MSC8112TVT2400V - Dual-Core SC140 DSP, 300MHz, 431-FCBGA | NXP
N.º de pieza: MSC8112TVT2400V ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $262.2 | $2.622,00 |
| 100 | $239.4 | $23.940,00 |
| 500 | $216.6 | $108.300,00 |
| 1.000 | $199.5 | $199.500,00 |
MSC8112TVT2400V Descripción general
A digital signal processor (DSP) is a specialized microprocessor whose ISA, datapath, and on-chip memory hierarchy are optimized for numeric kernels such as FIR/IIR filters, FFTs, vocoders, and modem baseband processing. Within the system hierarchy, the MSC8112 sits at the multimedia/communication processing tier, above general-purpose microcontrollers and below application processors. Its SC140 VLIW-style core, deterministic interrupt model, and tightly coupled SRAM make it well suited to wireline and wireless baseband, voice/media gateways, and radar/sonar front-end preprocessing.
Key features that distinguish this device for high-channel-density designs include dual SC140 cores sharing a single die for sub-100 ns inter-core synchronization, a 3.30 V I/O ring paired with a 1.10 V internal core voltage, and rich external connectivity via Ethernet, I2C, TDM, and UART interfaces. The FC-BGA package offers an integrated thermal pathway that, combined with the -40 C to +105 C (TJ) operating window, supports fanless and convection-cooled enclosures in central-office and outdoor equipment.
The architecture combines a Harvard-style core pair with a unified M2 SRAM region, allowing deterministic access for both cores through the MQBus while preserving cache coherence for DMA-driven peripherals. The 300 MHz core clock and dual-core topology yield an aggregate throughput of 600 MIPS, enabling multi-channel voice transcoding or multi-antenna DSP pipelines on a single device.
Typical applications include voice-over-IP media gateways, multi-channel modems, 3G baseband preprocessing, radar/sonar beamforming, and industrial machine-vision preprocessing. The 3.3 V I/O ring simplifies glueless interface to common FPGAs and Ethernet PHYs.
When designing with this device, allocate adequate decoupling around the FC-BGA land pattern, keep M1/M2 trace lengths matched within each core group, and follow the manufacturer's thermal layout guidelines to maintain junction temperature within the 105 C maximum.
This page consolidates distributor pricing, lifecycle data, and practical design context for the MSC8112TVT2400V that are not aggregated on a single manufacturer datasheet page.
Alternativas directas para MSC8112TVT2400V — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
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MSC8112TMP2400V
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MSC8112TVT3000V
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MSC8112TVT2400V Especificaciones
| Core Architecture | StarCore SC140 (dual-core) |
| Number of Cores | 2 |
| Core Clock Rate | 300 MHz |
| Performance | 300 MIPS (per core); 600 MIPS aggregate |
| Ancho del bus de datos | 32-bit |
| On-Chip RAM | 448 Kbytes (224 Kbytes M1 per core) |
| Instruction Cache | 16 Kbyte, 16-way |
| Write Buffer | 4-entry |
| Non-Volatile Memory | External |
| Core Voltage | 1.10 V |
| I/O Voltage | 3.30 V |
| Temperatura de funcionamiento | -40 C to +105 C (TJ) |
| Encapsulado / Carcasa | 431-FCBGA (20 x 20 mm) |
| Tipo de montaje | Surface Mount |
| Interfaces | Ethernet, I2C, TDM, UART |
| Packaging | Tray |
| Part Status | Obsolete |
Guía de configuración de pines de MSC8112TVT2400V 431-fcbga (20 x 20 mm)
Configuración de pines para MSC8112TVT2400V (encapsulado 431-fcbga (20 x 20 mm)). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.
No hay datos detallados de patillaje disponibles para MSC8112TVT2400V.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MSC8112TVT2400V es adecuado para 6 aplicacións: Multi-Channel Voice-over-IP Media Gateway, Multi-Channel Modem Line Card, 3G Baseband Preprocessing, Radar / Sonar Beamforming Front-End, Industrial Machine-Vision Preprocessing, Voice / Audio Broadcast Encoder.
Multi-Channel Voice-over-IP Media Gateway
The MSC8112TVT2400V's dual 300 MHz SC140 cores provide 600 MIPS aggregate, enabling concurrent transcoding of dozens of G.711/G.723/G.729 voice channels with headroom for echo cancellation and RTP jitter buffering. The integrated Ethernet MAC plus TDM interface allows direct connection to a backplane TDM bus on one side and a 10/100 Ethernet PHY on the other, eliminating external bridging logic. The 1.10 V core / 3.30 V I/O split pairs cleanly with standard Freescale PHY transceivers without level shifters.
Recomendado
Multi-Channel Modem Line Card
Two SC140 cores per device enable 16-32 channel V.90/V.92 or xDSL modem pools on a single DSP, replacing what previously required four discrete DSPs. The 448 Kbytes of shared M2 SRAM buffers training sequences and constellation data without external memory contention, while the MQBus arbiter guarantees deterministic access for periodic DSP/control tasks. The 431-FCBGA package fits standard AMC/mezzanine line-card footprints used in central-office DSLAM shelves.
