NXP Semiconductors

NVT4557HKX - SIM Card Level Translator, ESD | NXP

N.º de pieza: NVT4557HKX ✓ Activo
En stock Se envía en 1-3 días hábiles
1.08 V to 1.98 V Vdss XQFN10 Package
Desde $0.38 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-10-19
Precios por volumen
Cant. Precio unitario Total
1 $0.48 $0,48
10 $0.44 $4,40
100 $0.41 $41,00
500 $0.39 $195,00
1.000 $0.38 $380,00
ℹ️ Todos los precios están en USD

NVT4557HKX Descripción general

The NXP Semiconductors NVT4557HKX is a SIM card interface level translator with integrated EMI filtering and ESD protection, housed in a 10-pin XQFN package. It translates data, RSTn, and CLKn signals between a low-voltage host interface of 1.08 V to 1.98 V and a SIM card side operating from 1.62 V to 3.6 V, with 15 ns propagation delay and 10 MHz signaling support.

A level translator (also called a voltage level shifter or voltage translator) is an interface IC that allows digital circuits operating at different supply voltages to communicate reliably. In the power-management and interface hierarchy, the NVT4557 sits between a host microcontroller and a smart card, bridging the voltage gap created by modern low-voltage SoCs that no longer generate the higher SIM card supply rails internally. The device complies with ISO-7816 SIM/smart card interface requirements.

Key features include three dedicated 1.62 V to 3.6 V level translators for data, reset (RSTn), and clock (CLKn) lines, integrated EMI filtering that suppresses radiated and conducted emissions on the SIM lines, and built-in ESD protection that removes the need for external transient-voltage-suppression diodes on the card interface. Because the device provides supply translation without an internal LDO, it simplifies the bill of materials in designs where the card supply is already generated elsewhere.

Technically, the part supports an operating temperature range of -40 C to +85 C, making it suitable for both consumer and industrial embedded designs. The XQFN10 package keeps the footprint minimal for space-constrained mobile, IoT, and M2M hardware. Fast 15 ns transitions support the 10 MHz SIM clocking modes required by modern LTE and 5G modules.

Typical applications include SIM card interfaces in cellular modems, LTE/5G gateways, point-of-sale terminals, telematics units, and IoT devices using eSIM or removable SIM form factors.

When designing with the NVT4557HKX, keep the host supply within the 1.08 V to 1.98 V window and ensure the card-side supply stays within 1.62 V to 3.6 V; place the device close to the SIM connector to maximize the benefit of the integrated EMI filter.

This page synthesizes distributor pricing, lifecycle status, design notes, and selection guidance not found in the manufacturer datasheet alone.

Alternativas directas para NVT4557HKX — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

NVT4557HK

✅ Sustitución directa
📦 XQFN10
same die and function; base orderable part number, shipping/ordering format differs (HKX = reel of 4000)

📋 Alternativa de referencia (no en el catálogo)

NVT4557HKX Especificaciones

Función SIM card interface level translator
Integrated Features EMI filter and ESD protection
Host Side Interface Voltage 1.08 V to 1.98 V
Card Side Translator Voltage 1.62 V to 3.6 V
Number of Level Translators 3 (data, RSTn, CLKn)
Propagation Delay 15 ns
Maximum Data Rate 10 MHz
Interface Standard ISO-7816 SIM/smart card interface
Internal LDO No (supply translation without LDO)
Rango de temperatura de funcionamiento -40 C to +85 C
Encapsulado XQFN10
Tipo de montaje Surface Mount
Packaging Reel, 4000 units (Reel 7 Q1/T1 NDP)
Estado del ciclo de vida Active
Categoría Voltage Level Shifters

Guía de configuración de pines de NVT4557HKX xqfn10

Configuración de pines para NVT4557HKX (encapsulado xqfn10). La numeración de pines, las funciones y los diagramas de conexión se definen en la hoja de datos del fabricante. Consúltela para conocer el footprint exacto y las directrices de soldadura.

Diagrama de patillaje del encapsulado xqfn10 para NVT4557HKX

No hay datos detallados de patillaje disponibles para NVT4557HKX.

Consulte la hoja de datos para ver la configuración completa de patillas.

