MS87040 - 53.125Gb/s Quad PAM4 CDR with VCSEL Drivers
N.º de pieza: MS87040 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MS87040 Descripción general
A PAM4 CDR is a clock and data recovery circuit that reconstructs a high-speed serial data stream after losses, jitter, and noise have degraded the signal. In the optical-module hierarchy, a PAM4 CDR sits between the transceiver signal path and laser or photodiode circuitry. It supports four lanes at 26.5625 GBaud each, corresponding to 53.125 Gb/s per lane, making the MS87040 relevant to high-throughput 200G and 400G optical links when used in the chipset described by the verified source data.
Verified product information identifies four principal functional blocks. Each lane supports 26.5625 GBaud operation; adaptive input equalization is present; and the transmit side includes a quad VCSEL array driver. Bias current is adjustable up to 8 mA, and modulation current is adjustable up to 7.5 mA. A VCSEL burn-in mode uses a typical 12 mA setting according to the manufacturer product-page snippet. A global hardware output pad reports LOL and LOS status, while an I2C interface supports external microcontroller communication.
The analog CDR architecture is designed for low latency, and the device is compatible with 250-micrometer-pitch VCSEL arrays. These details place it in optical transceiver modules, parallel optical links, and SR4/SR8-oriented systems rather than general-purpose digital logic. The verified exhibition source describes the MS87040 as a chipset component for 200G SR4 and 400G SR8 applications and reports fast adaptation and start-up behavior.
A critical design consideration is that high-speed PAM4 links require controlled impedance, short differential paths, compliant optical-device layout, and verified power sequencing. The I2C control path and global LOL/LOS pad should be connected according to the complete module architecture. The available sources do not identify the package, pinout, supply voltage, power dissipation, temperature range, or detailed electrical limits, so those values must be confirmed with MiniSilicon before schematic capture or layout release.
This page distinguishes verified MS87040 capabilities from unavailable board-level parameters and records the absence of a confirmed drop-in replacement. It combines manufacturer information with chipset context while avoiding unsupported electrical assumptions. For sourcing, price, lifecycle, and mechanical decisions, request current manufacturer documentation and a commercial quotation for the exact package and ordering code.
Alternativas directas para MS87040 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
No hay alternativas directas disponibles para este producto.
Solicitar alternativasMS87040 Especificaciones
| Product Type | Quad PAM4 clock and data recovery IC with integrated VCSEL laser drivers |
| Channel Count | 4 channels |
| Per-Channel Data Rate | 53.125 Gb/s |
| Signaling Rate | 26.5625 GBaud |
| Modulation | PAM4 |
| VCSEL Array Compatibility | 250 um pitch |
| VCSEL Bias Current | Up to 8 mA |
| VCSEL Modulation Current | Up to 7.5 mA |
| VCSEL Burn-In Current | 12 mA typical |
| CDR Architecture | Low-latency analog CDR |
| Input Equalization | Adaptive input equalization |
| VCSEL Compensation | Proprietary VCSEL compensation |
| Status Monitoring | Global hardware output pad for LOL and LOS status |
| Control Interface | I2C digital interface |
| Power Consumption | Low power consumption; numerical value not provided in verified sources |
Guía de configuración de pines de MS87040 standard
Configuración de pines para MS87040 (encapsulado standard). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para MS87040.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MS87040 es adecuado para 6 aplicacións: 200G SR4 Parallel Optical Modules, 400G SR8 Optical Interconnect, 250-Micrometer-Pitch VCSEL Array Modules, Data-Center Optical Transceivers, Optical Module Manufacturing Test, Low-Power High-Speed Optical Interconnect.
200G SR4 Parallel Optical Modules
The MS87040 fits a 200G SR4 transmit architecture because it combines four 26.5625-GBaud PAM4 CDR lanes with an integrated four-channel VCSEL driver array. Each lane corresponds to 53.125 Gb/s, and the listed bias and modulation-current ranges reach 8 mA and 7.5 mA respectively. The device is compatible with 250-micrometer-pitch VCSEL arrays, which supports compact quad-emitter optical layouts. In the module, the CDR would recover the incoming high-speed lane data and provide conditioned drive signals to the VCSEL array. Adaptive input equalization and VCSEL compensation may help the transmit path accommodate channel and laser variation. Package, supply voltage, power consumption, thermal limits, and control-register details still require confirmation from MiniSilicon before layout release.
