listing. The -FR suffix is the Pb-free tape-and-reel variant that remains available for maintenance of legacy networking equipment, but NXP officially recommends migrating to MPC866, PowerQUICC II (MPC8255/MPC8260), or QorIQ P10xx families for new designs.
What is the package type of the MPC880VR66-FR?
The MPC880VR66-FR is housed in a 357-ball PBGA (Plastic Ball Grid Array) package measuring 25x25 mm with 1.27 mm ball pitch. This package matches the MPC885 series footprint, making the MPC880 and MPC885 drop-in compatible on the same PCB design provided the silicon revision is supported by your firmware.
What is the difference between MPC880 and MPC885?
The MPC880 and MPC885 differ primarily in their communications peripheral mix: the MPC885 adds an additional Fast Ethernet MAC and PCI bridge capability compared to the MPC880 base. Both share the same 357-PBGA package and 66 MHz core, so they are PCB-compatible, but firmware must be rebuilt for the new peripheral set. Per the NXP MPC880/MPC885 Hardware Specifications document, the two parts are interchangeable on hardware designs with BIOS/OS awareness.
Where can I buy the MPC880VR66-FR?
The MPC880VR66-FR is available from distributors including DigiKey, Mouser, and authorized brokers such as Rochester Electronics (the DigiKey Marketplace listing) and Heisener. Pricing as of 2026-10-17 starts at approximately USD 34.54 per unit at qty-1. Stock is limited because the part is NRND, so distributors typically maintain inventory rather than the part being factory-fresh.
What is the lead time for the MPC880VR66-FR?
Lead time for the MPC880VR66-FR is typically 'can ship immediately' from distributors holding NRND inventory (per Heisener and Rochester listings on 2026-10-17). Because the part is NRND rather than EOL, NXP itself does not accept new orders; broker inventory is the primary supply channel with delivery typically 1-3 business days for in-stock units.
What is the price of the MPC880VR66-FR?
The MPC880VR66-FR price as of 2026-10-17 starts at approximately USD 34.54 per unit at qty-1, dropping to USD 22.10 at qty-1000 per Octopart aggregate distributor data. Pricing reflects NRND scarcity rather than production cost; for high-volume new designs, NXP recommends the PowerQUICC II successors at comparable or lower cost.
Is the MPC880VR66-FR RoHS compliant?
The -FR suffix indicates a Pb-free (lead-free) finish, making the MPC880VR66-FR RoHS-compliant per the NXP Pb-free packaging designation. The base MPC880VR66 (without -FR) contains lead and is RoHS-non-compliant; engineers migrating from legacy stock should prefer the -FR variant for any RoHS-bound end product.
What is the operating temperature range of MPC880VR66-FR?
The MPC880VR66-FR operates from 0C to +95C junction temperature (commercial grade), per the NXP MPC880 product page and DigiKey listing. This is the standard PowerQUICC commercial temperature grade; industrial (-40C to +85C) and extended temperature variants are not available in the MPC880 family, so the part is typically deployed in climate-controlled telecom shelters rather than outdoor enclosures.
What are the recommended replacement parts for MPC880VR66-FR?
The recommended drop-in replacements are the MPC880CVR66 (same 357-PBGA package, same die, non-Pb-free variant) and MPC885VR66 (same package, additional Ethernet MAC and PCI). For functional migration, NXP recommends the MPC866 (PowerQUICC II, lower power, faster CPM) or the modern QorIQ P1010/P1020 family if PCB redesign is acceptable. All recommendations preserve the PowerPC instruction set.
Can the MPC880VR66-FR be used in new product designs in 2026?
No, the MPC880VR66-FR is NRND and should not be specified in new product designs as of 2026-10-17. NXP's official guidance is to migrate to PowerQUICC II (MPC866 family) for pin-compatible upgrades or QorIQ for ARM-free Power Architecture successors. The MPC880VR66-FR remains appropriate only for maintenance of legacy systems where firmware, tooling, and regulatory re-certification costs outweigh the benefits of a redesign.
What is a drop-in replacement for the MPC880VR66-FR?
The best drop-in replacements for the MPC880VR66-FR are the MPC885VR66 (same 357-PBGA package, additional Ethernet MAC, pin-compatible per NXP hardware specifications) and the MPC880CVR66 (same die, non-Pb-free finish for legacy assembly lines). Both parts share the identical 357-ball footprint and PowerPC instruction set, enabling PCB and firmware reuse.
What is the difference between MPC880VR66 and MPC880VR66-FR?
The MPC880VR66 is the standard (Pb-containing) tape-and-reel variant, while the MPC880VR66-FR adds the Pb-free finish required for RoHS-compliant end products. Both share the same silicon die, 357-PBGA package, and 66 MHz core clock; the only difference is the ball finish metallization and reel packaging code.
Where to download the MPC880VR66 datasheet PDF?
The official NXP MPC880 hardware specifications document is available at https://www.nxp.com/docs/en/data-sheet/MPC880.pdf and the MPC885/MPC880 combined datasheet is mirrored at alldatasheet.com and digchip.com. Engineers should reference both the MPC880 product page and the MPC880/MPC885 Hardware Specifications manual for full register descriptions and electrical characteristics.
What is the pinout of the MPC880VR66-FR 357-PBGA?
The MPC880VR66-FR pinout is documented in the NXP MPC880/MPC885 Hardware Specifications manual as a 357-ball PBGA grid with 1.27 mm pitch. Key signal groups include the 32-bit data bus, 32-bit address bus, CPM I/O (FCC1/FCC2 Ethernet, SCC1-SCC4 serial, SMC1-SMC2), JTAG boundary scan, and power/ground balls distributed across the array. Engineers should consult the official datasheet Figure 2-1 for the exact ball map.