Aplicaciones típicas

NVT4557HKX es adecuado para 6 aplicacións: LTE/5G Cellular Modem SIM Interface, Point-of-Sale Terminals, IoT and M2M Gateways, Automotive Telematics Units, Smart Meters with Cellular Connectivity, Consumer Mobile and Wearable Devices.

🌐

LTE/5G Cellular Modem SIM Interface

The NVT4557HKX is purpose-built for the SIM card interface of cellular modems, where advanced baseband SoCs run their GPIO banks at 1.08 V to 1.98 V while SIM cards require 1.8 V or 3 V signaling. Its three 1.62 V to 3.6 V translators handle data, RSTn, and CLKn with a 15 ns propagation delay, comfortably supporting the 10 MHz SIM clocking used during high-speed authentication in LTE and 5G networks. The integrated EMI filter helps the design pass conducted and radiated emissions testing near the radio, and the integrated ESD protection covers the user-accessible SIM contacts without external TVS diodes. Placing the device close to the SIM connector minimizes stub lengths and maximizes filter effectiveness.

🧩

Point-of-Sale Terminals

Payment terminals expose SIM or SAM card slots to users, making connector-level ESD robustness a hard requirement. The NVT4557HKX integrates ESD protection with its three level translators, removing discrete TVS parts and shrinking the card-reader BOM in the tight mechanical envelope of handheld POS hardware. Its 1.08 V to 1.98 V host-side range matches the low-voltage IO of modern payment SoCs, while the 1.62 V to 3.6 V card side supports both Class B (3 V) and Class C (1.8 V) cards under ISO-7816. The integrated EMI filter reduces clock harmonics that could otherwise couple into the terminal's radio or magstripe front end, easing EMC qualification of the finished product.

🖥️

IoT and M2M Gateways

Industrial IoT gateways and M2M routers use cellular modules with SIM slots that must survive electrically harsh field environments. The NVT4557HKX operates from -40 C to +85 C ambient, matching the temperature envelope of outdoor and unconditioned enclosures. Its XQFN10 package occupies minimal PCB area next to the SIM holder, and the integrated EMI filter suppresses SIM-line clock emissions that matter in dense multi-radio designs combining LTE, Wi-Fi, and LoRa. Because the part performs supply translation without an internal LDO, designers can reuse an existing 1.8 V or 3 V card rail from the module, reducing solution cost while the translators guarantee correct logic levels on data, RSTn, and CLKn at 10 MHz.

🚗

Automotive Telematics Units

Telematics control units (TCUs) contain an emergency-call SIM whose interface must work reliably across the automotive temperature range and survive connector handling during assembly and service. The NVT4557HKX's -40 C to +85 C operating range covers most in-cabin TCU mounting locations, and its integrated ESD protection adds margin at the SIM contact field. With a 15 ns propagation delay and 10 MHz support, it keeps up with modern eUICC (eSIM) profiles that perform frequent certificate operations over the clock line. The EMI filter helps the TCU pass CISPR-class EMC testing by damping SIM clock harmonics near the cellular antenna path, and the tiny XQFN10 footprint fits the dense multilayer stack typical of automotive modules.

💡

Smart Meters with Cellular Connectivity

Smart electricity and gas meters increasingly embed cellular modems for remote reading, requiring a SIM interface that functions for 15+ years in outdoor meter cabinets. The NVT4557HKX provides the voltage bridging between a low-voltage metering SoC (1.08 V to 1.98 V IO) and the SIM card (1.62 V to 3.6 V) with integrated ESD protection that tolerates field handling during meter installation. Its 10 MHz capability supports fast eSIM profile downloads during provisioning, and the EMI filter prevents SIM clock noise from disturbing the metering front end's sensitive analog measurements. The XQFN10 package and lack of external ESD components save board area inside the meter's tightly spaced enclosure.