Recomendado
400G SR8 Optical Interconnect
The MS87040 is positioned in verified chipset material for 400G SR8 applications, where high aggregate throughput is assembled from multiple 53.125-Gb/s PAM4 lanes. Its four-channel analog CDR and integrated VCSEL-driver array reduce the number of separate high-speed recovery and laser-drive functions needed in a parallel optical transmitter. Adaptive input equalization is listed as a feature, while proprietary VCSEL compensation targets optical-drive behavior. The implementation still requires a complete system budget covering electrical loss, optical power, VCSEL reliability, BER, thermal rise, and startup time. The four lanes do not by themselves establish every 400G module variant's compliance.
Recomendado
250-Micrometer-Pitch VCSEL Array Modules
The MS87040 is specifically listed as compatible with 250-micrometer-pitch VCSEL arrays, making it relevant to compact parallel optical modules that use closely spaced emitters. Its quad VCSEL driver array can support independent channel drive functions, while the adjustable bias current up to 8 mA and modulation current up to 7.5 mA provide the stated control ranges for optical-device operation. The 12-mA-typical burn-in mode may be useful during manufacturing or aging screening. Exact channel mapping, VCSEL pinout, current-setting method, ESD strategy, and thermal constraints are not specified in the available sources and must be obtained from the manufacturer.
Recomendado
Data-Center Optical Transceivers
The MS87040 can be considered for data-center optical transceivers that need high-speed PAM4 lane recovery and integrated VCSEL drive. Four 53.125-Gb/s lanes provide a clear performance identity, while the I2C interface gives a module controller a path for configuration and monitoring. The global LOL/LOS output pad provides a hardware status indication that may assist link diagnostics or module management. Designers should confirm the complete register map, initialization requirements, latency, power rails, thermal performance, and package before selecting it for a production transceiver. The verified product material does not include a module certification or a completed BER test result.
Recomendado
Optical Module Manufacturing Test
The MS87040's listed VCSEL burn-in mode, rated at 12 mA typical, can support controlled manufacturing or screening workflows for an optical transmit array. The integrated driver and CDR provide a common functional block for exercising high-speed lane behavior during module assembly. The I2C interface may allow a tester or microcontroller to manage device configuration, while the global LOL/LOS pad provides a direct status signal. However, the supplied data does not define burn-in duration, temperature conditions, acceptance limits, test sequencing, or whether the mode applies simultaneously or per channel. These procedures must be validated with MiniSilicon rather than inferred from the current specification.
Recomendado
Low-Power High-Speed Optical Interconnect
The MS87040 is marketed with low power consumption and a low-latency analog CDR, making it relevant to optical links where power and recovery delay are important system constraints. Integrating four CDR lanes and four VCSEL drivers can reduce the number of separate high-speed blocks compared with a discrete implementation, although the actual benefit depends on the unavailable device power table and the surrounding module architecture. Adaptive input equalization and proprietary VCSEL compensation are listed as additional performance features. Before using the device in a compact system, verify supply rails, thermal dissipation, channel skew, startup behavior, and the complete datasheet timing specifications.
Recomendado
Datos de referencia de ingeniería para MS87040 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Notas de diseño
Treat every PAM4 lane as a controlled-impedance differential channel and keep CDR, driver, connector, and VCSEL routing as short as practical. The MS87040 supports 53.125 Gb/s per lane, so insertion loss, reflection, skew, crosstalk, and return-loss behavior must be evaluated together. The available data does not specify package pins or differential impedance, so obtain the controlled reference design and measurement limits before releasing a PCB layout.
Separate high-speed supply requirements into quiet analog/supply planes and noisy digital or driver sections where the manufacturer guidance permits. Do not infer the MS87040 supply voltage or current budget from its four-channel data rate. Validate startup sequencing, rail decoupling, VCSEL driver headroom, and power disturbance using the complete datasheet and application circuit; the verified sources identify low power consumption but provide no numerical power table.
The global LOL/LOS pad and I2C interface should be connected according to the verified manufacturer definitions, because polarity, voltage levels, timing, and register semantics are not included in the supplied data. Also verify the exact VCSEL array pinout and channel mapping before applying the listed 8 mA bias-current, 7.5 mA modulation-current, or 12-mA-typical burn-in capability.
Estimate optical-module thermal rise using the actual CDR, driver, VCSEL, and supply-loss data after obtaining manufacturer electrical tables. The stated low-power characteristic is not a numeric thermal guarantee. Check adjacent-channel heating, laser bias stability, solder-joint reliability, and the effect of the package's exposed thermal features if present; the supplied data does not identify the package or its thermal resistance.
Información de cumplimiento
The supplied manufacturer and search-result snippets do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Verify current compliance documents with MiniSilicon before procurement or deployment.