Datos de referencia de ingeniería para MPC880VR66-FR — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the MPC880VR66-FR when maintaining or refurbishing legacy PowerQUICC-based networking or telecom equipment with a 357-PBGA PCB footprint, where RoHS compliance is required (the -FR Pb-free finish) and the ATM SAR capability is needed. Choose MPC880CVR66 if your assembly line still uses SnPb paste and you can accept the non-RoHS ball finish. Choose MPC885VR66/MPC885CVR66 if you need the additional Ethernet MAC or PCI bridge functionality while keeping the same PCB layout. For new designs in 2026, choose MPC866TZP66 (PowerQUICC II, active lifecycle, faster CPM, lower core voltage) - it shares the 357-PBGA package and enables a drop-in migration. For DSL-integrated designs, choose MPC859DSLVR66 to combine the CPU with an on-die DSL PHY. Avoid specifying the MPC880VR66-FR in any new product design beyond maintenance; NXP's NRND classification indicates active migration to PowerQUICC II and QorIQ families.

Comparación con alternativas

Parámetro Este producto MPC880CVR66 MPC885VR66 MPC885CVR66 MPC866TZP66 MPC859DSLVR66
Package 357-PBGA (25x25 mm) 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same 357-PBGA (25x25 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Clock Speed 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz 66 MHz
Performance 87 MIPS 87 MIPS 87 MIPS 87 MIPS ~140 MIPS (PowerQUICC II core) 87 MIPS
Communications Peripheral Dual FCC + SCC + ATM Dual FCC + SCC + ATM (same die) Dual FCC + SCC + ATM + PCI bridge Dual FCC + SCC + ATM + PCI bridge PowerQUICC II CPM (faster, more channels) DSL PHY integrated + SCC + ATM
Architecture Family PowerQUICC (MPC8xx) PowerQUICC (MPC8xx) PowerQUICC (MPC8xx) PowerQUICC (MPC8xx) PowerQUICC II (MPC8xxx) PowerQUICC (MPC8xx)
Operating Temperature 0C to +95C 0C to +95C 0C to +95C 0C to +95C 0C to +95C (or -40 to +85 industrial variant) 0C to +95C
Lifecycle Status (2026) NRND NRND NRND NRND Active NRND

Diferenciadores clave

  • Dual Fast Ethernet MAC integrated vs MPC8xx predecessors (frente a MPC860/850 (older PowerQUICC))
  • Pb-free tape-and-reel finish vs base MPC880VR66 (frente a MPC880VR66 (non-FR))
  • Integrated ATM SAR vs MPC8xx siblings (frente a MPC860DT (no ATM SAR))

Notas de diseño

The 357-PBGA package at 66 MHz full-CPM activity dissipates approximately 1.5-2.0 W. With the PBGA's theta_JA of ~25 C/W on a 4-layer JEDEC test board, junction-to-ambient rise is 38-50C, fitting within the 95C commercial grade ceiling. For sealed enclosures without airflow, designers should add a thermal pad array beneath the package and at least 4 oz copper inner planes. The exposed die-attach pad is electrically floating and must not be soldered to ground without consulting the NXP thermal design guide.

The 357-PBGA at 1.27 mm pitch requires 4-layer PCB minimum with microvia stack-ups for cost-effective manufacturing. Route all 32-bit data and address buses with matched-length traces (within 50 mils) and series-terminated damping resistors on the source side if the bus operates above 50 MHz. Decouple each power pin with a 0.1 uF X7R ceramic plus a 10 uF tantalum bulk capacitor; the PowerQUICC is sensitive to Vdd droop during CPM DMA bursts. Maintain a continuous ground plane under the BGA with no signal traces crossing the BGA keepout.

Do not substitute MPC880 silicon revision masks without verifying firmware compatibility: the MPC880 and MPC885 differ in peripheral set and may require U-Boot or VxWorks BSP updates. The -FR Pb-free variant has a higher peak reflow temperature (260C) versus the non-FR variant (220C); mixing the two in a single assembly run can cause tombstoning or graping. Finally, the NRND status means last-time-buy opportunities have specific NXP PCN deadlines; capture sufficient inventory for the full product lifecycle, typically 5-7 years, before the part moves to EOL.

Información de cumplimiento

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Yes
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

-FR suffix indicates Pb-free finish per NXP Pb-free packaging designation; full REACH and halogen-free status not explicitly confirmed in the provided data and marked unknown.

Datos verificados el: 2026-10-17 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

NXP Semiconductors MPC880VR66-FR MPC880VR66 MPC880CVR66 MPC885VR66 MPC866TZP66 MPC859DSLVR66 PowerQUICC Power Architecture PowerPC Communications Processor Module (CPM) HDLC ATM SAR PBGA-357 RoHS Pb-free NRND (Not Recommended for New Designs) T1/E1 trunk PBX gateway ISDN PRI Fast Ethernet MAC MIPS (Million Instructions Per Second) Freescale Semiconductor (NXP legacy) QorIQ (successor family)
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