📱

Consumer Mobile and Wearable Devices

Smartphones, tablets, and cellular wearables use nano-SIM or eSIM interfaces where board area is at an absolute premium. The NVT4557HKX's XQFN10 package fits beside the SIM connector in the thinnest device stacks, and its integration of EMI filtering plus ESD protection eliminates several discrete components per SIM line, a meaningful saving across millions of units. The 1.08 V to 1.98 V host-side range matches the retained-mode low-voltage IO banks of mobile application processors, while 15 ns delay and 10 MHz operation support the fastest ISO-7816 clock modes. The device's low integration complexity also shortens the SI/EMC debug cycle during handset platform bring-up.

What is the NVT4557HKX and what does it do?
The NVT4557HKX is a SIM card interface level translator from NXP Semiconductors that connects a SIM card to a low-voltage host microcontroller operating from 1.08 V to 1.98 V. It contains three level translators covering 1.62 V to 3.6 V for the data, RSTn, and CLKn signals, and includes an integrated EMI filter and ESD protection. According to the NXP NVT4557 product datasheet, the device is compliant with ISO-7816 SIM/smart card interface requirements and ships in an XQFN10 package.
What is the price of NVT4557HKX?
As of 2026-10-19, the NVT4557HKX is priced from approximately $0.38 USD at 1000-piece quantities, with single-unit pricing around $0.48 USD, based on distributor listings including LCSC, which lists the part family from $0.3809. Octopart currently compares bulk discounts from 6 distributors for this part. For exact volume pricing and stock, check the price tiers on this page or request a quote, since mobile-network-operator demand can cause short-term allocation.
Where to buy NVT4557HKX online?
The NVT4557HKX can be purchased online from authorized distributors including DigiKey (listed as NXP USA Inc. with ships-today stock), Mouser Electronics, and LCSC, with pricing aggregated across 6 distributors on Octopart as of 2026-10-19. XAIPART also supplies the NVT4557HKX with datasheet access and volume price breaks at 1, 10, 100, 500, and 1000 pieces. Always verify stock and lead time at checkout, as SIM-interface translators are frequently consumed by high-volume modem builds.
What is the difference between NVT4557HKX and NVT4557HK?
The NVT4557HK and NVT4557HKX share the same die, XQFN10 package, and functional specification; the suffix difference relates to ordering and shipping format. According to the digchip listing, the HKX ordering code denotes the reel-shipping variant (Reel 7 Q1/T1 NDP, 4000 units per reel, Tamb -40 C to +85 C), while NVT4557HK is the base product orderable part number on the NXP product page. Electrically they are interchangeable; choose the suffix that matches your reel or tray purchasing requirement.
What can replace NVT4557HKX?
The closest replacement is NXP's own NVT4557HK, which is the same device in the same XQFN10 package with identical 1.08 V to 1.98 V host-side and 1.62 V to 3.6 V card-side translation ranges, ISO-7816 compliance, EMI filtering, and ESD protection. In the verified web data reviewed for this page, no cross-brand pin-compatible drop-in equivalent in XQFN10 was published by a competitor, so for qualified designs we recommend staying within the NXP NVT4557 family or performing a footprint review before considering other SIM-interface translators.
Is NVT4557HKX suitable for LTE and 5G modem SIM interfaces?
Yes. The NVT4557HKX supports SIM clock rates up to 10 MHz with a 15 ns propagation delay, which covers the clock speeds used by modern LTE and 5G cellular modules for high-speed SIM authentication and data sessions. Its 1.08 V to 1.98 V host-side interface matches the low-voltage GPIO banks of contemporary baseband SoCs, while the 1.62 V to 3.6 V card side supports Class B (3 V) and Class C (1.8 V) SIM cards per ISO-7816. Integrated ESD protection is important at the user-accessible SIM connector.
Does the NVT4557HKX need external ESD protection on the SIM lines?
No external ESD protection diodes are required on the data, RSTn, and CLKn lines, because the NVT4557HKX integrates ESD protection together with an EMI filter, according to the NXP NVT4557 datasheet title: 'SIM card interface level translator with EMI filter and ESD protection.' This integration saves board space and bill-of-materials cost near the SIM connector. For the card supply pin and any externally accessible contacts, always review your system-level ESD target (for example IEC 61000-4-2 contact discharge) to confirm the integrated protection meets the requirement.
What is the operating temperature range of NVT4557HKX?