Recomendado
3G Baseband Preprocessing
The SC140 architecture's deterministic interrupt latency and dual-core 600 MIPS throughput make the MSC8112TVT2400V well suited to 3G Node-B baseband chip-rate and symbol-rate processing, including scrambling, despreading, and Viterbi decoding for UMTS/WCDMA channels. The 16 Kbyte instruction cache per core keeps inner loop code on-chip, while the 3.30 V I/O ring simplifies the glueless interface to analog RF front-end converters. The -40 C to +105 C junction range supports outdoor remote-radio-head deployments.
Recomendado
Radar / Sonar Beamforming Front-End
The dual-core topology lets one SC140 core manage array-element sampling while the second performs beam-weight calculation, sharing data through the MQBus with sub-microsecond latency. The 448 Kbytes M2 SRAM holds beamforming coefficients for hundreds of antenna elements without external memory traffic, keeping deterministic timing. The FC-BGA package's low thermal resistance supports fanless enclosures in unmanned sonar pod or airborne radar applications where size, weight, and power are tightly constrained.
Recomendado
Industrial Machine-Vision Preprocessing
The 600 MIPS aggregate throughput handles real-time 2D convolution, Sobel edge detection, and morphological operators on multiple VGA-resolution image streams from factory cameras. The Ethernet MAC enables direct attachment to GigE Vision cameras (with external PHY), while the 3.30 V I/O ring simplifies pairing with CMOS image sensors. The 431-FCBGA package's industrial -40 C to +105 C (TJ) range tolerates typical factory-floor ambient temperatures.
Recomendado
Voice / Audio Broadcast Encoder
Two SC140 cores running at 300 MHz provide enough headroom to encode multiple AAC, MP3, or G.722 audio streams simultaneously while leaving cycles for packetization and RTP streaming. The TDM interface accepts uncompressed PCM from a digital mixer or studio router, and the Ethernet MAC streams encoded packets to a CDN edge node. The 448 Kbytes of M2 SRAM holds per-channel look-ahead buffers for psychoacoustic models.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MSC8112TVT2400V — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MSC8112TMP2400V | MSC8112TVT3000V |
|---|---|---|---|
| Package | 431-FCBGA (20x20 mm) | MAP-BGA-431 | 431-FCBGA (20x20 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Dual StarCore SC140 | Dual StarCore SC140 | Dual StarCore SC140 |
| On-Chip RAM | 448 Kbytes | 448 Kbytes | 448 Kbytes |
| Core Voltage | 1.10 V | 1.10 V | 1.10 V |
| I/O Voltage | 3.30 V | 3.30 V | 3.30 V |
| Operating Temperature | -40 C to +105 C (TJ) | -40 C to +105 C (TJ) | -40 C to +105 C (TJ) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Dual-core SC140 topology on a single die (frente a TMS320C6701GJC150)
- Higher on-chip SRAM density (frente a TMS320DM642AGDK7)
- Integrated Ethernet + TDM + I2C + UART peripheral set (frente a Generic DSP without Ethernet)
Notas de diseño
The 431-FCBGA land pattern requires a multi-layer PCB with microvia-in-pad construction for the inner-row balls and a controlled-impedance stackup for the DDR/expansion bus signals. Use at least a 1-oz copper pour on top and inner layers under the package, stitch ground vias on a 1.0 mm grid around the perimeter, and follow the Freescale/NXP AN3185 layout guide for BGA break-out routing.
At 1.10 V core and ~600 MIPS aggregate throughput, the MSC8112TVT2400V can dissipate 3-5 W under heavy loads. Place a continuous copper thermal pad beneath the FC-BGA and stitch thermal vias (0.3 mm drill, 1.2 mm pitch) to the inner ground plane to keep the junction below the 105 C maximum, especially in fanless central-office deployments where ambient reaches 70 C.
Decouple each VDD/VSS pair with a 0.1 uF 0201/0402 X7R ceramic plus a 10 uF bulk X5R placed within 2 mm of the package corner; add a 1 uF X7R near each M2 SRAM supply pin. Hold the core rail ramp time between 1 ms and 10 ms as specified in the datasheet to avoid internal SCR latch-up; an external power-good supervisor on the 1.10 V rail is recommended.
Do not assume the two SC140 cores share a unified cache - each core has its own 16 Kbyte ICache and 224 Kbyte M1 region. Software must explicitly allocate M2 memory through the MQBus arbiter to avoid coherence issues. Also, verify that any third-party toolchain (CodeWarrior, StarCore tools) targets SC140 specifically, since the older SC100/SC110 cores are ISA-incompatible at the assembly level.
Información de cumplimiento
Compliance status not published in the verified web data for this legacy Freescale/NXP DSP; mark as unknown rather than assume RoHS status.