The NVT4557HKX operates from -40 C to +85 C ambient, as stated in the ordering information for the NVT4557HK XQFN10 reel variant (Reel 7 Q1/T1 NDP, Tamb = -40 C to +85 C) sourced from the digchip datasheet summary. This industrial-width range supports automotive-adjacent telematics, outdoor gateways, and industrial IoT hardware, in addition to the consumer mobile applications the part was originally designed for. Derate power only if you bundle it with high-dissipation components in the same thermal zone.
Where to download the NVT4557HKX datasheet PDF?
The official NVT4557HKX datasheet PDF is available directly from NXP Semiconductors at https://www.nxp.com/docs/en/data-sheet/NVT4557.pdf, which is the product specification document for the NVT4557 SIM card interface level translator with EMI filter and ESD protection. The same document is mirrored on aggregator sites such as Alldatasheet and Octopart, but NXP's own site always carries the latest revision. The NXP product page at nxp.com/part/NVT4557HK also links the data sheet, environmental documents, and product change notices.
Where can I find the NVT4557HKX pinout?
The NVT4557HKX pinout is documented in the official NXP NVT4557 datasheet PDF (Pinning section) available at nxp.com/docs/en/data-sheet/NVT4557.pdf. The 10-pin XQFN package assigns pins for the host-side supply, card-side supply, ground, and the three translated signal pairs for data, RSTn, and CLKn. Because XQFN packages have very fine pitch and a center pad, always verify pin 1 location and the thermal/electrical pad connection against the datasheet pinning diagram before finalizing your footprint in your PCB CAD tool.
Is the NVT4557HKX in stock and what is the lead time?
Stock status varies by distributor: as of 2026-10-19, DigiKey lists the NVT4557HKX as buyable with ships-today availability, and LCSC shows in-stock quantity for the related -TP ordering code, while Octopart aggregates 6 distributors total. Standard lead time when distributors are out of stock is typically quoted through NXP's distribution network and can extend to several weeks for reel quantities. XAIPART recommends confirming real-time stock on this page or requesting a quote for 1000+ piece volumes to lock allocation.
NVT4557HKX vs a discrete resistor-divider level shifter - which is better for SIM interfaces?
The NVT4557HKX is clearly better for SIM interfaces. Discrete resistor dividers cannot provide bidirectional translation for the SIM data line, add propagation delay variance, and offer no ESD or EMI performance. The NVT4557HKX provides three purpose-built translators with 15 ns delay for data, RSTn, and CLKn, integrated EMI filtering that reduces radiated emissions on the SIM lines, integrated ESD protection at the connector, and ISO-7816 compliance. It also handles the card supply switching sequencing that passive networks cannot manage, all in one 10-pin XQFN package.
When should I choose the NVT4557 over other SIM card interface ICs?
Choose the NVT4557 when your host SoC operates its GPIO bank at 1.08 V to 1.98 V (typical of advanced 7 nm-class baseband chips) and the card supply rail already exists elsewhere in the system, since this part performs supply translation without an internal LDO. If your design instead needs an integrated LDO to generate the SIM supply from a higher rail, evaluate NXP's SIM interface parts with built-in LDOs, as the NVT4557 will require an external supply solution. Also choose it when board space, EMI compliance, and connector ESD robustness drive the BOM toward a single integrated XQFN10 device.
What are the key specifications of NVT4557HKX engineers should know?
The NVT4557HKX in one dense factual summary: SIM card interface level translator with EMI filter and ESD protection from NXP Semiconductors; three 1.62 V to 3.6 V level translators for data, RSTn, and CLKn; host-side interface of 1.08 V to 1.98 V; 15 ns propagation delay; 10 MHz operation; ISO-7816 compliant; no internal LDO (supply translation only); XQFN10 surface-mount package; operating temperature -40 C to +85 C; supplied on reels of 4000 units (Reel 7 Q1/T1 NDP); lifecycle status active per NXP.
What is the best NXP alternative within the NVT4557 family?
The best same-family alternative is the NVT4557HK, the base orderable part number of the NVT4557 device sold under the same product page at nxp.com/part/NVT4557HK. It is functionally identical to the NVT4557HKX: same XQFN10 package, same 1.08 V to 1.98 V host interface, same 1.62 V to 3.6 V translators, same ISO-7816 compliance and EMI/ESD integration. The difference is the shipping format (reel of 4000 for the HKX ordering code). Both are active; selection is purely a procurement decision based on reel versus tray quantities.

Datos de referencia de ingeniería para NVT4557HKX — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the NVT4557HKX when your host SoC or baseband runs its GPIO bank at 1.08 V to 1.98 V and an external 1.8 V or 3 V SIM supply already exists in your power tree - the LDO-free architecture keeps the BOM minimal and avoids duplicating a supply rail. Its integrated EMI filter and ESD protection make it the pragmatic single-chip choice for SIM interfaces in modems, POS terminals, telematics, and smart meters, especially where board area near the connector is scarce. If you need the SIM card supply generated on-chip from a higher system rail, evaluate NXP SIM interface parts with an integrated LDO instead. Within the NVT4557 family itself, NVT4557HK and NVT4557HKX are electrically identical, differing only in ordering/shipping format - pick based on reel quantity needs. No cross-brand XQFN10 drop-in equivalent surfaced in the verified cross-reference data, so redesigns should stay within the NVT4557 family or budget a footprint review.

Comparación con alternativas

Parámetro Este producto NVT4557HK
Package XQFN10 XQFN10 - same
Brand NXP Semiconductors NXP Semiconductors
Host Side Voltage 1.08 V to 1.98 V 1.08 V to 1.98 V
Card Side Voltage 1.62 V to 3.6 V 1.62 V to 3.6 V
Translators 3 (data, RSTn, CLKn) 3 (data, RSTn, CLKn)
Propagation Delay 15 ns 15 ns
EMI Filter / ESD Integrated Integrated
Internal LDO No No
Operating Temperature -40 C to +85 C -40 C to +85 C

Diferenciadores clave

  • Integrated EMI filter on SIM lines (frente a NVT4557HK (family baseline; discrete-level-shifter designs))
  • Integrated ESD protection at the card interface (frente a Discrete TVS + generic translator solution)
  • LDO-free architecture (frente a SIM interface ICs with integrated LDO)

Notas de diseño

Place the NVT4557HKX as close as possible to the SIM card connector so the integrated EMI filter sits directly in the line path. Keep the data, RSTn, and CLKn traces short and matched in length where possible; the 10 MHz SIM clock has harmonics that can radiate if traces become antennas. For the XQFN10 land pattern, follow the NXP datasheet footprint recommendation including the center pad, and verify pin 1 orientation against the datasheet pinning diagram before release.

The NVT4557 performs level translation without an internal LDO, so the card-side supply (1.62 V to 3.6 V) and the host-side supply (1.08 V to 1.98 V) must both be generated elsewhere in the system. Verify supply sequencing at power-up: if the host IO bank is live while the card rail is still ramping, confirm the translator's behavior matches your sequencing assumptions per the NVT4557 datasheet power-up section. Add local 100 nF decoupling on both supply pins.

Do not assume this part generates the SIM supply like some competing SIM interface ICs with integrated LDOs - the NVT4557HKX explicitly translates supply without an LDO, per the Mouser product description. Designers migrating from LDO-integrated translators must add an external card-supply solution. Also confirm that the 15 ns propagation delay fits the ISO-7816 clock timing budget at 10 MHz in your specific module; typical modules accept it, but custom eUICC schemes should be checked.

Información de cumplimiento

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Unknown
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

Compliance details (RoHS/REACH/lead-free/halogen-free) were not present in the provided verified web data; NXP product page lists Environmental Quality documents for NVT4557HK - consult nxp.com/part/NVT4557HK for official environmental compliance statements.

Datos verificados el: 2026-10-19 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

Búsquedas relacionadas

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Componentes & términos relacionados

NXP Semiconductors NVT4557HKX NVT4557HK level translator voltage level shifter SIM card interface IC ISO-7816 EMI filter ESD protection XQFN10 QFN family surface mount RoHS LTE/5G modem eSIM / eUICC point-of-sale terminal telematics control unit propagation delay smart metering IoT gateway voltage regulator power management IC
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